JP7112341B2 - 実装装置および実装方法 - Google Patents
実装装置および実装方法 Download PDFInfo
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Description
位置合わせ用のチップ認識マークを有するチップ部品と、位置合わせ用の基板認識マークを有する基板とを、前記チップ認識マークと前記基板認識マークが同一方向を向く状態で実装する実装装置であって、
前記基板を保持する基板ステージと、
前記チップ部品を保持する実装ヘッドと、
前記基板に対して垂直方向に前記実装ヘッドを昇降させる昇降手段と、
前記実装ヘッドの上側で、前記実装ヘッドの動作と独立して移動して、前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識する認識機構と、
前記認識機構と接続し、前記認識機構から得た、前記チップ認識マークおよび前記基板認識マークの位置情報から、前記チップ部品と前記基板の位置ズレ量を計算する機能と、前記位置ズレ量に応じて前記実装ヘッド部と前記基板ステージの少なくとも一方を駆動して位置合わせを行う機能を有する制御部とを備え、
前記認識機構は、前記チップ認識マークを認識するチップ認識撮像手段と前記基板認識マークを認識する基板認識撮像手段とが、独立して設けられ、共通の光軸経路を経て焦点位置が異なる様に設けられた実装装置を提供する。
前記認識機構の光軸中心が、前記チップ認識マークと前記基板認識マークの中点近傍位置で前記チップ認識マークと前記基板認識マークとを同時に認識する機能を有する実装装置を提供する。
請求項1または請求項2に記載の実装装置であって、
前記チップ部品を接着剤を介して固定するもので、
前記実装ヘッドは、保持した前記チップ部品を前記基板に密着させて加圧するもので、
前記位置合わせ実施後、前記チップ部品を保持した前記実装ヘッドを前記基板に対して垂直方向に下降させ、前記チップ部品が前記基板に密着してから、
前記制御部が、前記実装ヘッドが前記チップ部品を加圧するのと並行して、前記認識機構に前記チップ認識マークおよび前記基板認識マークの認識動作を開始させ、前記チップ部品が前記基板に密着した実装状態における前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識し、前記チップ部品と前記基板の実装位置精度を算出する機能を有する実装装置を提供する。
請求項3に記載の実装装置であって、
前記チップ部品が前記基板に密着してから、並行して開始される実装位置精度を算出するための、前記チップ認識マークと前記基板認識マークの認識動作において、
前記チップ認識撮像手段か前記基板認識撮像手段の何れか一方を用いて、前記チップ認識マークと前記基板認識マークとを同時に認識する機能を有する実装装置を提供する。
算出した実装位置精度の結果を、実装位置にフィードバックし、自動で実装位置を校正調整する機能を有する実装装置を提供する。
前記チップ部品を前記基板と隙間を設けて配置した状態で、前記チップ認識マークと前記基板認識マークを同一方向から、チップ認識マークを認識するチップ認識撮像手段と前記基板認識マークを認識する基板認識撮像手段が共通の光軸経路を有し焦点位置が異なる様に独立して設けられた認識機構を用い、前記認識機構を移動させて、前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識して、前記チップ部品と前記基板の相対位置関係を合わせる位置合わせ工程と、
前記チップ部品を前記基板に密着させ加圧して実装する実装工程と、前記チップ部品が前記基板に密着した実装状態にあるときに、前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識して、前記チップ部品と前記基板の相対位置関係を算出する実装精度測定検査工程とを備え、
前記チップ部品が前記基板に密着してから、前記実装工程と前記実装精度測定検査工程を並行して行う実装方法を提供する。
前記実装精度測定検査工程において、前記チップ認識撮像手段か前記基板認識撮像手段の何れか一方を用いて、前記チップ認識マークと前記基板認識マークとを同時に認識する実装方法を提供する。
前記実装精度測定検査工程で算出した実装位置精度の結果を、実装位置にフィードバックし、自動で実装位置を校正調整する実装方法を提供する。
また、位置合わせ時に高低差がある基板認識マークとチップ認識マークの各々に焦点を合わせるため、式(2)が成立する位置関係としている。すなわち、撮像手段53aの焦点位置と撮像手段53bの焦点位置の差を「チップ部品Cの厚みTC+隙間D」とすることで、同時に高低差がある基板認識マークとチップ認識マークの各々に焦点を合わせることが可能となる。
ここで、チップ部品Cの厚みTCは実装装置1で定められた仕様範囲内で変動するため、以下の式(3)が成立するような設計とすることで、最も厚みの大きいチップ部品の時であっても、基板Sとの間に最低限の隙間を確保することが可能となる。
・・(3)
また、基板Sの厚みTSにおいても、実装装置1で定められた仕様範囲内で変動するため、認識機構5を基板Sの厚みTSに応じて、基板認識マークに焦点が合う様に垂直方向(Z方向)に位置制御し、かつ実装ヘッド4の垂直方向(Z方向)位置を前記式(2)が成立する様に位置制御することで、基板Sの厚み仕様全範囲内での位置合わせが可能となる。
2 基板ステージ
3 昇降加圧ユニット
4 実装ヘッド
5 認識機構
10 制御部
40 ヘッド本体
41V ヘッド空間
41 ヒーター部
41H 貫通孔
42 アタッチメントツール
50 画像取込部
51 光学系(共通部)
52a、52b 光学系(分岐部)
53a、53b 撮像手段
500、520 反射手段
511 ハーフミラー
C チップ部品
S 基板
AC1、AC2 チップ認識マーク
AS1、AS2 基板認識マーク
D 位置合わせ時の、チップ部品と基板の隙間
TC チップ部品の厚み
TS 基板の厚み
SC 基板の凹部
CC1 チップ部品の角部1
CC2 チップ部品の角部2
ΔX1 チップ部品の認識マーク1とチップ部品の角部1のX方向距離
ΔX2 チップ部品の認識マーク2とチップ部品の角部2のX方向距離
ΔY1 チップ部品の認識マーク1とチップ部品の角部1のY方向距離
ΔY2 チップ部品の認識マーク2とチップ部品の角部2のY方向距離
LS 画像取込部から基板認識マークまでの距離
LC 画像取込部からチップ認識マークまでの距離
L1 反射手段からハーフミラーまでの距離
L2a ハーフミラーから撮像手段53aの素子面までの距離
L2b ハーフミラーから撮像手段53bの素子面までの距離
Claims (8)
- 位置合わせ用のチップ認識マークを有するチップ部品と、位置合わせ用の基板認識マークを有する基板とを、前記チップ認識マークと前記基板認識マークが同一方向を向く状態で実装する実装装置であって、
前記基板を保持する基板ステージと、
前記チップ部品を保持する実装ヘッドと、
前記基板に対して垂直方向に前記実装ヘッドを昇降させる昇降手段と、
前記実装ヘッドの上側で、前記実装ヘッドの動作と独立して移動して、前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識する認識機構と、
前記認識機構と接続し、前記認識機構から得た、前記チップ認識マークおよび前記基板認識マークの位置情報から、前記チップ部品と前記基板の位置ズレ量を計算する機能と、前記位置ズレ量に応じて前記実装ヘッド部と前記基板ステージの少なくとも一方を駆動して位置合わせを行う機能を有する制御部とを備え、
前記認識機構は、前記チップ認識マークを認識するチップ認識撮像手段と前記基板認識マークを認識する基板認識撮像手段とが、独立して設けられ、共通の光軸経路を経て焦点位置が異なる様に設けられた実装装置。 - 請求項1に記載の実装装置であって、
前記認識機構の光軸中心が、前記チップ認識マークと前記基板認識マークの中点近傍位置で前記チップ認識マークと前記基板認識マークを同時に認識する機能を有する実装装置。 - 請求項1または請求項2に記載の実装装置であって、
前記チップ部品を接着剤を介して固定するもので、
前記実装ヘッドは、保持した前記チップ部品を前記基板に密着させて加圧するもので、
前記位置合わせ実施後、前記チップ部品を保持した前記実装ヘッドを前記基板に対して垂直方向に下降させ、前記チップ部品が前記基板に密着してから、
前記制御部が、前記実装ヘッドが前記チップ部品を加圧するのと並行して、前記認識機構に前記チップ認識マークおよび前記基板認識マークの認識動作を開始させ、前記チップ部品が前記基板に密着した実装状態における前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識し、前記チップ部品と前記基板の実装位置精度を算出する機能を有する実装装置。 - 請求項3に記載の実装装置であって、
前記チップ部品が前記基板に密着してから、並行して開始される実装位置精度を算出するための、前記チップ認識マークと前記基板認識マークの認識動作において、
前記チップ認識撮像手段か前記基板認識撮像手段の何れか一方を用いて、前記チップ認識マークと前記基板認識マークとを同時に認識する機能を有する実装装置。 - 請求項3または請求項4に記載の実装装置であって、
算出した実装位置精度の結果を、実装位置にフィードバックし、自動で実装位置を校正調整する機能を有する実装装置。 - 位置合わせ用のチップ認識マークを有するチップ部品を、位置合わせ用の基板認識マークを有する基板に、前記チップ認識マークと前記基板認識マークが同一方向を向く状態で接着剤を介し固定して実装する実装方法であって、
前記チップ部品を前記基板と隙間を設けて配置した状態で、前記チップ認識マークと前記基板認識マークを同一方向から、チップ認識マークを認識するチップ認識撮像手段と前記基板認識マークを認識する基板認識撮像手段が共通の光軸経路を有し焦点位置が異なる様に独立して設けられた認識機構を用い、前記認識機構を移動させて、前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識して、前記チップ部品と前記基板の相対位置関係を合わせる位置合わせ工程と、
前記チップ部品を前記基板に密着させ加圧して実装する実装工程と、前記チップ部品が前記基板に密着した実装状態にあるときに、前記チップ認識マークと前記基板認識マークの組み合わせを複数箇所で認識して、前記チップ部品と前記基板の相対位置関係を算出する実装精度測定検査工程とを備え、
前記チップ部品が前記基板に密着してから、前記実装工程と前記実装精度測定検査工程を並行して行う実装方法。 - 請求項6に記載の実装方法であって、
前記実装精度測定検査工程において、前記チップ認識撮像手段か前記基板認識撮像手段の何れか一方を用いて、前記チップ認識マークと前記基板認識マークとを同時に認識する実装方法。 - 請求項6または請求項7に記載の実装方法であって、
前記実装精度測定検査工程で算出した実装位置精度の結果を、実装位置にフィードバックし、自動で実装位置を校正調整する実装方法。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000276233A (ja) | 1999-03-24 | 2000-10-06 | Moritex Corp | 位置ずれ検出装置及びそれを用いた位置決め装置 |
JP2008306039A (ja) | 2007-06-08 | 2008-12-18 | Shinkawa Ltd | ボンディング装置用撮像装置及び撮像方法 |
JP2017208522A (ja) | 2016-05-11 | 2017-11-24 | パナソニックIpマネジメント株式会社 | 部品実装装置 |
JP2018056481A (ja) | 2016-09-30 | 2018-04-05 | ボンドテック株式会社 | アライメント装置およびアライメント方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4167790B2 (ja) * | 2000-03-10 | 2008-10-22 | 東レエンジニアリング株式会社 | チップ実装装置 |
JPWO2003041478A1 (ja) | 2001-11-05 | 2005-03-03 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
JP4322092B2 (ja) * | 2002-11-13 | 2009-08-26 | 富士機械製造株式会社 | 電子部品実装装置における校正方法および装置 |
JP4065805B2 (ja) * | 2003-04-10 | 2008-03-26 | 富士機械製造株式会社 | 撮像装置 |
TW200628029A (en) * | 2004-12-06 | 2006-08-01 | Matsushita Electric Ind Co Ltd | Component mounting apparatus and component mounting method |
JP4840862B2 (ja) * | 2006-08-29 | 2011-12-21 | 東レエンジニアリング株式会社 | 実装装置のチップ供給方法、及びその実装装置 |
JP5385794B2 (ja) * | 2008-01-30 | 2014-01-08 | 東レエンジニアリング株式会社 | チップ搭載方法およびチップ搭載装置 |
JP2014045011A (ja) * | 2012-08-24 | 2014-03-13 | Bondtech Inc | 基板支持システム |
EP2978296B1 (en) * | 2013-03-18 | 2019-08-21 | FUJI Corporation | Component mounting device and method of calibration in component mounting device |
JP6390978B2 (ja) * | 2016-02-05 | 2018-09-19 | パナソニックIpマネジメント株式会社 | 半導体装置の製造装置 |
WO2018146880A1 (ja) * | 2017-02-09 | 2018-08-16 | ボンドテック株式会社 | 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000276233A (ja) | 1999-03-24 | 2000-10-06 | Moritex Corp | 位置ずれ検出装置及びそれを用いた位置決め装置 |
JP2008306039A (ja) | 2007-06-08 | 2008-12-18 | Shinkawa Ltd | ボンディング装置用撮像装置及び撮像方法 |
JP2017208522A (ja) | 2016-05-11 | 2017-11-24 | パナソニックIpマネジメント株式会社 | 部品実装装置 |
JP2018056481A (ja) | 2016-09-30 | 2018-04-05 | ボンドテック株式会社 | アライメント装置およびアライメント方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7372457B2 (ja) | 2020-04-24 | 2023-10-31 | Dmg森精機株式会社 | 加工機械 |
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