JP6286726B2 - ボンディング装置およびボンディング方法 - Google Patents
ボンディング装置およびボンディング方法 Download PDFInfo
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/83132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
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Description
Claims (8)
- チップを基板上にボンディングするボンディング装置であって、
ボンディング作業面に向かって配置された第一カメラと、前記第一カメラとオフセットを有して配置されるボンディングツールと、を一体的に保持しつつ移動するボンディングヘッドと、
前記ボンディングツールに保持されたチップのボンディングツールに対する位置を検出するべく、前記ボンディングツール側に向かって設けられた第二カメラと、
前記第一カメラ及び前記第二カメラで認識可能に配置されたリファレンスマークを有し、前記第二カメラに対して位置が固定されたリファレンス部材と、
前記ボンディングヘッドの移動を制御する制御部と、
を備え、前記制御部は、
前記第一カメラで認識されたリファレンスマークの位置に基づいて、前記ボンディングヘッドを移動させたあと、前記第二カメラで認識されたリファレンスマークに対する前記ボンディングツールの位置に基づいて、前記オフセットの値を算出する、
ことを特徴とするボンディング装置。 - 請求項1に記載のボンディング装置であって、
前記制御部は、前記オフセットの値の誤差量を算出するものであって、算出した前記誤差量に基づいて前記オフセットの値を補正して次のボンディング処理を行う、
ことを特徴とするボンディング装置。 - 請求項1または2に記載のボンディング装置であって、
前記第一カメラまたは第二カメラは、前記ボンディングヘッドの移動に伴って撮像対象物がカメラの視野内を通過する撮像タイミングで、当該カメラに対応するストロボを発光させることで、前記ボンディングヘッドを停止させることなく前記撮像対象物を撮像し、
前記制御部は、前記ボンディングヘッドを停止させることなく得られた撮像画像に基づいて、前記オフセットの値を算出する、
ことを特徴とするボンディング装置。 - 請求項1から3のいずれか1項に記載のボンディング装置であって、
前記制御部は、前記リファレンスマークに対する前記ボンディングツールの位置を検出するための第二カメラにより撮像された画像に基づいて、前記チップのボンディングツールに対する位置を検出する、ことを特徴とするボンディング装置。 - 請求項4に記載のボンディング装置であって、
前記第二カメラは、赤外線を撮像する赤外線カメラであることを特徴とするボンディング装置。 - 請求項1から5のいずれか1項に記載のボンディング装置であって、
前記リファレンスマークは、前記第二カメラの被写界深度の端部に配置される、ことを特徴とするボンディング装置。 - 請求項1から5のいずれか1項に記載のボンディング装置であって、
前記第二カメラは、視野内の焦点位置を部分的に異ならせる機構を備える、ことを特徴とするボンディング装置。 - ボンディング作業面に向かって配置された第一カメラおよび前記第一カメラとオフセットを有して配置されるボンディングツールを一体的に保持しつつ移動するボンディングヘッドと、前記ボンディングツールに保持されたチップのボンディングツールに対する位置を検出するべく前記ボンディングツール側に向かって設けられた第二カメラと、前記第一カメラ及び前記第二カメラで認識可能に配置されたリファレンスマークを有し、前記第二カメラに対して位置が固定されたリファレンス部材と、を備えたボンディング装置によるボンディング方法であって、
前記第一カメラで、前記第二カメラの視野内に設置された前記リファレンスマークの位置を認識するステップと、
前記認識されたリファレンスマークの位置に基づいて前記ボンディングヘッドを移動させた後、前記第二カメラで、前記リファレンスマークに対するボンディングツールの位置を認識するステップと、
前記認識されたリファレンスマークに対するボンディングツールの位置に基づいて、前記オフセットの値を算出するステップと、
を備えることを特徴とするボンディング方法。
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JP2014096338 | 2014-05-07 | ||
JP2014096338 | 2014-05-07 | ||
PCT/JP2015/062813 WO2015170645A1 (ja) | 2014-05-07 | 2015-04-28 | ボンディング装置およびボンディング方法 |
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JPWO2015170645A1 JPWO2015170645A1 (ja) | 2017-04-20 |
JP6286726B2 true JP6286726B2 (ja) | 2018-03-07 |
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US (1) | US20170148759A1 (ja) |
JP (1) | JP6286726B2 (ja) |
KR (1) | KR101897088B1 (ja) |
CN (1) | CN106663636B (ja) |
SG (1) | SG11201609249XA (ja) |
TW (1) | TWI545663B (ja) |
WO (1) | WO2015170645A1 (ja) |
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JP2022071993A (ja) * | 2020-10-29 | 2022-05-17 | アスリートFa株式会社 | 電子部品接合装置 |
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CN112945092B (zh) * | 2021-01-27 | 2023-03-28 | 深圳市卓兴半导体科技有限公司 | 一种多工位设备的模板定位方法及系统 |
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JPS5838009B2 (ja) | 1976-10-04 | 1983-08-19 | 株式会社日立製作所 | 入出力絶縁型信号伝送回路 |
JP2780000B2 (ja) * | 1993-06-16 | 1998-07-23 | 澁谷工業株式会社 | 半導体位置合せ装置 |
US6417922B1 (en) * | 1997-12-29 | 2002-07-09 | Asml Netherlands B.V. | Alignment device and lithographic apparatus comprising such a device |
JP2982000B1 (ja) | 1998-07-03 | 1999-11-22 | 株式会社新川 | ボンディング方法及びその装置 |
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JP4128540B2 (ja) | 2003-06-05 | 2008-07-30 | 株式会社新川 | ボンディング装置 |
US20070110917A1 (en) * | 2003-12-02 | 2007-05-17 | Bondtech, Inc | Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit |
US7784670B2 (en) * | 2004-01-22 | 2010-08-31 | Bondtech Inc. | Joining method and device produced by this method and joining unit |
JP2006210785A (ja) * | 2005-01-31 | 2006-08-10 | Matsushita Electric Ind Co Ltd | 半導体位置合わせ装置および位置合わせ方法 |
WO2009025016A1 (ja) * | 2007-08-17 | 2009-02-26 | Fujitsu Limited | 部品実装装置及び方法 |
JP5344145B2 (ja) * | 2008-12-25 | 2013-11-20 | 澁谷工業株式会社 | ボンディング装置における電子部品と基板の位置合わせ方法 |
KR101575279B1 (ko) * | 2009-03-19 | 2015-12-10 | 한화테크윈 주식회사 | 부품실장기의 레이저 변위센서가 구비된 헤드 어셈블리 및 그 좌표 교정방법 |
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CN106663636B (zh) | 2019-05-14 |
KR101897088B1 (ko) | 2018-09-10 |
WO2015170645A1 (ja) | 2015-11-12 |
KR20160147045A (ko) | 2016-12-21 |
SG11201609249XA (en) | 2016-12-29 |
TW201606881A (zh) | 2016-02-16 |
TWI545663B (zh) | 2016-08-11 |
JPWO2015170645A1 (ja) | 2017-04-20 |
US20170148759A1 (en) | 2017-05-25 |
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