USRE47780E1 - Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus - Google Patents

Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus Download PDF

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USRE47780E1
USRE47780E1 US15/651,187 US201215651187A USRE47780E US RE47780 E1 USRE47780 E1 US RE47780E1 US 201215651187 A US201215651187 A US 201215651187A US RE47780 E USRE47780 E US RE47780E
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substrate
light
emitting elements
semiconductor light
sealing member
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Kenji Sugiura
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0016—Processes relating to electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • the present invention relates to light-emitting apparatuses, backlight units, liquid crystal display apparatuses, and illumination apparatuses, and in particular, relates to a light-emitting apparatus using semiconductor light-emitting elements, for example.
  • LEDs light-emitting diodes
  • LEDs are high efficiency, space-saving light sources, and in recent years have been widely used as light sources in backlights for liquid crystal display apparatuses, such as liquid crystal display televisions, and as illumination sources in illumination apparatuses.
  • LEDs are unitized as light-emitting apparatuses (light-emitting modules) in backlight light sources and illumination light sources.
  • Patent Literature (PTL) 1 discloses a SMD type light-emitting apparatus which uses an edge-light type backlight unit.
  • FIG. 17A is a planar view of a conventional SMD type light-emitting apparatus.
  • FIG. 17B is a perspective view of a SMD type LED element used in a conventional SMD type light-emitting apparatus.
  • the conventional SMD type light-emitting apparatus 1000 includes a substrate 1010 and a plurality of SMD type LED elements 1100 mounted in a line on the substrate 1010 .
  • each SMD type LED element 1100 is a package type LED element and includes a cavity 1101 molded from, for example, resin, an LED 1020 mounted in the cavity 1101 , and a sealing member 1030 made of a phosphor-containing resin injected in the cavity 1101 to cover the LED 1020 .
  • the SMD type light-emitting apparatus appears grainy when lit up as a result of the areas between neighboring SMD type LED elements being non light-emitting regions. As such, with SMD type light-emitting apparatuses, there is a problem of irregular luminance and irregular chromaticity within the light-emitting apparatus (module). It should be noted that in the present invention, “grainy” refers to an appearance, and is a degree that a plurality of LED light sources lined up can be individually identified by visual inspection.
  • the present invention was conceived to solve the above-described problem and aims to provide a light-emitting apparatus and such which can reduce a grainy appearance and suppress luminance irregularity while also suppressing chromatic irregularity.
  • an aspect of the light-emitting apparatus includes: an elongated substrate; a plurality of semiconductor light-emitting elements arranged in a straight line on the substrate in a longitudinal direction of the substrate; and a sealing member that includes an optical wavelength converter and seals the semiconductor light-emitting elements, wherein the sealing member is formed in a straight line in a direction of arrangement of the semiconductor light-emitting elements and seals the semiconductor light-emitting elements collectively.
  • the line width of the sealing member can be made smaller, the light from the semiconductor light-emitting elements reflected at the interface of the sealing member and the airspace is allowed to pass between neighboring semiconductor light-emitting elements, even when the semiconductor light-emitting elements are spaced at a large pitch. This makes it possible to suppress a grainy appearance even more.
  • Wc Wc ⁇ Lc, where Lc is a length of each of the semiconductor light-emitting elements in the straight line direction and Wc is a length of each of the semiconductor light-emitting elements in a direction perpendicular to the straight line direction.
  • the sealing member is formed to have a substantially semicircular cross sectional shape, it is possible to suppress luminance and chromatic unevenness regardless of which angle the light-emitting apparatus (light source) is viewed from.
  • 0.9 ⁇ Hs 45 /Hs ⁇ 1.1 where Hs is a height of the sealing member and Hs 45 is a length of the sealing member measured from a center of a cross section of the sealing member at 45 degree angle.
  • Hs is a height of the sealing member
  • Hs 45 is a length of the sealing member measured from a center of a cross section of the sealing member at 45 degree angle.
  • 0.4 ⁇ Hs/Ws ⁇ 0.6 it is preferable that 0.4 ⁇ Hs/Ws ⁇ 0.6.
  • the sealing member is formed to have a semicircular cross sectional shape, it is possible to suppress luminance and chromatic unevenness regardless of which angle the light-emitting apparatus (light source) is viewed from.
  • the light-emitting apparatus further include two electrodes that are formed on the substrate and are for supplying power to the semiconductor light-emitting elements, wherein a first of the two electrodes is formed at a first end of the substrate in a longitudinal direction of the substrate, and a second of the two electrodes is formed at a second end of the substrate in the longitudinal direction of the substrate, and the two electrodes are formed laterally offset toward one longitudinal side of the substrate, based on the sealing member.
  • the sealing member be formed so that a straight line passing a center of a line width of the sealing member and a straight line passing a center of the substrate in a lateral direction of the substrate are different.
  • the sealing member be formed extending to both end edges of the substrate in the longitudinal direction of the substrate.
  • the semiconductor light-emitting elements be spaced at a uniform pitch, and two outermost semiconductor light-emitting elements among the semiconductor light-emitting elements be each positioned half the pitch length from a nearest one of the end edges of the substrate.
  • the semiconductor light-emitting elements be each bonded with a wire, at least a portion of each of the wires be sealed by the sealing member, and all of the wires sealed by the sealing member be provided in a same direction as a straight line direction of the sealing member.
  • the light-emitting apparatus further include a protective element for electrostatic protection of the semiconductor light-emitting elements, wherein the protective element is arranged in a straight line with the semiconductor light-emitting elements.
  • the protective element and all of the semiconductor light-emitting elements be spaced at a uniform pitch.
  • a contour of an end of the sealing member have a curvature.
  • the protective element and each of the semiconductor light-emitting elements be bonded with a wire, at least a portion of each of the wires be sealed by the sealing member, and all of the wires sealed by the sealing member be provided in a same direction as a straight line direction of the sealing member.
  • the light-emitting apparatus further include a first line and a second line that are electrically connected to the semiconductor light-emitting elements, wherein the first line and the second line each have a straight portion formed on the substrate in a straight line substantially parallel to the longitudinal direction of the substrate, and the sealing member is formed between the straight portion of the first line and the straight portion of the second line.
  • the straight portion of the first line and the straight portion of the second line be glass coated.
  • the optical wavelength converter be a phosphor that excites light emitted by the semiconductor light-emitting elements.
  • one aspect of the backlight unit according to the present invention includes the above-described light-emitting apparatus.
  • the backlight unit further include a plurality of the light-emitting apparatuses, wherein the light-emitting apparatuses are arranged so that the substrates of the light-emitting apparatuses abut each other.
  • one aspect of the liquid crystal display apparatus includes the above-described backlight unit and a liquid crystal display panel positioned in a path of light emitted from the backlight unit.
  • one aspect of the illumination apparatus according to the present invention includes the above-described light-emitting apparatus.
  • the illumination apparatus further include a plurality of the light-emitting apparatuses, wherein the light-emitting apparatuses are arranged so that the substrates of the light-emitting apparatuses are abutting each other.
  • FIG. 1 is a birds-eye view of the light-emitting apparatus according to the first embodiment of the present invention.
  • FIG. 2 is a planar view of the light-emitting apparatus according to the first embodiment of the present invention
  • (b) in FIG. 2 is a cross section along the line X-X′ in (a)
  • (c) in FIG. 2 is a cross section along the line Y-Y′ in (a).
  • FIG. 3 is an enlarged planar view of the light-emitting apparatus according to the first embodiment of the present invention.
  • FIG. 4A shows the luminance characteristics of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD).
  • FIG. 4B shows the chromatic characteristics (ax) of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD).
  • FIG. 5 is an enlarged planar view of a portion of the light-emitting apparatus according to the first embodiment of the present invention, and (b) in FIG. 5 is an enlarged cross sectional view of the same light-emitting apparatus.
  • FIG. 6 shows a plurality of the light-emitting apparatuses according to the first embodiment of the present invention lined up.
  • FIG. 7 is an enlarged planar view of the connecting portion of the light-emitting apparatuses according to the first embodiment of the present invention lined up in a row, and (b) in FIG. 7 is a side view thereof.
  • FIG. 8A is a planar view for illustrating the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention.
  • FIG. 8B is a side view (a side view of FIG. 8A ) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention.
  • FIG. 8C is a cross section (a cross section of FIG. 8A ) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention.
  • FIG. 9 is a planar view of the light-emitting apparatus according to the second embodiment of the present invention
  • (b) in FIG. 9 is a cross section along the line X-X′ in (a)
  • (c) in FIG. 9 is a cross section along the line Y-Y′ in (a).
  • FIG. 10 shows the circuitry configuration of the light-emitting apparatus according to the second embodiment of the present invention.
  • FIG. 11 shows the line pattern on the light-emitting apparatus according to the second embodiment of the present invention.
  • FIG. 12A is a planar view for illustrating the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention.
  • FIG. 12B is a side view (a side view of FIG. 12A ) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention.
  • FIG. 12C is a cross section (a cross section of FIG. 12A ) for illustrating the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention.
  • FIG. 13 is an exploded perspective view of the backlight unit according to the third embodiment of the present invention.
  • FIG. 14 is a cross section of the liquid crystal display apparatus according to the fourth embodiment of the present invention.
  • FIG. 15 is a perspective view of the illumination apparatus according to the fifth embodiment of the present invention with a portion thereof cut out.
  • FIG. 16 is a birds-eye view of the illumination apparatus according to the sixth embodiment of the present invention.
  • FIG. 17A is a planar view of a conventional SMD type light-emitting apparatus.
  • FIG. 17B is a perspective view of a SMD type LED element used in a conventional SMD type light-emitting apparatus.
  • the x, y, and z axes are mutually orthogonal, and in each of the embodiments, the x axis direction is the lengthwise direction of the substrate, the y axis direction a direction orthogonal to the x axis, and the z axis direction is a direction orthogonal to both the x axis and they axis. It should be noted that the dimensions and such in the drawings are not strictly accurate.
  • FIG. 1 is a birds-eye view of the light-emitting apparatus according to the first embodiment of the present invention.
  • the light-emitting apparatus 100 is a line-shaped light source which emits light in the shape of a line, and includes a light-emitting unit 110 formed in a line shape on a substrate 10 which emits a predetermined light.
  • the light-emitting unit 110 is made up of a plurality of LED chips arranged in a line (one dimension) and a sealing member including a phosphor.
  • the light-emitting apparatus 100 is a COB (chip on board) type light-emitting apparatus in which the LED chips (bare chips) mounted directly on the substrate 10 as sealed with a phosphor-containing resin.
  • COB chip on board
  • FIG. 2 is a planar view of the light-emitting apparatus according to the first embodiment of the present invention. Moreover, (b) in FIG. 2 shows a cross section (substrate longitudinal direction cross section) of the light-emitting apparatus according to the first embodiment of the present invention along the line X-X′, and (c) in FIG. 2 shows a cross section (substrate lateral direction cross section) of the light-emitting apparatus according to the first embodiment of the present invention along the line Y-Y′.
  • the light-emitting apparatus 100 is a LED module (light-emitting module) of a plurality of modularized LED chips, and includes a substrate 10 , a plurality of LEDs 20 , a sealing member 30 , a line 40 , a protective element 50 , a first electrode 61 , a second electrode 62 , and wiring 70 .
  • a LED module light-emitting module
  • the substrate 10 includes a substrate 10 , a plurality of LEDs 20 , a sealing member 30 , a line 40 , a protective element 50 , a first electrode 61 , a second electrode 62 , and wiring 70 .
  • the substrate 10 is an elongated rectangular substrate for mounting the LEDs 20 .
  • the aspect ratio L1/L2 of the elongated substrate 10 preferably satisfies 10 ⁇ L1/L2, where L1 is the length of the substrate 10 in the longitudinal direction (lengthwise direction) (longitudinal length) and L2 is the length of the substrate 10 in the lateral direction (lateral length).
  • a ceramic substrate made from alumina or a translucent aluminum nitride, an aluminum substrate made from aluminum alloy, a transparent glass substrate, or a flexible substrate (FPC) made from resin may be used as the substrate 10 .
  • a metal based substrate such as an aluminum substrate
  • an insulating film made from an organic material such as polyimide
  • a white resist material may be formed on the substrate 10 .
  • a ceramic substrate made from alumina having a rectangular shape is used as the substrate 10 , where L1 is 140 mm, L2 is 5.5 mm, and the thickness thereof is 1.0 mm. Moreover, it is possible to increase L1 to 280 mm and use an even further elongated substrate.
  • the plurality of LEDs 20 are an example of the semiconductor light-emitting elements, and are mounted directly on the substrate 10 .
  • the plurality of LEDs 20 are arranged in a single line (in a straight line shape) along the longitudinal direction of the substrate 10 . It should be noted that in the first embodiment, 24 LEDs 20 are arranged in a single line.
  • a bare chip which emits monochromatic visible light can be used for each of the LED 20 s, and the LED 20 s can be die-bonded to the substrate 10 with a die attaching material (die bonding material).
  • a blue LED chip which emits blue light may be used for each of the LED 20 s, for example.
  • a gallium nitride semiconductor light-emitting element formed from InGaN material, for example, and having a central wavelength of 440 nm to 470 nm, can be used as the blue LED chip. It should be noted that in the first embodiment, a square blue LED chip with a side length of 346 ⁇ m is used as the LED 20 , but a rectangular LED chip can be used.
  • the 24 LEDs 20 are spaced at a uniform pitch so that the distance between neighboring LEDs 20 is uniform throughout.
  • the two outermost LEDs 20 among the LEDs 20 arranged in line are each positioned half the pitch length of the LEDs 20 from the nearest lateral side edge of the substrate 10 .
  • the distance between the first LED 20 in the line and the nearest lateral side edge of the substrate and the distance between the last LED 20 in the line and the nearest lateral side edge of the substrate is half the pitch of the LEDs 20 (1 ⁇ 2 pitch).
  • the pitch of the LEDs 20 is 5.85 mm.
  • the sealing member 30 is a phosphor-containing resin which contains a phosphor that is an optical wavelength converter, and converts the wavelength of the light from the LEDs 20 while sealing and protecting all of the LEDs 20 on the substrate 10 collectively
  • the sealing member 30 is formed on the substrate 10 in a straight line along the direction of arrangement of the LEDs 20 .
  • the straight line (stripe) sealing member 30 is formed so that a straight line running in the straight line direction (stripe direction) through the center of the line width (stripe width) of the sealing member 30 and a straight line running through the center of the substrate in the lateral direction (a line that connects the center of the two opposing lateral sides) are different. More specifically, as (a) in FIG. 2 shows, the sealing member 30 is formed laterally offset from a straight line running through the center of the lateral direction of the substrate 10 , toward one longitudinal side of the substrate 10 .
  • the sealing member 30 extends to the vicinity of both end edges of the substrate 10 in the longitudinal direction.
  • the sealing member 30 is formed continuously from one end surface of the lateral side of the substrate 10 to another end surface of the opposite lateral side of the substrate 10 (see FIG. 1 ).
  • the sealing member 30 when blue LEDs are used for the LEDs 20 , a phosphor-containing resin that is a silicon resin dispersed with yttrium aluminum garnet (YAG) yellow phosphor particles may be used as the sealing member 30 in order to achieve a white light.
  • the sealing member 30 is formed to have a straight line direction length of 140 mm, a line width of 1.5 mm, and a center maximum height of 0.6 mm.
  • blue LED chips are used as the LEDs 20
  • a phosphor-containing resin containing yellow phosphor particles is used as the sealing member 30 .
  • the line 40 is a conductive member and is patterned in a predetermined shape for electrically connecting each of the LEDs 20 . Furthermore, the line 40 is patterned in a predetermined shape for electrically connecting the LEDs 20 and the protective element 50 . It should be noted that the line 40 is electrically connected to the first electrode 61 and the second electrode 62 .
  • the line 40 is formed to connect all of the LEDs 20 in series.
  • a metal line such as a tungsten (W) or copper (Cu) line having a surface plated with gold (Au), for example, can be used as the line 40 .
  • the protective element 50 is an electrostatic protection element for electrostatic protection of the LEDs 20 .
  • One or more of the protective elements 50 are mounted on the substrate 10 .
  • the protective element 50 prevents the LEDs 20 , which have a low reverse breakdown voltage, from being destroyed by static electricity of an opposite polarity which generates on the substrate 10 .
  • the protective element 50 is provided connected in parallel, in a polarity opposite that of the LEDs 20 .
  • a zener diode for example, is used as the protective element 50 , and in the first embodiment, one zener diode is provided on the substrate 10 .
  • the first electrode 61 and the second electrode 62 are electrode terminals (power feeding units) for connection to a power source external to the light-emitting apparatus 100 , and are electrically connected to the line 40 . Power is supplied to each LED 20 via the line 40 and the wiring 70 as a result of power being supplied from the external power source to the first electrode 61 and the second electrode 62 .
  • a DC power source to the first electrode 61 and the second electrode 62 .
  • the first electrode 61 and the second electrode 62 are made of gold (Au).
  • the first electrode 61 and the second electrode 62 are positioned opposite each other at both lateral sides.
  • the first electrode 61 is formed at one end of the substrate 10 in the longitudinal direction (one lateral side end)
  • the second electrode 62 is formed at the other end of the substrate 10 in the longitudinal direction (the other lateral side end).
  • first electrode 61 and the second electrode 62 are formed laterally offset toward one longitudinal side of the substrate 10 based on the sealing member 30 .
  • first electrode 61 and the sealing member 30 are formed aligned in the lateral direction of the substrate 10
  • the second electrode 62 is formed, based on the sealing member 30 , toward a side of the sealing member 30 on which the first electrode 61 is formed.
  • the wiring 70 is electrical wiring for electrically connecting the LEDs 20 and the line 40 , and is, for example, gold wiring.
  • a p-side electrode and an n-side electrode are formed on the chip of each LED 20 for supplying current, and the p-side electrode and the n-side electrode are wire-bonded to the line 40 by the wiring 70 .
  • the entirety of the wiring 70 is embedded in the sealing member 30 , but when the size of the sealing member 30 is reduced to improve light extraction efficiency, there are cases when a portion of the wiring 70 is exposed from the sealing member 30 . As such, at least a portion of the wiring 70 is sealed by the sealing member 30 .
  • all of the wiring 70 sealed by the sealing member 30 is provided in a same direction as the straight line direction of the sealing member 30 .
  • all of the wiring 70 connected to the LEDs 20 is provided positioned in a straight line in a planar view.
  • FIG. 3 is an enlarged planar view of the light-emitting apparatus according to the first embodiment of the present invention.
  • the light-emitting apparatus 100 includes a sealing member 30 (phosphor-containing resin) which seals the LEDs 20 collectively and is formed in a straight line along the direction of arrangement of the LEDs 20 .
  • a sealing member 30 phosphor-containing resin
  • the sealing member 30 is present between neighboring LEDs 20 as well, which eliminates non light-emitting regions between neighboring LEDs 20 .
  • FIG. 3 shows, since a portion of the light emitted from the LEDs 20 is reflected at the interface of the sealing member 30 and airspace in the direction of the line width of the sealing member 30 and continues in the sealing member 30 , it is possible to increase light in the straight line direction of the sealing member 30 (the longitudinal direction of the substrate 10 ). As such, regions between neighboring LEDs 20 can be made light-emitting regions, thereby eliminating a grainy appearance, and making it possible to achieve the advantageous effect of suppressing luminance irregularity.
  • Ls is the length of the sealing member 30 in the straight line direction (length in the longitudinal direction of the substrate 10 in the sealing member 30 ) and Ws is the line width of the sealing member 30 (length of the substrate 10 in the lateral direction in the sealing member 30 )
  • Ls and Ws are appropriately set in accordance with the desired size and shape of the light-emitting apparatus, but it is preferable that 10 ⁇ Ls/Ws. It is even more preferable that 30 ⁇ Ls/Ws.
  • the sealing member 30 is formed in a straight line, a large line width and/or a large LED pitch results in a grainy appearance.
  • the straight line shape of the sealing member 30 is preferably 1.0 mm ⁇ P ⁇ 3.0 mm. This makes it possible to improve luminance uniformity between pitches of the LEDs 20 .
  • the sealing member 30 which covers the LEDs 20 in whole is formed in a straight line in the direction of arrangement of the LEDs 20 , the sealing member 30 is continuous within the module. This provides the advantageous effect that it is possible suppress difference in chromaticity in the module due to internal diffusion. In particular, it is possible to suppress chromatic unevenness in the center, which serves the most function in emitting light.
  • the light-emitting apparatus 100 With the light-emitting apparatus 100 according to the first embodiment of the present invention, it is possible to reduce a grainy appearance and suppress luminance unevenness (irregularity) while suppressing chromatic unevenness (irregularity).
  • FIG. 4A shows the luminance characteristics of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD).
  • FIG. 4B shows the chromatic characteristics ( ⁇ x) of the light-emitting apparatus according to the first embodiment of the present invention (COB) and a conventional light-emitting apparatus (SMD). It should be noted that in FIG. 4A and FIG.
  • the characteristics shown in (a1) and (b1), the characteristics shown in (a2) and (b2), and the characteristics shown in (a3) and (b3) are results of measurements taken in the direction A, direction B, and direction C. Moreover, in these tests, the LED chips used in the light-emitting apparatus according to the first embodiment (COB) and the conventional light-emitting apparatus (SMD) are substantially the same.
  • FIG. 4A shows, in the light-emitting apparatus according to the first embodiment (COB), luminance irregularity in each of the directions A, B, and C is low, and compared to the conventional light-emitting apparatus (SMD), luminance irregularity is suppressed.
  • COB light-emitting apparatus according to the first embodiment
  • SMD conventional light-emitting apparatus
  • the conventional light-emitting apparatus SMD
  • luminance irregularity of light emitted from the side walls increases since mounting the LEDs (SMDs) at an angle or singularity irregularity causes unevenness in wall surface thickness of the cavity unit, but with the light-emitting apparatus according to the first embodiment (COB), luminance of the light emitted from the side walls is even, not irregular.
  • the light-emitting apparatus according to the first embodiment COB is capable of reducing a grainy appearance in angles at which the light-emitting apparatus (light source) is viewed.
  • FIG. 4B shows, in the light-emitting apparatus according to the first embodiment (COB), difference in chromaticity in each of the directions A, B, and C is low, and compared to the conventional light-emitting apparatus (SMD), chromatic irregularity is suppressed.
  • COB light-emitting apparatus according to the first embodiment
  • SMD conventional light-emitting apparatus
  • FIG. 5 is an enlarged planar view of a portion of the light-emitting apparatus according to the first embodiment of the present invention, and (b) in FIG. 5 is an enlarged cross sectional view of the same light-emitting apparatus.
  • Wc Ws ⁇ Ws/4, where Ws is the length of the sealing member 30 in they axis direction of the substrate 10 .
  • the distance from center to center of the chips of neighboring LEDs 20 be 6 mm or less. Additionally, the distance between the edges of the chips of neighboring LED 20 s is preferably 5.5 mm or less.
  • 0.9 ⁇ Hs 45 /Hs ⁇ 1.1 where Ws is the line width of the sealing member 30 , Hs is the height of the sealing member 30 , and Hs 45 is the length (thickness) of the sealing member 30 from the center of the sealing member 30 in a yz cross section of the sealing member 30 measured at 45 degree angle, as (b) in FIG. 5 shows.
  • 0.4 ⁇ Hs/Ws ⁇ 0.6 since the sealing member 30 can be formed to have a substantially semicircular cross sectional shape, it is possible to suppress luminance and chromatic unevenness regardless of which angle the light-emitting apparatus 100 (light source) is viewed from.
  • the sealing member 30 is formed in a straight line relative to the LEDs 20 arranged in a straight line.
  • the state of the sealing member 30 formed to encompass the LEDs 20 is balanced since the configuration centered around any given one of the LEDs 20 is the same throughout.
  • the unevenness would be cyclic, and would not stand out, meaning it is possible to achieve a steady emission of light.
  • the sealing member in a single module is formed discontinuously, when the modules are used lined up in a row, difference in chromaticity arises between the modules, and chromatic unevenness arises in the side wall direction.
  • the first electrode 61 and the second electrode 62 are formed laterally offset toward one longitudinal side of the substrate 10 based on the sealing member 30 .
  • the first electrode 61 and the second electrode 62 are formed laterally offset toward one longitudinal side of the substrate 10 based on the sealing member 30 .
  • all of the wiring 70 sealed by the sealing member 30 is provided in a same direction as the straight line direction of the sealing member 30 . With this, it is possible to form the sealing member 30 to have a stable shape.
  • the sealing member 30 when forming the sealing member 30 , when the sealing member material is applied, the sealing member material is pulled in the line direction of the wiring 70 .
  • the line direction of the wiring 70 is different from the straight line direction of the sealing member 30 , there are cases when the sealing member 30 cannot be made in the preferable straight line shape (stripe shape).
  • the sealing member 30 have different line widths, meaning the line width is not constant throughout.
  • the sealing member material is only pulled in the straight line direction in the application of the sealing member material. With this, it is possible to easily form the sealing member 30 having a uniform line width.
  • the light-emitting apparatus 100 according to the first embodiment is very useful when extremely long light source is required, such as in roughly 1200 mm long straight tube LED lamps.
  • the sealing member 30 is formed all the way to both edges of the substrate 10 in the longitudinal direction, as the light-emitting unit 110 in the previously described FIG. 1 shows.
  • the sealing members 30 of neighboring light-emitting apparatuses 100 can be connected seamlessly.
  • a line-shaped light source configured of a plurality of the light-emitting units connected together can be realized, it is possible to realize a line-shaped light source greater than 1000 mm.
  • the method of connecting the plurality of light-emitting apparatuses 100 is not particularly limited.
  • possible methods include: a method of preparing a plurality of light-emitting apparatuses 100 provided with fitting locations at the ends of the substrate as connecting units and fixing the substrates with fasteners while the fitting locations are overlapping, for example; a method of laying lines in a region in which the sealing member 30 is not formed from among substrates of neighboring light-emitting apparatuses 100 and connecting them together with a line bridge structure; or a method of preparing a single elongated board shaped member and adhering or fastening thereon a plurality of the light-emitting apparatuses 100 to form one line-shaped light source.
  • the method of connecting a plurality of the light-emitting apparatuses 100 is not particularly limited, and may be any method which allows for the mechanical and electrical connection between the plurality of light-emitting apparatuses, and for example, when a line having the same thickness as the sealing member is used to fix the light-emitting apparatuses, there is concern that a shadowed area will develop as a result of the line and reduce the line-shaped light source properties. For this reason, when a plurality of the light-emitting apparatuses 100 are connected, it is preferable to use a method which connects them without forming a shadowed area in the connection portion.
  • this includes a method of mechanically connecting the light-emitting apparatuses 100 together using a wire substantially thinner (for example, 0.5 mm or less) than the width of the lateral direction of the sealing member, a method of forming the end portions of the light-emitting apparatuses 100 so that the end portions of the substrates of neighboring light-emitting apparatuses 100 overlap, and riveting the overlapping end portions thereof, and a method of fixing the substrates of the light-emitting apparatuses 100 lined up together with latches such as clips.
  • a wire substantially thinner for example, 0.5 mm or less
  • the sealing member 30 is formed only in a single straight line without any bends.
  • chromatic unevenness arise in this area, but by forming the sealing member 30 into a single straight line, it is possible to suppress such chromatic unevenness.
  • the sealing member is configured in a plurality of lines, re-excitation occurs between neighboring lines and chromatic irregularities develop, multiple coating processes are required to form the sealing member and difference in chromaticity develops in the module, but by forming the sealing member 30 only in a single line, it is possible to suppress the development of such chromatic irregularities and difference in chromaticity.
  • FIG. 6 shows (a portion of) a plurality of the light-emitting apparatuses according to the first embodiment of the present invention lined up. It should be noted that in FIG. 6 , light-emitting apparatuses 100 A and 100 B have the same configuration as the light-emitting apparatus 100 according to the first embodiment of the present invention.
  • the plurality of light-emitting apparatuses are arranged to connect together in a lengthwise direction.
  • the light-emitting apparatuses 100 A and 100 B are arranged connected together in the lengthwise direction of the light-emitting apparatuses 100 A and 100 B.
  • a lateral side of a substrate 10 A of the light-emitting apparatus 100 A and a lateral side of a substrate 10 B of the light-emitting apparatus 100 B are arranged facing each other and connected to each other.
  • a first electrode 61 A of the light-emitting apparatus 100 A which is a first one of the light-emitting apparatuses
  • a second electrode 62 B of the light-emitting apparatus 100 B which is a second one of the light-emitting apparatuses
  • the first electrode 61 A ( 61 B) and the second electrode 62 A ( 62 B) are formed laterally offset toward one longitudinal side of the substrate 10 A ( 10 B) based on the sealing member 30 A ( 30 B).
  • the first electrode 61 A of the light-emitting apparatus 100 A and the second electrode 62 B of the light-emitting apparatus 100 B are next to each other on the same side, the first electrode 61 A and the second electrode 62 B can easily be connected together with a desired conductive member.
  • the positional relationship of the first electrode and the second electrode will not change even if the substrate is rotated 180 degrees. In other words, the directionality of the substrate cannot be identified by the first electrode and the second electrode alone.
  • one of the first electrode and the second electrode is the positive electrode and the other is the negative electrode, so when the light-emitting apparatuses are aligned in a row, there are times when the alignment of the negative electrodes and the positive electrodes is off.
  • the positional relationship between the first electrode 61 A (first electrode 61 B) and the second electrode 62 A (second electrode 62 B) changes when the substrate is rotated 180 degrees.
  • the sealing member 30 A ( 30 B) is formed reaching both edges of the substrate 10 A ( 10 B).
  • the sealing member 30 A and the sealing member 30 B are continuously connected without break in the location where the light-emitting apparatus 100 A and the light-emitting apparatus 100 B are connected together.
  • a non light-emitting region is eliminated in the connecting region of the light-emitting apparatus 100 A and the light-emitting apparatus 100 B, it is possible to suppress illuminance and chromatic unevenness which appears when a non light-emitting region exists between light-emitting apparatuses.
  • the distance between the first or last LED in the row and the substrate 10 A ( 10 B) is half the length of the pitch (1 ⁇ 2 pitch) of the LEDs in the light-emitting apparatus 100 A (the LEDs in the light-emitting apparatus 100 B).
  • the distance between the LED on the light-emitting apparatus 100 A closest to the light-emitting apparatus 100 B and the LED on the light-emitting apparatus 100 B closest to the light-emitting apparatus 100 A is the same as the pitch between the LEDs. Accordingly, it is possible to make the pitch uniform between all LEDs on all light-emitting apparatuses including the light-emitting apparatus 100 A and the light-emitting apparatus 100 B. This makes it possible to further suppress illuminance and chromatic unevenness between the light-emitting apparatuses.
  • FIG. 7 is an enlarged planar view of the connecting portion of the light-emitting apparatuses according to the first embodiment of the present invention lined up in a row, and (b) in FIG. 7 is a side view thereof. It should be noted that the arrows in FIG. 7 indicate the direction in which the light radiated from the end portions of the sealing member travels.
  • the contour of the end of each sealing member has a curvature, which facilitates light emission in a diagonal direction. With this, it is possible to suppress a break in light when viewing the connecting portion of the light-emitting apparatus 100 A and 100 B, and possible to make the connection point of the light-emitting apparatus 100 A and light-emitting apparatus 100 B appear less visible.
  • the contour of the end of each sealing member has a curvature, which facilitates light emission in an upward, diagonal direction. With this, it is possible to suppress a break in light when viewing the connecting portion of the light-emitting apparatus 100 A and 100 B, and possible to make the connection point of the light-emitting apparatus 100 A and light-emitting apparatus 100 B appear less visible.
  • the sealing members may be formed using a dispenser in order to provide each of the ends of the sealing members with a contour having a curvature like described above.
  • a dispenser may be used to deposit the resin material for the sealing member in a straight line in order to easily give the edges of the sealing members a contour having a curvature.
  • FIG. 8A through FIG. 8C illustrate the forming method of the sealing member in the light-emitting apparatus according to the first embodiment of the present invention, where FIG. 8A is a planar view, FIG. 8B is a side view, and FIG. 8C is a cross sectional view.
  • the sealing member 30 can be applied using a dispenser.
  • a discharge nozzle 600 of the dispenser is positioned facing a given position on the substrate 10 and is driven to move in the longitudinal direction of the substrate 10 while dispensing the sealing member material (phosphor-containing resin). At this time, the sealing member material is dispensed to cover the LEDs 20 , the line 40 , and the wiring 70 .
  • the sealing member material is applied in a single application operation from one lateral side end of the substrate 10 to the other lateral side end.
  • the sealing member material is applied, the sealing member material is hardened according to a given method. With this, it is possible to form the sealing member 30 to have a given shape.
  • FIG. 9 is a planar view of the light-emitting apparatus according to the second embodiment of the present invention. Moreover, (b) in FIG. 9 shows a cross section (substrate longitudinal direction cross section) of the light-emitting apparatus according to the second embodiment of the present invention along the line X-X′, and (c) in FIG. 9 shows a cross section (substrate lateral direction cross section) of the light-emitting apparatus according to the second embodiment of the present invention along the line Y-Y′.
  • the basic structure of the light-emitting apparatus 200 according to the second embodiment of the present invention is the same as the light-emitting apparatus 100 according to the first embodiment of the present invention.
  • the line pattern and positioning of the protective element in the light-emitting apparatus 200 according to the second embodiment is different from the light-emitting apparatus 100 according to the first embodiment of the present invention. All other structures are basically the same. Accordingly, in FIG. 9 , structural elements that are the same as the structural elements shown in FIG. 2 share the same reference numbers. Additionally, detailed description thereof will be omitted.
  • the light-emitting apparatus 200 according to the second embodiment of the present invention additionally includes a first line 41 and a second line 42 .
  • the first line 41 and the second line 42 are electrically connected to the plurality of LEDs 20 and the protective element 50 , and are patterned into a given shape on the substrate 10 .
  • the line 40 is a line for connecting the LEDs in series, and similar to the first embodiment, is patterned to connect a plurality of the LEDs 20 (3 LEDs 20 in the second embodiment) in series.
  • the first line 41 and the second line 42 are lines for connecting LEDs in parallel, and are patterned to connect, in parallel, the LEDs 20 connected in series by the line 40 .
  • the first line 41 and the second line 42 are patterned to also connect the LEDs 20 and the protective element 50 in parallel.
  • FIG. 10 shows the circuitry configuration of the light-emitting apparatus according to the second embodiment of the present invention.
  • the configuration of the circuitry for the LEDs 20 and the protective element 50 in the light-emitting apparatus 200 according to the second embodiment of the present invention is such that, as FIG. 10 shows, groups of three of the LEDs 20 connected in series are connected together in parallel, and the groups of three LEDs 20 connected in series are connected in parallel to the protective element 50 .
  • FIG. 11 shows the line pattern on the light-emitting apparatus according to the second embodiment of the present invention.
  • the first line 41 and the second line 42 include a straight portion 41 a and 42 a, respectively, which have a straight line shape and are the main lines running along the longitudinal direction of the substrate 10 .
  • the first line 41 includes an extending portion 41 b which extends from the straight portion 41 a toward the straight portion 42 a of the second line 42 , that is to say, extends in the lateral direction of the substrate 10 .
  • the second line 42 includes an extending portion 42 b which extends from the straight portion 42 a toward the straight portion 41 a of the first line 41 , that is to say, extends in the lateral direction of the substrate 10 .
  • the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 are formed to be substantially parallel to the longitudinal direction of the substrate 10 .
  • the line 40 patterned in a given shape is formed along the longitudinal direction of the substrate 10 between the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 .
  • the extending portion 41 b of the first line 41 and the extending portion 42 b of the second line 42 are formed to connect three of the LEDs 20 in series along with the line 40 , and also function as bonding pads.
  • regions on the substrate 10 excluding the first electrode 61 , the second electrode 62 , and the wire boding region are glass coated. Consequently, at least the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 are glass coated. It should be noted that in the second embodiment, a glass coat film having a film thickness of approximately 40 ⁇ m is deposited.
  • the sealing member 30 is formed between the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 . Since the distance (separation width) between the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 is approximately the same as the line width of the sealing member 30 , the sealing member 30 is formed by being applied along the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 . In this way, the first line 41 and the second line 42 are patterned on the substrate 10 so that the line width of the sealing member 30 is a predetermined width.
  • the LEDs 20 are positioned between each line 40 , between the line 40 and the extending portion 41 b, and between the line 40 and the extending portion 42 b.
  • the LEDs 20 , the line 40 , and the extending portion 41 b or the extending portion 42 b are bonded by the wiring 70 .
  • the protective element 50 is positioned between the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 , and positioned between the extending portion 41 b and the extending portion 42 b formed in the center of the substrate 10 .
  • the protective element 50 and the extending portion 41 b or the extending portion 42 b are bonded by the wiring 70 .
  • the protective element 50 is arranged in a straight line with the LEDs 20 .
  • the protective element 50 and all of the LEDs 20 are arranged in a single line. All of the wiring bonded to the protective element 50 and the LEDs 20 is provided in a same direction as the straight line direction of the sealing member 30 .
  • the light-emitting apparatus 200 is capable of achieving the same functionality as the first embodiment.
  • the protective element 50 is arranged in a single line along with the LEDs 20 , and the protective element 50 , along with the LEDs 20 , is sealed by the sealing member 30 collectively.
  • all of the wiring bonded to the protective element 50 and the LEDs 20 is provided in a same direction as the straight line direction of the sealing member 30 .
  • these elements including the protective element 50 and all of the LEDs 20 , are spaced at the same pitch.
  • FIG. 12A through FIG. 12C illustrate the forming method of the sealing member in the light-emitting apparatus according to the second embodiment of the present invention, where FIG. 12A is a planar view, FIG. 12B is a side view, and FIG. 12C is a cross sectional view.
  • the sealing member 30 can be applied using a dispenser in the second embodiment as well.
  • the discharge nozzle 600 of the dispenser is positioned facing a given position on the substrate 10 and is driven to move in the longitudinal direction of the substrate 10 while dispensing the sealing member material (phosphor-containing resin).
  • the sealing member material is applied in a single application operation from one lateral side end of the substrate 10 to the other lateral side end.
  • the sealing member material is applied on the region between the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 .
  • the lateral spread of the substrate 10 is restricted by the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 , and the sealing member material can be kept from overflowing beyond the straight portion 41 a and the straight portion 42 a.
  • the lateral spread of the sealing member material on the substrate 10 can be restricted by the straight portion 41 a and the straight portion 42 a, it is possible to easily form the sealing member 30 having a narrow line width. Consequently, even when the pitch between the LEDs 20 is large, it is possible to further suppress a grainy appearance.
  • the lateral spread of the sealing member material on the substrate 10 can be restricted by the straight portion 41 a and the straight portion 42 a, it is possible to easily form the sealing member 30 having a narrow line width even when the sealing member material is not very thixotropic and highly fluid. In this way, there is a wide selection of options for the sealing member material.
  • the straight portion 41 a of the first line 41 and the straight portion 42 a of the second line 42 are glass coated, but the coating is not limited thereto.
  • a plating process may be performed on the straight portion 41 a and the straight portion 42 a to form a plating layer thereon and thicken the straight portion 41 a and the straight portion 42 a.
  • FIG. 13 is an exploded perspective view of the backlight unit according to the third embodiment of the present invention.
  • the backlight unit 300 is an edge light type backlight unit with the light source positioned to the sides of the light guide plate, and includes a chassis 310 , a reflective sheet 320 , a light guide plate 330 , a light-emitting apparatus 340 , an optical sheet group 350 , and a front frame 360 .
  • the chassis 310 has a flat, box shape, and is formed by pressing a steel plate made from stainless steel, for example.
  • the chassis 310 has an opening 311 on the bottom surface, and a flange portion 312 is formed around the edge of the opening of the chassis 310 .
  • Fastener holes 313 are formed on the flange portion 312 for fastening to the front frame 360 .
  • the reflective sheet 320 is a sheet made from polyethylene terephthalate (PET), for example, and passes white light from the light-emitting apparatus 340 to the inside of the light guide plate 330 while reflecting the white light.
  • PET polyethylene terephthalate
  • the light guide plate 330 is a sheet made from polycarbonate (PC) or acryl, for example, and printed on the main surface (rear surface) thereof on the side facing the reflective sheet 320 and opposite the light exiting surface (front surface) thereof is a dot pattern, which includes lighting elements for diffusing light entering the light guide plate 330 and emitting the light from the light exiting surface.
  • Prism shapes or light scattering elements such as light scattering structures formed by being printed or applied on the rear surface of the light guide plate 330 , or light scatting elements formed inside the light guide plate 330 , for example, are used as the lighting elements.
  • the optical sheet group 350 is configured of a diffusion sheet 351 , a prism sheet 352 , and a polarized sheet 353 , all having the same size and the same planar shape (rectangular shape).
  • the diffusion sheet 351 is a film made from PET or a film made from PC, for example.
  • the prism sheet 352 is a sheet made from polyester, for example, and a restrictive prism pattern is formed from acryl resin on one side.
  • a film made from polyethylene naphthalate, for example, is used as the polarized sheet 353 .
  • the front frame 360 is fixed to the flange portion 312 of the chassis 310 by fastening fasteners 361 through the fastener holes 313 on the chassis 310 .
  • the front frame 360 holds the light guide plate 330 and the optical sheet group 350 to the chassis 310 .
  • the light-emitting apparatus 340 is the light-emitting apparatus according to the above-described first and second embodiments.
  • four of the light-emitting apparatuses are used, and each are equipped with a heat sink 370 .
  • the four light-emitting apparatuses are arranged such that the substrates of the light-emitting apparatuses are abutting each other, as FIG. 6 shows.
  • the light-emitting apparatuses 340 equipped with the heat sinks 370 are arranged so that the light exiting surfaces thereof face the side of the light guide plate 330 .
  • the heat sink 370 holds the light-emitting apparatus 340 and is aluminum drawn into an L shape (angle material), for example.
  • the heat sink 370 is fixed to the chassis 310 with a fastener, for example.
  • the backlight unit 300 according to the third embodiment of the present invention uses the light-emitting apparatus according to the first and second embodiments of the present invention, it is possible to realize a backlight unit having a highly uniform luminance wherein luminance irregularity is suppressed.
  • FIG. 14 is a cross section of the liquid crystal display apparatus according to the fourth embodiment of the present invention.
  • the liquid crystal display apparatus 400 is, for example, a liquid crystal television or liquid crystal monitor, and includes a liquid crystal display panel 410 , a backlight unit 420 positioned behind the liquid crystal display panel 410 , and a housing 430 which houses the liquid crystal display panel 410 and the backlight unit 420 .
  • the above-described backlight unit according to the third embodiment of the present invention is used as the backlight unit 420 .
  • the backlight unit 420 is equipped with a light-emitting apparatus 421 , which is a line-shaped light source.
  • the light-emitting apparatuses 100 and 200 according to the first and second embodiments of the present invention can be used as the light-emitting apparatus 421 .
  • the liquid crystal display apparatus 400 uses the backlight unit 420 in which chromatic and luminance irregularities are suppressed, it is possible to realize a high contrast, high luminance liquid crystal display apparatus with superior display properties.
  • FIG. 15 is a perspective view of the illumination apparatus according to the fifth embodiment of the present invention with a portion thereof cut out.
  • the illumination apparatus 500 according to the fifth embodiment of the present invention is an LED lamp provided with the light-emitting apparatus according to the first and second embodiments of the present invention, and as FIG. 15 shows, is comparable to a straight tube fluorescent lamp used for general purpose lighting.
  • the illumination apparatus 500 includes a straight tube 510 formed of an elongated glass tube, a light-emitting apparatus 520 located inside the straight tube 510 , a base 540 attached to both ends of the straight tube 510 and including a pair of base pins 530 , an adhesive (not pictured) for adhering (fixing) the light-emitting apparatus 520 fitted to the straight tube 510 , and light circuitry (not pictured) which receives power via the base 540 and causes the LED chips on the light-emitting apparatus 520 to emit light. It should be noted that the light circuitry may be provided in the lighting fixture external to the LED lamp.
  • the light-emitting apparatuses 100 and 200 according to the first and second embodiments of the present invention can be used as the light-emitting apparatus 520 .
  • a plurality of the light-emitting apparatuses 520 are used, and as FIG. 6 shows, are arranged such that the substrates of the light-emitting apparatuses abut each other.
  • the illumination apparatus 500 according to the fifth embodiment of the present invention uses the light-emitting apparatus according to the first and second embodiments of the present invention, it is possible to realize an illumination apparatus void of luminance irregularities.
  • FIG. 16 is a birds-eye view of the illumination apparatus according to the sixth embodiment of the present invention.
  • the sixth embodiment is an example of the light-emitting apparatus 100 according to the previously described first embodiment applied as an illumination light source for the illumination apparatus. It should be noted that the light-emitting apparatus 200 according to the second embodiment may also be applied to the sixth embodiment.
  • the illumination apparatus 1 is a base light and includes: the light-emitting apparatus 100 , a lighting fixture 2 , and a fixing member 3 for fixing the light-emitting apparatus 100 to the lighting fixture 2 .
  • the light-emitting apparatus 100 is directly mounted to both the fixing member 3 and the lighting fixture 2 .
  • the lighting fixture 2 is equipped with light circuitry and such for controlling the lighting of the light-emitting apparatus 100 . Moreover, the lighting fixture 2 includes fastener holes which correspond to the through-holes in the fixing member 3 . In other words, the positions of the through-holes in the fixing member 3 match with the positions of the fastener holes in the lighting fixture 2 .
  • the lighting fixture 2 can be shaped by press forming, for example, a sheet of aluminum or steel, and is directly mounted to a ceiling, for example.
  • the fixing member 3 is an elongated substrate.
  • an elongated metal based substrate such as an aluminum substrate can be used for the fixing member 3 .
  • the fixing member 3 is provided with a plurality of through-holes, and when the fixing member 3 and the lighting fixture 2 are to be fixed together, the through-holes of the fixing member 3 and the fastener holes of the lighting fixture 2 line up, fasteners 4 are placed in the through-holes, and the fasteners 4 , the through-holes, and the fastener holes are fastened together.
  • the through-holes are alternately provided on the longitudinal sides of the fixing member 3 .
  • FIG. 16 shows, it is possible to provide four through-holes on one longitudinal side of the fixing member 3 , and provide three through-holes on the other longitudinal side of the fixing member 3 in locations not directly across from the through-holes provided on the other side.
  • the fixing method of the fixing member 3 and the light-emitting apparatus 100 is not particularly limited to a single method.
  • the fixing member 3 and the light-emitting apparatus 100 may be fixed together with an adhesive, for example.
  • a transparent cover may be provided to cover the light-emitting apparatus 100 .
  • a plurality of the light-emitting apparatuses 100 may be provided in one illumination apparatus.
  • a plurality of the light-emitting apparatuses 100 may be fixed to one fixing member 3 , or one fixing member 3 to which one light-emitting apparatus 100 is fixed may be provided in plurality on the lighting fixture 2 .
  • the through-holes on the fixing member 3 are provided on both longitudinal sides of the substrate, but the through-holes may be provided on just one longitudinal side.
  • fastener holes are formed by providing through-holes in the fixing member 3 , but cut-out portions instead of throughholes may be provided as a structure for allowing the passage of the fasteners 4 .
  • cut-out portions instead of throughholes may be provided as a structure for allowing the passage of the fasteners 4 .
  • a standardized member may be used as the fixing member 3 .
  • the light-emitting apparatus 100 is fixed to the fixing member 3 , and this is attached to the lighting fixture 2 as a module, but the fixing member 3 itself may be used as the substrate 10 of the light-emitting apparatus 100 .
  • the substrate 10 of the light-emitting apparatus 100 may be configured to function as the fixing member 3 as well, and the light-emitting apparatus 100 may be directly attached to the lighting fixture 2 without the use of the fixing member 3 .
  • the substrate 10 of the light-emitting apparatus 100 may be provided with fastening through-holes or cut-outs for fixing with fasteners.
  • the light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus has been described based on the first through sixth exemplary embodiments, but the scope of the present invention is not limited thereto.
  • the present invention also includes embodiment variants conceived by those skilled in the art unless they depart from the spirit and scope of the present invention.
  • embodiments resulting from arbitrary combinations of constituent elements of different exemplary embodiments are intended to be included within the scope of the present invention as long as these do not depart from the essence of the present invention.
  • the light-emitting apparatus application to a backlight unit, liquid crystal display apparatus, or illumination apparatus is described, but application of the light-emitting apparatus is not limited to these examples.
  • Other applications include, for example, a lamp source in a photocopier, an emergency exit light, or a light in a billboard apparatus.
  • the light-emitting apparatus can also be used as a light source in industrial applications such as a line light source for inspection purposes.
  • each light-emitting apparatus is configured of blue light LEDs and yellow phosphors in order to radiate a white light, but this configuration is not limiting.
  • a phosphor-containing resin containing red phosphors or green phosphors may be used in conjunction with blue light LEDs to radiate a white light.
  • LEDs which emit a light other than blue light may be used.
  • the semiconductor light-emitting elements used in each light-emitting apparatus are LEDs, but the semiconductor light-emitting elements used may be semiconductor lasers, organic electro luminescence (EL) or inorganic EL light-emitting elements.
  • the present invention can be widely applied to light-emitting apparatuses using semiconductor light-emitting elements such as LEDs as a light source, backlight units, liquid crystal display apparatuses, illumination apparatuses such as straight tube fluorescent lamps, emergency exit lamps, or electronic devices such as photocopiers, or in industrial applications such as line light sources for inspection purposes.
  • semiconductor light-emitting elements such as LEDs as a light source, backlight units, liquid crystal display apparatuses, illumination apparatuses such as straight tube fluorescent lamps, emergency exit lamps, or electronic devices such as photocopiers, or in industrial applications such as line light sources for inspection purposes.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Liquid Crystal (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
US15/651,187 2011-04-20 2012-03-12 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus Active USRE47780E1 (en)

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PCT/JP2012/001698 WO2012144126A1 (ja) 2011-04-20 2012-03-12 発光装置、バックライトユニット、液晶表示装置及び照明装置
US15/651,187 USRE47780E1 (en) 2011-04-20 2012-03-12 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
US14/112,079 US9299743B2 (en) 2011-04-20 2012-03-12 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus

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