CN110246771B - Wafer bonding equipment and method - Google Patents
Wafer bonding equipment and method Download PDFInfo
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- CN110246771B CN110246771B CN201910528673.7A CN201910528673A CN110246771B CN 110246771 B CN110246771 B CN 110246771B CN 201910528673 A CN201910528673 A CN 201910528673A CN 110246771 B CN110246771 B CN 110246771B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/76—Apparatus for connecting with build-up interconnects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/76001—Calibration means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/767—Means for aligning
- H01L2224/76753—Means for optical alignment, e.g. sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
- H01L2224/8212—Aligning
- H01L2224/82121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8213—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer bonding device, which comprises: the first fixing device only can move along the X-axis direction and the Y-axis direction and is used for fixing a first wafer to be bonded, and a first calibration mark is arranged on the first wafer; the reference mark is arranged on the first fixing device; the second fixing device can move along the X-axis direction, the Y-axis direction and the Z-axis direction and is arranged opposite to the first fixing device; the rotating device is arranged on one surface, facing the first fixing device, of the second fixing device and used for fixing a second wafer to be bonded, and a second calibration mark is arranged on the second wafer; the image acquisition devices which are oppositely arranged and can synchronously move along the X axis, the Y axis and the Z axis are respectively used for acquiring a first calibration mark and a second calibration mark; and the reference mark acquisition device is used for reading the reference mark. Has the advantages that: the first calibration mark and the second calibration mark can be clearly acquired by the image acquisition device at the same time, and the wafer bonding precision is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to wafer bonding equipment and a wafer bonding method, which are used for improving the wafer bonding precision.
Background
Wafer alignment is the most critical factor affecting bonding precision in a wafer bonding process, and is mainly realized by mechanical movement of a chuck (Table) for fixing a wafer and acquisition of wafer coordinates through a lens for reading an alignment Mark (Mark) on the wafer.
The two bonded wafers are divided into an upper wafer and a lower wafer, and lenses for respectively reading the alignment marks of the two wafers are divided into an independent type and an integrated type. The independent type is that the lenses for reading the upper wafer and the lower wafer are independent from each other, and finally the mark coordinates obtained by the two lenses are converted into a coordinate system to calculate the relative positions of the two wafers; the integrated lens for reading the upper wafer and the lower wafer is fixed on the same moving mechanism, the two lenses cannot move relatively, and the relative positions of the two wafers can be directly calculated in a coordinate system. Compared with an independent lens, the integrated lens has less intermediate coordinate system conversion and higher relative precision.
After the prior art, the upper lens and the lower lens are calibrated, the distance between the upper lens and the lower lens is determined, the calibration mark of the same wafer is manually adjusted and read, the calibration mark can be read within the depth range of the lens, and an error exists in comparison with a standard focal length; when the alignment mark of the wafer under reading by the integral lens is clearest, the alignment mark of the wafer on reading at the back is often unclear. Moreover, since the upper chuck cannot move vertically in the Z-axis direction, when the alignment mark of the upper wafer is read, the lens and the upper chuck cannot move relatively, and if there is a difference in wafer thickness, the alignment mark of the upper wafer may not be clear.
Disclosure of Invention
In view of the above problems in the prior art, an apparatus and method for wafer bonding are provided.
The specific technical scheme is as follows:
the invention includes an apparatus for wafer bonding, comprising:
the first fixing device can only move along the X-axis direction and the Y-axis direction and is used for fixing a first wafer to be bonded on the first fixing device in a way that the bonding surface faces downwards, and a first calibration mark is arranged on the first wafer;
the reference mark is arranged on the first fixing device;
the second fixing device can move along the directions of an X axis, a Y axis and a Z axis and is arranged opposite to the first fixing device;
the rotating device is arranged on one surface, facing the first fixing device, of the second fixing device and used for fixing a second wafer to be bonded, and a second calibration mark is arranged on the second wafer;
a pair of image acquisition devices which are oppositely arranged and can synchronously move along an X axis, a Y axis and a Z axis and are respectively used for acquiring the first calibration mark and the second calibration mark so as to align the first wafer and the second wafer;
and the reference mark acquisition device is used for reading the reference mark so as to acquire the real-time position of the first fixing device as a reference coordinate.
Preferably, the rotating means is a chuck.
Preferably, the first fixing device is provided with at least one sensor for detecting a distance between the first fixing device and the second fixing device to obtain a reference position.
Preferably, the apparatus includes a support which is arranged along the Z-axis direction and can move along the X-axis, Y-axis and Z-axis directions, and the pair of image capturing devices are respectively arranged at the upper and lower ends of the support.
Preferably, a pair of the image capturing apparatuses includes:
the first image acquisition device is arranged at the upper end of the bracket, has a downward acquisition direction and is used for acquiring the second calibration mark;
and the second image acquisition device is arranged at the upper end of the support, the acquisition direction of the second image acquisition device is upward, and the second image acquisition device is used for acquiring the first calibration mark.
The invention comprises a method for bonding wafers, which comprises the following steps:
step S1, horizontally moving the first fixing device to a position between a pair of image acquisition devices;
step S2, adjusting the positions of a pair of image acquisition devices to enable the pair of image acquisition devices to clearly acquire the first calibration marks, and locking the positions of the pair of image acquisition devices;
step S3, the reference mark collecting device collects the reference mark for the first time, and records the real-time position of the first fixing device at this time as the reference coordinate;
a step S4 of moving the first fixing device away from between a pair of the image capturing devices and moving the second fixing device to between a pair of the image capturing devices;
step S5, adjusting the position of the second fixing device and/or the rotating device to clearly capture the second calibration mark by the pair of image capturing devices;
a step S6 of moving the second fixing device away from between the pair of image capturing devices and moving the first fixing device to between the pair of image capturing devices;
step S7, the reference mark collecting device collects the reference mark for the second time, and records the real-time position of the first fixing device at this time as the reference coordinate;
step S8, comparing the reference coordinates acquired for the first time with the reference coordinates acquired for the second time, calculating a difference compensation value, and adjusting the second wafer according to the difference compensation value;
step S9, moving the second fixture to a bonding position, and bonding the first wafer and the second wafer.
Preferably, the step S1 includes:
step S11, moving the first fixing device and the second fixing device to a corresponding transfer position in the horizontal direction;
step S12, transferring the first wafer and the second wafer to the first fixture and the second fixture, respectively;
in step S13, the first fixing device is moved to an alignment position in the horizontal direction, so that the first wafer is moved between the pair of image capturing devices.
Preferably, the step S4 includes:
step S41, the second fixing device moves to the corresponding alignment position in the horizontal direction, and the second fixing device is at a safety position in the vertical direction;
in step S42, the second fixing device is lifted to a contact position in the vertical direction.
Preferably, the step S5 includes:
step S51, adjusting the position of the rotating device until the second calibration mark appears in the field of view of the image capturing device, stopping rotating the rotating device and locking the rotating device;
step S52, adjusting the position of the second fixing device in the vertical direction until the image capturing device can clearly capture the second calibration mark, and recording the position of the second fixing device at this time as the bonding position.
Preferably, in step S8, the position of the rotating device is adjusted according to the difference compensation value to calibrate the position of the second wafer relative to the first wafer.
The technical scheme of the invention has the beneficial effects that: the equipment and the method for wafer bonding can ensure that an image acquisition device can simultaneously and clearly acquire a first calibration mark and a second calibration mark; and the precision of the reference coordinate obtained when the reference mark is collected is improved by adjusting the order of wafer calibration, so that the wafer bonding precision is improved.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
FIG. 1 is a schematic illustration of a reference position Z0 of a second fixture according to an embodiment of the present invention;
FIG. 2 is a schematic view of the contact position Z1 of the second fixture in an embodiment of the present invention;
FIG. 3 is a schematic view of a keying location Z2 of a second fixture in an embodiment of the present invention;
FIG. 4 is a schematic view of the safety position Z3 of the second fastening device in accordance with an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an apparatus in an embodiment of the invention;
FIG. 6 is a flow chart of steps of a method in an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The present invention includes an apparatus for wafer bonding, as shown in fig. 5, including:
the first fixing device 1 can only move along the X-axis direction and the Y-axis direction and is used for fixing a first wafer 10 to be bonded on the first fixing device 1 with a bonding surface facing downwards, and a first calibration mark is arranged on the first wafer 10;
a reference mark 11 disposed on the first fixture 1;
as shown in fig. 4, a second fixing device 2 movable in the X-axis, Y-axis, and Z-axis directions is disposed opposite to the first fixing device 1;
the rotating device is arranged on one surface, facing the first fixing device 1, of the second fixing device and is used for fixing a second wafer 20 to be bonded, and a second calibration mark is arranged on the second wafer 20;
as shown in fig. 5, a pair of image capturing devices 3, which are oppositely disposed and can move along the X-axis, the Y-axis, and the Z-axis synchronously, are used for capturing the first calibration mark and the second calibration mark, respectively, so as to align the first wafer 10 and the second wafer 20;
a reference mark acquisition device 4 for reading the reference mark 11 so as to acquire the real-time position of the first fixing device 1 as a reference coordinate;
the device comprises a bracket 5 which is arranged along the Z-axis direction and can move along the X-axis direction, the Y-axis direction and the Z-axis direction, and a pair of image acquisition devices 3 are respectively arranged at the upper end and the lower end of the bracket 5;
the pair of image pickup devices 3 includes:
the first image acquisition device 31 is arranged at the upper end of the bracket 5, has a downward acquisition direction and is used for acquiring a second calibration mark;
a second image capturing device 32 disposed at the upper end of the bracket 5 and having an upward capturing direction for capturing the first calibration mark.
Specifically, in the present embodiment, as shown in fig. 1 to 4, the first fixing device 1 includes a first base 12 and a first chuck 13, the first chuck 13 is disposed on the first base 12, the first fixing device 1 is disposed at the upper end of the support 5, the first fixing device 1 can only move along the X-axis direction and the Y-axis direction, but cannot move along the Z-axis direction, that is, cannot move in the vertical direction, and the first chuck 13 is used for fixing the first wafer 10; the second fixing device 2 includes a rotating device and a second base 22, the rotating device is disposed on the second base 22, the rotating device is a chuck, in order to be distinguished from the first chuck 13, the rotating device is defined as a second chuck 21 in this embodiment, the second chuck 21 is rotatable, the second fixing device 2 can only move along the directions of the X axis, the Y axis and the Z axis, and the second chuck 21 drives the second wafer 20 to rotate, so that the second wafer 20 is aligned with the first wafer 10.
Specifically, the reference mark 11 is disposed on the first chuck 13, and the reference mark collecting device 4 is a reference lens for reading the reference mark 11. In the process of calibrating the wafer, firstly, the first fixing device 1 and the second fixing device 2 are respectively moved to corresponding transfer positions, and the first wafer 10 and the second wafer 20 are respectively transferred to the first fixing device 1 and the second fixing device 2; moving the first fixing device 1 to the alignment position, moving the pair of image acquisition devices 3 along the X axis, the Y axis and the Z axis, adjusting the positions of the image acquisition devices 3 until the second image acquisition devices 32 read the first alignment marks on the first wafer 10 to be clearest, and locking the positions of the pair of image acquisition devices 3; adjusting the position of the reference lens 4 to enable the reference lens 4 to collect the reference mark 11 for the first time, so as to collect the real-time position of the first fixing device 1 at the moment as a first reference coordinate; subsequently the first fixture 1 is moved in the horizontal direction to the transfer position, the second fixture 2 is moved in the horizontal direction to the alignment position, and the second fixture 2 is in the safety position Z3 (shown in fig. 4) in the vertical direction; the second fixture 2 is raised to the contact position Z1 shown in fig. 2, and if the image capturing device 3 cannot capture the second calibration standard, the second chuck 21 is rotated to adjust the second calibration standard to be within the field of view of the first image capturing device 31, and then the second chuck 21 is locked; adjusting the position of the second fixing device 2 in the vertical direction until the second calibration mark acquired by the first image acquisition device 31 is clearest; the second fixing device 2 descends to a safe position Z3 in the vertical direction, the first fixing device 1 moves to an alignment position, the reference mark 11 on the first chuck 13 is read again by using the reference lens 4, the real-time position of the first fixing device 1 at the moment is collected as a second reference coordinate, the first reference coordinate and the second reference coordinate are automatically compared through a software program to calculate difference compensation, and the position of the second wafer 20 is adjusted through the difference compensation to improve the calibration precision between the wafers; the second fixture 2 is lifted from the safety position Z3 to the bonding position Z2 (shown in fig. 3) to ensure a bonding gap between the first wafer 10 and the second wafer 20, thereby improving the bonding accuracy between the wafers and further bonding the first wafer 10 and the second wafer 20.
In a preferred embodiment, the first fixture 1 is provided with at least one sensor for detecting the distance between the first fixture 1 and the second fixture 2 to obtain a reference position Z0.
Specifically, in the present embodiment, three sensors are uniformly provided below the first chuck 13 of the first fixture 1 for detecting the reference position Z0 of the first chuck 13 and the second chuck 21 and ensuring that the first chuck 13 and the second chuck 21 are kept parallel. As shown in fig. 1, the reference position Z0 represents the position of the second chuck 21 when it is raised to the position of the second susceptor 22 when it is engaged with the first chuck 13, the reference position Z0 has an important meaning to the wafer alignment accuracy, and the contact position Z1, the bonding position Z2, and the safety position Z3 are calculated based on the reference position Z0. As shown in fig. 4, the safety position Z3 is for ensuring the distance between the first fixture 1 and the second fixture 2, as shown in fig. 2, the contact position Z1 represents the position of the second susceptor 22 when the first wafer 10 is attached to the second wafer 20, as shown in fig. 3, the bonding position Z2 represents the position of the second susceptor in the vertical direction when the first wafer 10 is bonded to the second wafer 20, and the bonding position Z2 ensures the bonding gap between the wafers.
An embodiment of the present invention provides a method for wafer bonding, as shown in fig. 6, including the following steps:
step S1, horizontally moving the first fixing device 1 to between the pair of image capturing devices 3;
step S2, adjusting the positions of the pair of image capturing devices 3 to clearly capture the first calibration marks of the pair of image capturing devices 3, and locking the positions of the pair of image capturing devices 3;
step S3, the reference mark acquisition device 4 acquires the reference mark 11 for the first time and records the real-time position of the first fixing device 1 at the moment as a reference coordinate;
a step S4 of separating the first fixture 1 from between the pair of image capturing devices 3 and moving the second fixture 2 to between the pair of image capturing devices 3;
step S5, adjusting the position of the second fixing device 2 and/or the rotating device 21 to clearly acquire the second calibration mark by the pair of image acquisition devices 3;
a step S6 of moving the second fixing device 2 away from between the pair of image capturing devices 3 and moving the first fixing device 1 to between the pair of image capturing devices 3;
step S7, the reference mark acquisition device 4 acquires the reference mark 11 for the second time and records the real-time position of the first fixing device 1 as a reference coordinate;
step S8, comparing the reference coordinate acquired for the first time with the reference coordinate acquired for the second time, calculating a difference compensation value, and adjusting the second wafer 20 according to the difference compensation value;
in step S9, the second fixture 2 is moved to a bonding position to bond the first wafer 10 and the second wafer 20.
Specifically, in this embodiment, step S1 specifically includes: step S11, the first fixing device 1 and the second fixing device 2 move to a corresponding transfer position in the horizontal direction; step S12, transferring the first wafer 10 and the second wafer 20 to the first fixture 1 and the second fixture 2, respectively; in step S13, the first fixing device 1 moves to an alignment position in the horizontal direction, so that the first wafer 10 moves between the pair of image capturing devices 3.
Specifically, step S4 includes: step S41, the second fixing device 2 moves to the corresponding alignment position in the horizontal direction, and the second fixing device 2 is at a safety position Z3 in the vertical direction; in step S42, the second fixture 2 is lifted to a contact position Z1 in the vertical direction.
Specifically, step S5 includes: step S51, adjusting the position of the second chuck 21 (i.e. the rotating device) until the second calibration mark appears in the field of view of the image capturing device 3, stopping rotating the second chuck 21 and locking the second chuck 21; step S52, adjusting the position of the second fixing device 2 in the vertical direction until the image capturing device 3 can clearly capture the second calibration mark, and recording the position of the second fixing device 2 at this time as the bonding position Z2 shown in fig. 3, where the bonding position Z2 is to ensure the bonding gap of the wafer, and the bonding gap is important for the bonding of the wafer and is the most core parameter except for the alignment accuracy.
Specifically, since an error may occur in the process of moving the first fixture 1 to the alignment position each time, the reference coordinates on the first fixture 1 are acquired twice by the reference lens 4 and are respectively recorded as the first reference coordinates and the second reference coordinates, and the difference compensation value is calculated by comparing the first reference coordinates and the second reference coordinates. Further, in step S8, the position of the second chuck 21 is adjusted again according to the difference compensation value to calibrate the position of the second wafer relative to the first wafer, so as to improve the calibration accuracy between wafers.
The technical scheme of the invention has the beneficial effects that: the equipment and the method for wafer bonding can ensure that an image acquisition device can simultaneously and clearly acquire a first calibration mark and a second calibration mark; and the precision of the reference coordinate obtained when the reference mark is collected is improved by adjusting the order of wafer calibration, so that the wafer bonding precision is improved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (9)
1. An apparatus for wafer bonding, comprising:
the first fixing device can only move along the X-axis direction and the Y-axis direction and is used for fixing a first wafer to be bonded on the first fixing device in a way that the bonding surface faces downwards, and a first calibration mark is arranged on the first wafer;
the reference mark is arranged on the first fixing device;
the second fixing device can move along the directions of an X axis, a Y axis and a Z axis and is arranged opposite to the first fixing device;
the rotating device is arranged on one surface, facing the first fixing device, of the second fixing device and used for fixing a second wafer to be bonded, and a second calibration mark is arranged on the second wafer;
a pair of image acquisition devices which are oppositely arranged and can synchronously move along an X axis, a Y axis and a Z axis and are respectively used for acquiring the first calibration mark and the second calibration mark so as to align the first wafer and the second wafer;
the reference mark acquisition device is used for reading the reference mark so as to acquire the real-time position of the first fixing device as a reference coordinate;
the image acquisition device comprises a support which is arranged along the Z-axis direction and can move along the X-axis direction, the Y-axis direction and the Z-axis direction, and a pair of image acquisition devices are respectively arranged at the upper end and the lower end of the support.
2. The apparatus of claim 1, wherein the rotating means is a chuck.
3. The apparatus of claim 1, wherein the first fixture is provided with at least one sensor for detecting a distance between the first fixture and the second fixture to obtain a reference position.
4. The apparatus of claim 3, wherein a pair of the image capture devices comprises:
the first image acquisition device is arranged at the upper end of the bracket, has a downward acquisition direction and is used for acquiring the second calibration mark;
and the second image acquisition device is arranged at the upper end of the support, the acquisition direction of the second image acquisition device is upward, and the second image acquisition device is used for acquiring the first calibration mark.
5. A method of wafer bonding, characterized by being applied to the apparatus of any one of claims 1-4; the method comprises the following steps:
step S1, horizontally moving the first fixing device to a position between a pair of image acquisition devices;
step S2, adjusting the positions of a pair of image acquisition devices to enable the pair of image acquisition devices to clearly acquire the first calibration marks, and locking the positions of the pair of image acquisition devices;
step S3, the reference mark collecting device collects the reference mark for the first time, and records the real-time position of the first fixing device at this time as the reference coordinate;
a step S4 of moving the first fixing device away from between a pair of the image capturing devices and moving the second fixing device to between a pair of the image capturing devices;
step S5, adjusting the position of the second fixing device and/or the rotating device to clearly capture the second calibration mark by the pair of image capturing devices;
a step S6 of moving the second fixing device away from between the pair of image capturing devices and moving the first fixing device to between the pair of image capturing devices;
step S7, the reference mark collecting device collects the reference mark for the second time, and records the real-time position of the first fixing device at this time as the reference coordinate;
step S8, comparing the reference coordinates acquired for the first time with the reference coordinates acquired for the second time, calculating a difference compensation value, and adjusting the second wafer according to the difference compensation value;
step S9, moving the second fixture to a bonding position, and bonding the first wafer and the second wafer.
6. The method according to claim 5, wherein the step S1 includes:
step S11, moving the first fixing device and the second fixing device to a corresponding transfer position in the horizontal direction;
step S12, transferring the first wafer and the second wafer to the first fixture and the second fixture, respectively;
in step S13, the first fixing device is moved to an alignment position in the horizontal direction, so that the first wafer is moved between the pair of image capturing devices.
7. The method according to claim 5, wherein the step S4 includes:
step S41, the second fixing device moves to the corresponding alignment position in the horizontal direction, and the second fixing device is at a safety position in the vertical direction;
in step S42, the second fixing device is lifted to a contact position in the vertical direction.
8. The method according to claim 5, wherein the step S5 includes:
step S51, adjusting the position of the rotating device until the second calibration mark appears in the field of view of the image capturing device, stopping rotating the rotating device and locking the rotating device;
step S52, adjusting the position of the second fixing device in the vertical direction until the image capturing device can clearly capture the second calibration mark, and recording the position of the second fixing device at this time as the bonding position.
9. The method of claim 5, wherein in step S8, the position of the rotating device is adjusted according to the difference compensation value to calibrate the position of the second wafer relative to the first wafer.
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| CN110854052A (en) * | 2019-10-11 | 2020-02-28 | 长江存储科技有限责任公司 | Parallelism calibration method and device and computer storage medium |
| CN110955120B (en) * | 2019-12-16 | 2021-08-06 | 武汉新芯集成电路制造有限公司 | Method and device for determining precompensation value |
| CN112768393A (en) * | 2021-02-02 | 2021-05-07 | 沈阳芯源微电子设备股份有限公司 | Calibration device, alignment system and alignment method |
| CN115799140B (en) * | 2022-07-20 | 2023-12-01 | 拓荆键科(海宁)半导体设备有限公司 | Calibration method and device, combined microscope and wafer bonding method |
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| KR101484348B1 (en) * | 2007-08-10 | 2015-01-19 | 가부시키가이샤 니콘 | Substrate bonding apparatus and substrate bonding method |
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