CN110246771A - A kind of device and method of wafer bonding - Google Patents
A kind of device and method of wafer bonding Download PDFInfo
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- CN110246771A CN110246771A CN201910528673.7A CN201910528673A CN110246771A CN 110246771 A CN110246771 A CN 110246771A CN 201910528673 A CN201910528673 A CN 201910528673A CN 110246771 A CN110246771 A CN 110246771A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/76—Apparatus for connecting with build-up interconnects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/76001—Calibration means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/767—Means for aligning
- H01L2224/76753—Means for optical alignment, e.g. sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
- H01L2224/8212—Aligning
- H01L2224/82121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/8213—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
Abstract
The present invention relates to technical field of manufacturing semiconductors more particularly to a kind of equipment of wafer bonding, comprising: the fixed device of can only move along X-axis, Y direction first, for fixing the first wafer to be bonded, the first wafer is equipped with one first calibration marker;Reference mark is set on the first fixed device;The fixed device of can move along X-axis, Y-axis, Z-direction second is oppositely arranged with the first fixed device;Rotating device is set to the second fixed device towards the one side of the first fixed device, and for fixing one second wafer to be bonded, the second wafer is equipped with one second calibration marker;To the image collecting device moved along X-axis, Y-axis, Z axis that is oppositely arranged and can synchronize, it is respectively used to the first calibration marker of acquisition and the second calibration marker;One reference mark acquisition device, for reading reference mark.The utility model has the advantages that may insure image collecting device while clearly collecting the first calibration marker and the second calibration marker, wafer bonding precision is improved.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors more particularly to a kind of device and method of wafer bonding, to improve
The precision of wafer bonding.
Background technique
Wafer alignment is the factor that bonding precision most critical is influenced in wafer bonding processing procedure, and wafer alignment is mainly by fixed brilliant
The mechanical movement of round chuck (Table) and the camera lens of the registration mark (Mark) on reading wafer are common to obtain wafer coordinate
To realize.
The wafer of two panels bonding is divided into wafer and lower wafer, and the camera lens for reading two panels wafer alignment mark respectively is divided into solely
Vertical and integral type.Stand alone type for the camera lens that reads upper wafer and lower wafer be it is independent of each other, finally two camera lenses are obtained
Marker coordinates be transformed into a coordinate system relative position for calculating two wafers;Integral type is to read upper wafer under
The camera lens of wafer is fixed in the same mobile mechanism, and two camera lenses are unable to move relatively, can be straight in a coordinate system
Connect the relative position for calculating two wafers.The more free-standing camera lens of integral type camera lens has lacked middle coordinate system conversion, and relative accuracy is more
It is high.
After the prior art, upper and lower lens calibration determines the spacing up and down between camera lens, be manually adjust read it is same
The calibration marker of a wafer can be read in camera lens field depth, and there are errors compared with standard focal length;Lead to integral type
It is often unintelligible in the registration mark for reading upper wafer below when the registration mark of wafer is clearest under camera lens is read.Moreover,
Since upper chuck can not be vertically moved in Z-direction, when reading the registration mark of upper wafer, camera lens and upper chuck can not be opposite
Movement, if wafer thickness has differences, the registration mark for also resulting in the upper wafer of reading is unintelligible.
Summary of the invention
For the above-mentioned problems in the prior art, a kind of device and method of wafer bonding are now provided.
Specific technical solution is as follows:
The present invention includes a kind of equipment of wafer bonding, comprising:
One the first fixed device that can be only moved along X-axis, Y direction, for making a first wafer bonding face to be bonded
Directed downwardly to be fixed on the described first fixed device, first wafer is equipped with one first calibration marker;
One reference mark is set on the described first fixed device;
One the second fixed device that can be moved along X-axis, Y-axis, Z-direction, is oppositely arranged with the described first fixed device;
One rotating device is set to one side of the described second fixed device towards the described first fixed device, for fixing
One second wafer to be bonded, second wafer are equipped with one second calibration marker;
A pair of opposing, and the image collecting device moved along X-axis, Y-axis, Z axis that can be synchronized are respectively used to acquisition institute
The first calibration marker and second calibration marker are stated, so that first wafer and second wafer alignment;
One reference mark acquisition device, for reading the reference mark, to acquire the reality of the described first fixed device
When position as a reference coordinates.
Preferably, the rotating device is a chuck.
Preferably, the described first fixed device is equipped at least one sensor, for detecting the described first fixed device
The distance between described second fixed device is to obtain a base position.
Preferably, the equipment is arranged including one along Z-direction, and the bracket that can be moved along X-axis, Y-axis, Z-direction, and one
The upper and lower ends of the bracket are respectively arranged to described image acquisition device.
Preferably, a pair of of described image acquisition device includes:
One first image collecting device is arranged on the bracket end, and acquisition direction is downward, to acquire described second
Calibration marker;
One second image collecting device is arranged on the bracket end, and acquisition direction is upward, to acquire described first
Calibration marker.
The present invention includes a kind of method of wafer bonding, comprising the following steps:
Step S1, by being moved between a pair of of described image acquisition device for the described first fixed device level;
Step S2 adjusts the position of a pair of of described image acquisition device, adopts a pair of of described image acquisition device clearly
Collect first calibration marker, and locks the position of a pair of of described image acquisition device;
Step S3, the reference mark acquisition device acquire the reference mark for the first time, and record is described first solid at this time
The real time position of device is determined as the reference coordinates;
Step S4 leaves the described first fixed device between a pair of of described image acquisition device, and described second is consolidated
Determine device to be moved between a pair of of described image acquisition device;
Step S5 adjusts the position of the described second fixed device and/or the rotating device, acquires a pair of of described image
Device clearly collects second calibration marker;
Step S6 leaves the described second fixed device between a pair of of described image acquisition device, and described first is consolidated
Determine device to be moved between a pair of of described image acquisition device;
Step S7, the reference mark acquisition device acquire the reference mark for the second time, and record is described first solid at this time
The real time position of device is determined as the reference coordinates;
Step S8 compares the reference coordinates of the reference coordinates of first time acquisition and second of acquisition,
And a difference offset is calculated, second wafer is adjusted according to the difference offset;
Described second fixed device is moved to a bonding position by step S9, by first wafer and second crystalline substance
Round key closes.
Preferably, the step S1 includes:
Step S11, the described first fixed device and the second fixed device are moved to corresponding respectively at horizontal direction
One transmission position;
First wafer and second wafer are respectively sent to the described first fixed device and described by step S12
Second fixed device;
Step S13, described first it is fixed be installed on horizontal direction and be moved to a pair of of level set so that first wafer moves
It moves between a pair of of described image acquisition device.
Preferably, the step S4 includes:
Step S41, the described second fixed horizontal direction that is installed on is moved to corresponding alignment position, and described second is fixed
The home of device vertically;
Step S42, second fixation are installed on vertical direction and rise to a contact position.
Preferably, the step S5 includes:
Step S51 adjusts the position of the rotating device, until second calibration marker appears in described image acquisition
In the visual field of device, stopping rotating the rotating device and locks the rotating device;
Step S52 adjusts the described second fixed position for being installed on vertical direction, until described image acquisition device can
Second calibration marker is clearly collected, record described second fixes the position of device as the bonding position at this time.
Preferably, in step S8, the position of the rotating device is adjusted according to the difference offset, described in calibration
Position of second wafer relative to first wafer.
The beneficial effect of technical solution of the present invention is: providing a kind of device and method of wafer bonding, it can be ensured that figure
As acquisition device clearly collects the first calibration marker and the second calibration marker simultaneously;And by adjusting time of wafer calibration
Sequence, the precision of the reference coordinates obtained when improving acquisition reference mark, to improve wafer bonding precision.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the schematic diagram of the base position Z0 of the second fixed device in the embodiment of the present invention;
Fig. 2 is the schematic diagram of the contact position Z1 of the second fixed device in the embodiment of the present invention;
Fig. 3 is the schematic diagram of the bonding position Z2 of the second fixed device in the embodiment of the present invention;
Fig. 4 is the schematic diagram of the home Z3 of the second fixed device in the embodiment of the present invention;
Fig. 5 is the structural schematic diagram of the equipment in the embodiment of the present invention;
Fig. 6 is the step flow chart of the method in the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
The present invention includes a kind of equipment of wafer bonding, as shown in Figure 5, comprising:
One the first fixed device 1 that can be only moved along X-axis, Y direction, for making the first wafer 10 bonding to be bonded
Face-down is fixed on the first fixed device 1, and the first wafer 10 is equipped with one first calibration marker;
One reference mark 11 is set on the first fixed device 1;
As shown in figure 4, a second fixed device 2 that can be moved along X-axis, Y-axis, Z-direction, with the first fixed 1 phase of device
To setting;
One rotating device is set to one side of the second fixed device towards the first fixed device 1, to be bonded for fixing
One second wafer 20, the second wafer 20 are equipped with one second calibration marker;
As shown in figure 5, a pair of opposing, and the image collecting device 3 moved along X-axis, Y-axis, Z axis that can be synchronized, point
The first calibration marker and the second calibration marker Yong Yu not be acquired, so that the first wafer 10 and the alignment of the second wafer 20;
One reference mark acquisition device 4, for reading reference mark 11, thus the real-time position of the fixed device 1 of acquisition first
It sets as reference coordinates;
It is arranged including one along Z-direction, and can be along the bracket 5 that X-axis, Y-axis, Z-direction move, a pair of of image collecting device
3 are respectively arranged at the upper and lower ends of bracket 5;
A pair of of image collecting device 3 includes:
One first image collecting device 31 is set to 5 upper end of bracket, and acquisition direction is downward, to acquire the second calibration
Mark;
One second image collecting device 32 is set to 5 upper end of bracket, and acquisition direction is upward, to acquire the first calibration
Mark.
Specifically, in the present embodiment, as shown in Figures 1 to 4, the first fixed device 1 includes the first pedestal 12 and first
Chuck 13, the first chuck 13 are set on the first pedestal 12, and the first fixed device 1 is set to the upper end of bracket 5, the first fixed dress
Setting 1 can only move along X-axis, Y direction, but can not move along Z-direction, i.e., can not be mobile in vertical direction, the first chuck 13
For fixing the first wafer 10;Second fixed device 2 includes that rotating device and the second pedestal 22, rotating device are set to the second base
On seat 22, rotating device is chuck, and in order to be different from the first chuck 13, rotating device is defined as the second chuck in the present embodiment
21, the second chuck 21 is rotatable, and the second fixed device 2 can only be moved along X-axis, Y-axis, Z-direction, is driven by the second chuck 21
Second wafer 20 rotation, so that the second wafer 20 is aligned with the first wafer 10.
Specifically, reference mark 11 is set on the first chuck 13, and reference mark acquisition device 4 is to be used for referring to camera lens
Read reference mark 11.In the calibration process of wafer, firstly, the first fixed device 1 and the second fixed device 2 are being moved respectively
It moves to corresponding transmission position, it is fixed that the first wafer 10 and the second wafer 20 are respectively sent to the first fixed device 1 and second
On device 2;The first fixed device 1 is moved to alignment position again, a pair of of image collecting device 3 can be moved along X-axis, Y-axis, Z axis,
The position for adjusting image collecting device 3, until the second image collecting device 32 reads first pair of fiducial mark on the first wafer 10
Until will is clearest, and the position of a pair of of image collecting device 3 is locked;The position of adjustment reference camera lens 4, so that referring to camera lens
4 acquire reference mark 11 for the first time, so that acquisition first fixes the real time position of device 1 as the first reference coordinates at this time;With
The first fixed device 1 is moved to transmission position in the horizontal direction afterwards, and the second fixed device 2 is moved in the horizontal direction to level
It sets, the home Z3 of the second fixed device 2 vertically (shown in Fig. 4);Second fixed device 2 rises to shown in Fig. 2
Contact position Z1 rotate the second chuck 21 if image collecting device 3 can not collect the second calibration standard, adjust to
Two calibration markers appear in the visual field of the first image collecting device 31, then lock the second chuck 21;The fixed dress of adjustment second
2 are set in the position of vertical direction, until collected second calibration marker of the first image collecting device 31 is clearest;Second is fixed
Device 2 drops to home Z3 in vertical direction, and the first fixed device 1 is moved to alignment position, again using referring to camera lens 4
Read the reference mark 11 on the first chuck 13, the real time position of acquisition the first fixed device 1 at this time as the second reference coordinates,
And the first reference coordinates are compared by software program automatically and the second reference coordinates calculate difference compensation, pass through difference compensation and adjusts
The position of whole second wafer 20, to improve the calibration accuracy between wafer;The second fixed device 2 is risen by home Z3 again
To bonding position Z2 (shown in Fig. 3), to guarantee the bonding gap between the first wafer 10 and the second wafer 20, to improve wafer
Between bonding precision, further the first wafer 10 and the second wafer 20 are bonded.
As preferred embodiment mode, the first fixed device 1 is equipped at least one sensor, solid for detecting first
The distance between device 1 and the second fixed device 2 are determined to obtain a base position Z0.
Specifically, in the present embodiment, three sensings are equably set below the first chuck 13 of the first fixed device 1
Device for detecting the base position Z0 of the first chuck 13 and the second chuck 21, and ensures that the first chuck 13 and the second chuck 21 are protected
Maintain an equal level row.As shown in Figure 1, base position Z0 indicates that the second chuck 21 rises to the second pedestal 22 when being bonded with the first chuck 13
Position, base position Z0 have great importance for wafer calibration precision, contact position Z1, bonding position Z2 and security bit
It sets Z3 and is all based on base position Z0 and be calculated.As shown in figure 4, home Z3 be in order to ensure the first fixed device 1 with
The distance between second fixed device 2, as shown in Fig. 2, when contact position Z1 indicates that the first wafer 10 is bonded with the second wafer 20
The position of second pedestal 22, as shown in figure 3, when bonding position Z2 is for indicating that the first wafer 10 is bonded with the second wafer 20, the
In the position of vertical direction, bonding position Z2 is used to guarantee the bonding gap between wafer two pedestals.
The embodiment of the present invention provides a kind of method of wafer bonding, as shown in Figure 6, comprising the following steps:
Step S1, by being moved between a pair of of image collecting device 3 for the first fixed 1 level of device;
Step S2 adjusts the position of a pair of of image collecting device 3, and a pair of of image collecting device 3 is made clearly to collect the
One calibration marker, and lock the position of a pair of of image collecting device 3;
Step S3, reference mark acquisition device 4 acquire reference mark 11 for the first time, and record first fixes device 1 at this time
Real time position is as reference coordinates;
Step S4 leaves the first fixed device 1 between a pair of of image collecting device 3, and the second fixed device 2 is mobile
To between a pair of of image collecting device 3;
Step S5, the position of the fixed device 2 of adjustment second and/or rotating device 21 keep a pair of of image collecting device 3 clear
Collect the second calibration marker;
Step S6 leaves the second fixed device 2 between a pair of of image collecting device 3, and the first fixed device 1 is mobile
To between a pair of of image collecting device 3;
Step S7, second of the acquisition reference mark 11 of reference mark acquisition device 4, record first fix device 1 at this time
Real time position is as reference coordinates;
The reference coordinates of the reference coordinates of first time acquisition and second of acquisition are compared, and calculated by step S8
A difference offset out adjusts the second wafer 20 according to difference offset;
Second fixed device 2 is moved to a bonding position, the first wafer 10 is bonded with the second wafer 20 by step S9.
Specifically, in the present embodiment, step S1 is specifically included: step S11, the first fixed device 1 and the second fixed dress
It sets 2 and is moved to corresponding transmission position respectively at horizontal direction;Step S12 distinguishes the first wafer 10 and the second wafer 20
It is sent to the first fixed device 1 and the second fixed device 2;Step S13, the first fixed device 1 are moved to a pair in horizontal direction
Level is set, so that the first wafer 10 is moved between a pair of of image collecting device 3.
Specifically, step S4 includes: step S41, and the second fixed device 2 is moved to corresponding to level in horizontal direction
It sets, and the home Z3 of the second fixed device 2 vertically;Step S42, the second fixed device 2 is in vertical direction
Rise to a contact position Z1.
Specifically, step S5 includes: step S51, adjusts the position of the second chuck 21 (i.e. rotating device), until the second school
Fiducial mark will appears in the visual field of image collecting device 3, and stop rotating the second chuck 21 and the second chuck 21 of locking;Step S52,
The fixed device 2 of adjustment second is in the position of vertical direction, until image collecting device 3 can clearly collect the second calibration mark
Will, the second position for fixing device 2 is to ensure that wafer as bonding position Z2 shown in Fig. 3, bonding position Z2 to record at this time
Bonding gap, bonding gap it is particularly significant for the bonding of wafer, be most crucial parameter other than alignment precision.
Specifically, since the first fixed device 1 is each time during being moved to alignment position all there may be error,
Therefore, the reference coordinates acquired twice by referring to camera lens 4 on first fixed device 1 are denoted as the first reference coordinates and second respectively
Reference coordinates calculate difference offset by the first reference coordinates of comparison and the second reference coordinates.Further, in step S8
In, adjust the position of the second chuck 21 again according to difference offset, to calibrate position of second wafer relative to the first wafer,
To improve the calibration accuracy between wafer.
The beneficial effect of technical solution of the present invention is: providing a kind of device and method of wafer bonding, it can be ensured that figure
As acquisition device clearly collects the first calibration marker and the second calibration marker simultaneously;And by adjusting time of wafer calibration
Sequence, the precision of the reference coordinates obtained when improving acquisition reference mark, to improve wafer bonding precision.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (10)
1. a kind of equipment of wafer bonding characterized by comprising
One the first fixed device that can be only moved along X-axis, Y direction, for keeping first wafer bonding to be bonded face-down
Be fixed on the described first fixed device, first wafer is equipped with one first calibration marker;
One reference mark is set on the described first fixed device;
One the second fixed device that can be moved along X-axis, Y-axis, Z-direction, is oppositely arranged with the described first fixed device;
One rotating device is set to one side of the described second fixed device towards the described first fixed device, for fixed to key
One second wafer closed, second wafer are equipped with one second calibration marker;
A pair of opposing, and the image collecting device moved along X-axis, Y-axis, Z axis that can be synchronized are respectively used to acquire described
One calibration marker and second calibration marker, so that first wafer and second wafer alignment;
One reference mark acquisition device, for reading the reference mark, to acquire the real-time position of the described first fixed device
It sets as a reference coordinates.
2. equipment according to claim 1, which is characterized in that the rotating device is a chuck.
3. equipment according to claim 1, which is characterized in that the described first fixed device is equipped at least one sensing
Device, for detecting the distance between the described first fixed device and the second fixed device to obtain a base position.
4. equipment according to claim 1, which is characterized in that be arranged including one along Z-direction, and can be along X-axis, Y-axis, Z
The mobile bracket of axis direction, a pair of of described image acquisition device are respectively arranged at the upper and lower ends of the bracket.
5. equipment according to claim 4, which is characterized in that a pair of of described image acquisition device includes:
One first image collecting device is arranged on the bracket end, and acquisition direction is downward, to acquire second calibration
Mark;
One second image collecting device is arranged on the bracket end, and acquisition direction is upward, to acquire first calibration
Mark.
6. a kind of method of wafer bonding, it is characterised in that applied to the equipment as described in any in claim 1-7;The side
Method the following steps are included:
Step S1, by being moved between a pair of of described image acquisition device for the described first fixed device level;
Step S2 adjusts the position of a pair of of described image acquisition device, collects a pair of of described image acquisition device clearly
First calibration marker, and lock the position of a pair of of described image acquisition device;
Step S3, the reference mark acquisition device acquire the reference mark for the first time, and record described first fixes dress at this time
The real time position set is as the reference coordinates;
Step S4 leaves the described first fixed device between a pair of of described image acquisition device, and described second is fixed and is filled
It sets and is moved between a pair of of described image acquisition device;
Step S5 adjusts the position of the described second fixed device and/or the rotating device, makes a pair of of described image acquisition device
Clearly collect second calibration marker;
Step S6 leaves the described second fixed device between a pair of of described image acquisition device, and described first is fixed and is filled
It sets and is moved between a pair of of described image acquisition device;
Step S7, the reference mark acquisition device acquire the reference mark for the second time, and record described first fixes dress at this time
The real time position set is as the reference coordinates;
The reference coordinates of the reference coordinates of first time acquisition and second of acquisition are compared, and counted by step S8
Calculation obtains a difference offset, adjusts second wafer according to the difference offset;
Described second fixed device is moved to a bonding position, by first wafer and the second wafer key by step S9
It closes.
7. according to the method described in claim 6, it is characterized in that, the step S1 includes:
Step S11, the described first fixed device and the second fixed device are moved to corresponding one respectively at horizontal direction and pass
Send position;
First wafer and second wafer are respectively sent to the described first fixed device and described second by step S12
Fixed device;
Step S13, described first it is fixed be installed on horizontal direction and be moved to a pair of of level set so that first wafer is moved to
Between a pair of of described image acquisition device.
8. according to the method described in claim 6, it is characterized in that, the step S4 includes:
Step S41, the described second fixed horizontal direction that is installed on are moved to corresponding alignment position, and the described second fixed device
A home vertically;
Step S42, second fixation are installed on vertical direction and rise to a contact position.
9. according to the method described in claim 6, it is characterized in that, the step S5 includes:
Step S51 adjusts the position of the rotating device, until second calibration marker appears in described image acquisition device
The visual field in, stopping rotating the rotating device and locks the rotating device;
Step S52 adjusts the described second fixed position for being installed on vertical direction, until described image acquisition device can be clear
Collect second calibration marker, the position of record the described second fixed device at this time is as the bonding position.
10. according to the method described in claim 6, it is characterized in that, adjusting institute according to the difference offset in step S8
The position of rotating device is stated, to calibrate position of second wafer relative to first wafer.
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CN110854052A (en) * | 2019-10-11 | 2020-02-28 | 长江存储科技有限责任公司 | Parallelism calibration method and device and computer storage medium |
CN110955120A (en) * | 2019-12-16 | 2020-04-03 | 武汉新芯集成电路制造有限公司 | Method and device for determining precompensation value |
CN112768393A (en) * | 2021-02-02 | 2021-05-07 | 沈阳芯源微电子设备股份有限公司 | Calibration device, alignment system and alignment method |
CN115799140A (en) * | 2022-07-20 | 2023-03-14 | 拓荆键科(海宁)半导体设备有限公司 | Calibration method and device, combined microscope and wafer bonding method |
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