SG11201609249XA - Bonding apparatus and bonding method - Google Patents

Bonding apparatus and bonding method

Info

Publication number
SG11201609249XA
SG11201609249XA SG11201609249XA SG11201609249XA SG11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA SG 11201609249X A SG11201609249X A SG 11201609249XA
Authority
SG
Singapore
Prior art keywords
bonding
bonding method
bonding apparatus
Prior art date
Application number
SG11201609249XA
Inventor
Shigeru Hayata
Rei Ando
Yasushi Sato
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201609249XA publication Critical patent/SG11201609249XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8113—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/81132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8313—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/83132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Microscoopes, Condenser (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG11201609249XA 2014-05-07 2015-04-28 Bonding apparatus and bonding method SG11201609249XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014096338 2014-05-07
PCT/JP2015/062813 WO2015170645A1 (en) 2014-05-07 2015-04-28 Bonding apparatus and bonding method

Publications (1)

Publication Number Publication Date
SG11201609249XA true SG11201609249XA (en) 2016-12-29

Family

ID=54392497

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201609249XA SG11201609249XA (en) 2014-05-07 2015-04-28 Bonding apparatus and bonding method

Country Status (7)

Country Link
US (1) US20170148759A1 (en)
JP (1) JP6286726B2 (en)
KR (1) KR101897088B1 (en)
CN (1) CN106663636B (en)
SG (1) SG11201609249XA (en)
TW (1) TWI545663B (en)
WO (1) WO2015170645A1 (en)

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TWI580511B (en) * 2014-06-10 2017-05-01 Shinkawa Kk A bonding device, and a method of estimating the placement position of the engagement tool
CN108352308B (en) 2016-01-28 2022-05-10 雅马哈发动机株式会社 Wafer picking device
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
CN108986167B (en) * 2017-06-05 2022-01-11 梭特科技股份有限公司 Correction method of crystal setting equipment and crystal setting equipment using same
TWI684235B (en) * 2017-07-12 2020-02-01 日商新川股份有限公司 Device and method for positioning a first object relative to a second object
JP7072264B2 (en) * 2017-08-28 2022-05-20 株式会社新川 Devices and methods for linearly moving a moving object with respect to an object
JP7033878B2 (en) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment
TWI697656B (en) * 2017-12-20 2020-07-01 日商新川股份有限公司 Line shape inspection device and line shape inspection method
TWI716925B (en) * 2018-07-06 2021-01-21 日商新川股份有限公司 Pickup system for semiconductor die
KR102134069B1 (en) * 2018-07-17 2020-07-14 주식회사 에프에스티 Wafer alignment apparatus, wafer alignment method, and correction method of wafer alignment apparatus
JP6968762B2 (en) * 2018-07-23 2021-11-17 Ｔｏｗａ株式会社 Transport mechanism, electronic component manufacturing equipment, transport method and electronic component manufacturing method
JP6644115B2 (en) * 2018-07-23 2020-02-12 アスリートＦａ株式会社 Mounting device and mounting method
JP7022340B2 (en) * 2018-08-01 2022-02-18 日本電気硝子株式会社 Camera calibration method, calibration device and calibration target
TWI744849B (en) * 2019-04-15 2021-11-01 日商新川股份有限公司 Bonding device and method for correcting movement amount of bonding head
CN110246771B (en) * 2019-06-18 2021-06-15 武汉新芯集成电路制造有限公司 Wafer bonding equipment and method
KR102545300B1 (en) 2019-06-24 2023-06-16 삼성전자주식회사 Collet apparatus and method for fabricating semiconductor device using the same
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
CN112447555B (en) * 2019-08-29 2024-05-14 芝浦机械电子装置株式会社 Electronic component mounting apparatus
JP7291586B2 (en) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 Die bonding apparatus and semiconductor device manufacturing method
US11776930B2 (en) * 2019-12-16 2023-10-03 Asmpt Singapore Pte. Ltd. Die bond head apparatus with die holder motion table
TWI775198B (en) * 2019-12-17 2022-08-21 日商新川股份有限公司 Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor device
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
CN111370353B (en) * 2020-03-26 2023-05-05 长江存储科技有限责任公司 Wafer bonding equipment and method for detecting operation state of wafer bonding equipment
JP2022052009A (en) * 2020-09-23 2022-04-04 ファスフォードテクノロジ株式会社 Die bonding device and method of manufacturing semiconductor device
JP2022071993A (en) * 2020-10-29 2022-05-17 アスリートＦａ株式会社 Electronic component bonding apparatus
CN112945092B (en) * 2021-01-27 2023-03-28 深圳市卓兴半导体科技有限公司 Template positioning method and system of multi-station equipment
JP2022124134A (en) * 2021-02-15 2022-08-25 株式会社ディスコ Processing method for workpiece
KR102580842B1 (en) * 2022-10-31 2023-09-20 제너셈(주) Method for determining movement amount of press

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JPS5838009B2 (en) 1976-10-04 1983-08-19 株式会社日立製作所 Input/output isolated signal transmission circuit
JP2780000B2 (en) * 1993-06-16 1998-07-23 澁谷工業株式会社 Semiconductor alignment equipment
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JP4046030B2 (en) * 2002-08-30 2008-02-13 株式会社村田製作所 Component mounting method and component mounting apparatus
JP4105926B2 (en) 2002-09-30 2008-06-25 株式会社新川 Offset measuring mechanism in bonding apparatus and offset measuring method in bonding apparatus
JP4128540B2 (en) 2003-06-05 2008-07-30 株式会社新川 Bonding equipment
WO2005055293A1 (en) * 2003-12-02 2005-06-16 Bondtech Inc. Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit
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JP5344145B2 (en) * 2008-12-25 2013-11-20 澁谷工業株式会社 Method for aligning electronic component and substrate in bonding apparatus
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Also Published As

Publication number Publication date
KR20160147045A (en) 2016-12-21
TWI545663B (en) 2016-08-11
CN106663636A (en) 2017-05-10
CN106663636B (en) 2019-05-14
JP6286726B2 (en) 2018-03-07
US20170148759A1 (en) 2017-05-25
JPWO2015170645A1 (en) 2017-04-20
TW201606881A (en) 2016-02-16
KR101897088B1 (en) 2018-09-10
WO2015170645A1 (en) 2015-11-12

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