US20120251841A1 - Liquid radiation curable resins for additive fabrication comprising a triaryl sulfonium borate cationic photoinitiator - Google Patents

Liquid radiation curable resins for additive fabrication comprising a triaryl sulfonium borate cationic photoinitiator Download PDF

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Publication number
US20120251841A1
US20120251841A1 US13/515,664 US201013515664A US2012251841A1 US 20120251841 A1 US20120251841 A1 US 20120251841A1 US 201013515664 A US201013515664 A US 201013515664A US 2012251841 A1 US2012251841 A1 US 2012251841A1
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Prior art keywords
radiation curable
curable resin
liquid radiation
additive fabrication
pentafluorophenyl
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US13/515,664
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John Edmund Southwell
Jigeng Xu
Kangtai Ren
Ken Dake
Sam East
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DSM IP Assets BV
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DSM IP Assets BV
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Priority to US13/515,664 priority Critical patent/US20120251841A1/en
Publication of US20120251841A1 publication Critical patent/US20120251841A1/en
Assigned to DSM IP ASSETS B.V. reassignment DSM IP ASSETS B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EAST, SAM, SOUTHWELL, JOHN EDMUND, XU, JIGENG, DAKE, KEN, REN, KANGTAI
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245—Platforms or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
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    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
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    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/20—Post-treatment, e.g. curing, coating or polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C2033/0005—Moulds or cores; Details thereof or accessories therefor with transparent parts, e.g. permitting visual inspection of the interior of the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Definitions

  • the present invention relates to liquid radiation curable resins for additive fabrication processes.
  • Additive fabrication processes for producing three dimensional objects are known in the field. Additive fabrication processes utilize computer-aided design (CAD) data of an object to build three-dimensional parts. These three-dimensional parts may be formed from liquid resins, powders, or other materials.
  • CAD computer-aided design
  • SL stereolithography
  • CAD data of an object wherein the data is transformed into thin cross-sections of a three-dimensional object.
  • the data is loaded into a computer which controls a laser beam that traces the pattern of a cross section through a liquid radiation curable resin composition contained in a vat, solidifying a thin layer of the resin corresponding to the cross section.
  • the solidified layer is recoated with resin and the laser beam traces another cross section to harden another layer of resin on top of the previous layer.
  • the process is repeated layer by layer until the three-dimensional object is completed.
  • the three-dimensional object is, in general, not fully cured and therefore may be subjected to post-curing, if required.
  • An example of an SL process is described in U.S. Pat. No. 4,575,330.
  • lasers used in stereolithography There are several types of lasers used in stereolithography, ranging from 193 nm to 355 nm in wavelength.
  • the use of bulky and expensive gas lasers to cure liquid radiation curable resins is well known.
  • the delivery of laser energy in a stereolithography system can be Continuous Wave (CW) or Q-switched pulses.
  • CW lasers provide continuous laser energy and can be used in a high speed scanning process.
  • their output power is limited which reduces the amount of curing that occurs during object creation. As a result the finished object will need additional post process curing.
  • excess heat could be generated at the point of irradiation which may be detrimental to the resin.
  • the use of a laser requires scanning point by point on the resin which can be time-consuming.
  • LEDs are semiconductor devices which utilize the phenomenon of electroluminescence to generate light. LEDs consist of a semiconducting material doped with impurities to create a p-n junction capable of emitting light as positive holes join with negative electrons when voltage is applied. The wavelength of emitted light is determined by the materials used in the active region of the semiconductor. Typical materials used in semiconductors of LEDs include, for example, elements from Groups 13 (III) and 15 (V) of the periodic table. These semiconductors are referred to as III-V semiconductors and include, for example, GaAs, GaP, GaAsP, AlGaAs, InGaAsP, AlGaInP, and InGaN semiconductors. Other examples of semiconductors used in LEDs include compounds from Group 14 (IV-IV semiconductor) and Group 12-16 (II-VI). The choice of materials is based on multiple factors including desired wavelength of emission, performance parameters, and cost.
  • LEDs used gallium arsenide (GaAs) to emit infrared (IR) radiation and low intensity red light. Advances in materials science have led to the development of LEDs capable of emitting light with higher intensity and shorter wavelengths, including other colors of visible light and UV light. It is possible to create LEDs that emit light across a wide wavelength spectrum, for example, from a low of about 100 nm to a high of about 900 nm. Typically, LED UV light sources currently emit light at wavelengths between 300 and 475 nm, with 365 nm, 390 nm, and 395 nm being common peak spectral outputs. See textbook, “Light-Emitting Diodes” by E. Fred Schubert, 2 nd Edition, ⁇ E. Fred Schubert 2006, published by Cambridge University Press.
  • LED lamps for commercial curing applications. For example, Phoseon Technology, Summit UV, Honle UV America, Inc., IST Metz GmbH, Jenton International Ltd., Lumos Solutions Ltd., Solid UV Inc., Seoul Optodevice Co., Ltd., Spectronics Corporation, Luminus Devices Inc., and Clearstone Technologies, are some of the manufacturers offering LED lamps for curing ink-jet printing compositions, PVC floor coating compositions, metal coating compositions, plastic coating composition, and adhesive compositions.
  • LED curing devices are used in dental work.
  • An example of such a device is the ELIPARTM FreeLight 2 LED curing light from 3M ESPE. This device emits light in the visible region with a peak irradiance at 460 nm.
  • LED equipment is also being tested for use in the ink-jet printing, including, for example, by IST Metz. Although LED lamps are available, liquid radiation curable resins suitable for additive fabrication and curable by the use of LED light are not well known commercially.
  • U.S. Pat. No. 7,211,368 reportedly discloses a liquid stereolithography resin comprising a first urethane acrylate oligomer, a first acrylate monomer, a polymerization modifier, a second urethane acrylate oligomer different from the first urethane acrylate oligomer, and a stabilizer.
  • the first urethane acrylate oligomer is an aliphatic polyester urethane diacrylate oligomer
  • the first acrylate monomer is ethoxylated (3) trimethylolpropane acrylate
  • the polymerization modifier is selected from the group consisting of isobornyl acrylate, ethoxylated (5) pentaerythritol tetraacrylate, an aliphatic urethane acrylate, tris-(2-hydroxyethyl)isocyanurate triacrylate, and mixtures thereof.
  • the resin includes 5-35 weight % of an aliphatic polyester urethane diacrylate oligomer and 0.5-25 weight % ethoxylated (3) trimethylolpropane acrylate, wherein the resin includes 15-45 weight % ethoxylated (5) pentaerythritol tetraacrylate.
  • the '368 patent indicates that a laser is used to cure the resin. Further, the '368 patent fails to disclose the use of an acid generating photoinitiator, such as a cationic photoinitiator.
  • U.S. Pat. No. 6,927,018 and U.S. Patent Application Publication No. 2005/0227186 purportedly provide a method, article of manufacture and system for fabricating an article using photo-activatable building material.
  • the method according to the '018 patent and the '186 publication includes the steps of applying a layer of the photo-activatable building material to a preselected surface, scanning the layer using a plurality of light-emitting centers to photo-activate the layer of photo-activatable building material in accordance with a predetermined photo-initiation process to obtain polymerization of the building material.
  • Scanning is accomplished at a predetermined distance using a predetermined light intensity, and repeating the steps of applying the layer.
  • Each layer is applied to an immediately previous layer, and the layer is scanned with the plurality of light-emitting centers to polymerize the building material until the article is fabricated.
  • UV LEDs and laser diodes as suitable light-emitting centers, they fail to disclose detailed information on photo-activatable building material suitable for LED cure.
  • U.S. Pat. No. 7,270,528 purportedly discloses a flash curing system for solid freeform fabrication which generates a plurality of radiation emitting pulses that forms a planar flash.
  • the planar flash initiates curing of a curable material dispensed by a solid freeform fabrication apparatus.
  • the '528 patent while mentioning UV light-emitting diodes (LED) lamps in the specification, sets forth examples where a flash lamp is used to cure the resin composition.
  • the resin composition illustrated in the '528 patent does contain a cationically curable monomer or a cationic photoinitiator.
  • U.S. Patent Application Publication No. 2008/0231731 or 2008/0169589 or European Patent Application No. EP 1950032 purportedly discloses a solid imaging apparatus that includes a replaceable cartridge containing a source of build material and an extendable and retractable flexible transport film for transporting the build material layer-by-layer from the cartridge to the surface of a build in an image plane. If desired, the apparatus can produce a fully reacted build. A high intensity UV source is said to cure the build between layers.
  • the above publications state that the solid imaging radiation that is used to cure the build material can be “any actinic radiation which causes a photocurable liquid to react to produce a solid, whether a visible or UV source or other source,”
  • International Patent Publication No. WO 2008/118263 is directed to a system for building a three-dimensional object based on build data representing the three-dimensional object, wherein the system includes an extrusion head that deposits a radiation-curable material in consecutive layers at a high deposition rate. The radiation-curable material of each of the consecutive layers is cooled to a self-supporting state.
  • the system is said to include a radiation source that selectively exposes portions of the consecutive layers to radiation at a high resolution in accordance with the build data.
  • the exposure head includes a linear array of high resolution, UV light-emitting diodes (LEDs).
  • LEDs UV light-emitting diodes
  • P71-1464 CUREBARTM and P150-3072 PRINTHEADTM are described as examples of suitable UV-radiation sources for the exposure head.
  • the '263 publication fails to describe exemplary photocurable formulations suitable for curing by LED light in an additive fabrication process.
  • the invention in this PCT patent application relates to the use of LED curing in structural applications, in particular in applications for the lining or relining of objects, and to objects containing a cured resin composition obtained by LED curing.
  • This invention provides a simple, environmentally safe and readily controllable method for (re)lining pipes, tanks and vessels, especially for such pipes and equipment having a large diameter, in particular more than 15 cm.
  • the specification does not describe LED radiation curable photocurable resins.
  • U.S. Patent Application Publication No. 2007/0205528 reportedly discloses an optical molding process wherein the radiation source used is a non-coherent source of radiation.
  • the '528 publication indicates that the photocurable compositions are formulated so as to enable the production of three-dimensional articles having better performance when irradiated with conventional (non-coherent) UV rather than with Laser UV, and states that the photocurable compositions disclosed are more appropriate for UV non-coherent irradiation than for Laser UV.
  • the exposure system uses irradiation from non-coherent light sources, e.g., a xenon fusion lamp, or light emitting diode bars
  • the exemplified exposure was reportedly carried out according to the method of WO 00/21735, which is said to describe an apparatus and a method wherein the photosensitive material is exposed to a light source illuminating a cross-section of a material by at least two modulator arrangements of individually controllable light modulators.
  • U.S. Patent Application Publication No. 2009/0267269A or WO 2009/132245 reportedly discloses a continuous-wave (CW) ultraviolet (UV) curing system for solid freeform fabrication (SFF), wherein the curing system is configured to provide an exposure of UV radiation for one or more layers of UV-curable material. It is reported that one or more UV exposures may initiate curing of a curable material in the layer dispensed by a solid freeform fabrication apparatus. According to the '269 or '245 publication, one approach to provide the single or multiple UV exposures is the use of one or more UV LEDs, which generate UV radiation without generating any substantial amounts of infrared (IR) radiation at the same time.
  • IR infrared
  • hybrid liquid radiation curable resins produce cured three-dimensional articles with the most desirable combination of mechanical properties.
  • a hybrid liquid radiation curable resin is a liquid radiation curable resin that comprises both free radical and cationic polymerizable components and photoinitiators. It is also well known that the cationically polymerizable components of a liquid radiation curable resin primarily contribute to the desirable combination of mechanical properties in a cured three-dimensional article, however, the cationically polymerizable components of a liquid radiation curable resin polymerize at a much slower rate than the free-radically polymerizable components.
  • Liquid radiation curable resins for additive fabrication that contain cationically polymerizable components but no free-radical polymerizable components are known, however, such resins are generally considered to be too slow for use as rapid prototyping materials. Therefore, it is desired to increase the speed of the cationic cure in a liquid radiation curable resin for additive fabrication to enable the resin to attain the most desirable combination of physical properties as quickly as possible.
  • the cationic polymerizable components generally cure at a much slower rate than free-radical polymerizable components, it is highly desirable to speed the rate of cationic cure. Moreover, it is desirable to attain a resin with a fast photospeed that uses less photoinitiator so that the amounts of the components that positively contribute to the mechanical properties of a three-dimensional article formed from the liquid radiation curable resin can occupy a greater percentage of the liquid radiation curable resin. Furthermore, cationic photoinitiators that provide excellent photospeed at a variety of wavelengths commonly used in additive fabrication techniques are highly desirable.
  • Thermal-stability is the ability of a liquid radiation curable resin to maintain its viscosity after exposure to temperature over time or during storage.
  • Cationic photoinitiators are responsive to both light and temperature. At elevated temperatures, or at ambient temperature for a long time period, the cationic photoinitiators will be slowly activated and initiate a small amount of polymerization in the liquid radiation curable resin. Over time, this small amount of polymerization will create an undesirable increase in the viscosity of the liquid radiation curable resin for additive fabrication.
  • Silica filler has been the most preferred inorganic filler for liquid radiation curable resins for additive fabrication for a number of years. Please see for example, US published applications 2006/0100301, assigned to DSM, and 2005/0040562, assigned to 3D Systems. Silica particles are predominately comprised of SiO 2 . Examples of commercial embodiments of filled liquid radiation curable resins wherein silica nanoparticles are present are NanoToolTM and NanoFormTM 15100 Series by DSM Somos® and Accura® BlueStoneTM by 3D Systems, Inc.
  • a high amount of inorganic filler is highly desirable in a liquid radiation curable resin due to its impact on the strength and stiffness of the three-dimensional object produced therefrom.
  • highly filled compositions represent several challenges to the formulator of liquid radiation curable resins for additive fabrication. As the amount of filler increases, the viscosity of the liquid radiation curable resin also usually increases. A high viscosity liquid radiation curable resin is not desirable in some additive fabrication processes, for instance, stereolithography.
  • Photo-stability is the ability of a liquid radiation curable resin to maintain its viscosity after exposure to ambient light and undesirable light scattering in additive fabrication machines.
  • liquid radiation curable resins for additive fabrication include one or more photoinitiators that are responsive to ambient light undesirable light scattering that occurs in additive fabrication processes, partial polymerization occurs in the liquid radiation curable resin after it is exposed to light. This small amount of polymerization, over time, causes the viscosity of the liquid radiation curable resin to increase gradually. Achieving good photo-stability is particularly challenging in highly filled liquid radiation curable resins because of additional light scattering effects caused by the filler.
  • the most used cationic photoinitiators for current liquid radiation curable resins for additive fabrication are based upon sulfonium or iodonium cations in combination with either fluorophosphates or fluoroantimonate anions.
  • Antimonate salts are often preferred because of their fast rate of cure.
  • objects fabricated from antimonate based compositions must be disposed of as a hazardous waste or hazardous constituent waste.
  • antimonate salts can have an undesirable effect in investment casting applications.
  • Iodonium-borate photoinitiators are available, but suffer from the need to be sensitized at the wavelengths useful for stereolithography and have low thermal-stability.
  • Sulfonium phosphate photoinitiators are available, but suffer from a poor rate of curing.
  • the first aspect of the instant claimed invention is a liquid radiation curable resin for additive fabrication comprising an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator with a tetrakis(pentafluorophenyl)borate anion and a cation of the following formula (I):
  • Y1, Y2, and Y3 are the same or different and where Y1, Y2, or Y3 are R-substituted aromatic thioether with R being an acetyl or halogen group.
  • the second aspect of the instant claimed invention is a process of forming a three-dimensional object comprising the steps of forming and selectively curing a layer of a liquid radiation curable resin for additive fabrication of the first aspect of the instant claimed invention and repeating the steps of forming and selectively curing a layer of a liquid radiation curable resin for additive fabrication of the first aspect of the instant claimed invention a plurality of times to obtain a three-dimensional object.
  • the third aspect of the instant claimed invention is a three-dimensional object formed from the liquid radiation curable resin for additive fabrication of the first aspect of the instant claimed invention.
  • the fourth aspect of the instant claimed invention is a liquid radiation curable resin for additive fabrication comprising 5 wt % to about 90 wt %, preferably from 10 wt % to 75 wt %, more preferably from 30 to 75 wt % of inorganic filler, said inorganic filler preferably comprising greater than 80 wt %, preferably greater than 90 wt %, more preferably greater than 95 wt % of silica, that has a Dp of from about 4.5 mils to about 7.0 mils wherein the liquid radiation curable resin for additive fabrication, when placed on a shaker table set at 240 rpm and exposed to two 15 watt plant and aquarium lamps hung 8 inches above the surface of the liquid radiation curable resin for additive fabrication, has a gel time of greater than 200 hours, preferably greater than 250 hours.
  • the fifth aspect of the instant claimed invention is the use of an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator with a tetrakis(pentafluorophenyl)borate anion and a cation of the following formula (I):
  • Y1, Y2, and Y3 are the same or different and where Y1, Y2, or Y3 are R-substituted aromatic thioether with R being an acetyl or halogen group, on metal and metal alloys.
  • the first aspect of the instant claimed invention is a liquid radiation curable resin for additive fabrication comprising an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator with a tetrakis(pentafluorophenyl)borate anion and a cation of the following formula (I):
  • Y1, Y2, and Y3 are the same or different and wherein Y1, Y2, or Y3 are R-substituted aromatic thioether with R being an acetyl or halogen group.
  • the liquid radiation curable resin for additive fabrication comprises an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator.
  • the cationic photoinitiator generates photoacids upon irradiation of light. They generate Brönsted or Lewis acids upon irradiation.
  • Triaryl sulfonium salts Use of triaryl sulfonium salts in additive fabrication applications is known. Please see U.S. Pat. No. 6,368,769, to Asahi Denki Kogyo, which discusses triaryl sulfonium salts with tetraryl borate anions, including tetrakis(pentafluorophenyl)borate, and use of the compounds in stereolithography applications. Triarylsulfonium salts are disclosed in, for example, J Photopolymer Science & Tech (2000), 13(1), 117-118 and J Poly Science, Part A (2008), 46(11), 3820-29.
  • Triarylsulfonium salts Ar 3 S + MX n ⁇ with complex metal halide anions such as BF 4 ⁇ , AsF 6 ⁇ , PF 6 ⁇ , and SbF 6 ⁇ , are disclosed in J Polymr Sci, Part A (1996), 34(16), 3231-3253.
  • the inventors have discovered that using an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator as the cationic photoinitiator in a liquid radiation curable resin for additive fabrication enables a liquid radiation curable resin that attains a fast photospeed, attains good thermal-stability, and attains good photo-stability.
  • the R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator has a tetrakis(pentafluorophenyl)borate anion and a cation of the following formula (I):
  • Y1, Y2, and Y3 are the same or different and wherein Y1, Y2, or Y3 are R-substituted aromatic thioether with R being an acetyl or halogen group.
  • Y1, Y2, and Y3 are the same. In another embodiment, Y1 and Y2 are the same, but Y3 is different. Y1, Y2, or Y3 are an R-substituted aromatic thioether with R being an acetyl or halogen group. Preferably Y1, Y2, or Y3 are a para-R-substituted aromatic thioether with R being an acetyl or halogen group.
  • a particularly preferred R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator is tris(4-(4-acetylphenyl)thiophenyl)sulfonium tetrakis(pentafluorophenyl)borate.
  • Tris(4-(4-acetylphenyl)thiophenyl)sulfonium tetrakis(pentafluorophenyl)borate is known commercially as IRGACURE® PAG-290 (formerly known by the development code GSID4480-1) and is available from Ciba/BASF.
  • an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator for instance, tris(4-(4-acetylphenyl)thiophenyl)sulfonium tetrakis(pentafluorophenyl)borate, is much more thermally-stable than other cationic photoinitiators.
  • the improved thermal-stability allows liquid radiation curable resins for additive fabrication incorporating a triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator instead of other conventional cationic photoinitiators to retain their viscosity at elevated temperatures for long periods of time.
  • a liquid radiation curable resin for additive fabrication that comprises an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator, for instance tris(4-(4-acetylphenyl)thiophenyl)sulfonium tetrakis(pentafluorophenyl)borate, in combination with high amounts of inorganic filler, such as silica-based filler.
  • inorganic filler such as silica-based filler.
  • the liquid radiation curable resin for additive fabrication includes a cationic polymerizable component in addition to an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator.
  • the liquid radiation curable resins for additive fabrication include cationic polymerizable components, free-radical photoinitiators, and free-radical polymerizable components.
  • the liquid radiation curable resins for additive fabrication include an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator and additional cationic photoinitiators and/or photosensitizers, along with a cationic polymerizable component and, optionally, free-radical polymerizable components and free-radical photoinitiators.
  • the liquid radiation curable resin for additive fabrication of the invention are curable by one or more LEDs operating at the appropriate wavelength.
  • the LEDs operate at a wavelength of from 200 nm-460 nm, preferably from 300 nm-400 nm, more preferably from 340 nm-375 nm.
  • the R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator can be present in any suitable amount. In embodiments, up to 20 wt %, more preferably up to 10 wt %, more preferably up to about 7 wt %.
  • the R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator is present in an amount from about 0.1 wt % to about 20 wt %, preferably from about 0.1 wt % to about 10 wt %, more preferably from about 0.1 wt % to about 7 wt %, more preferably from about 0.2 wt % to about 4 wt %.
  • the R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator is present in an amount from 0.1 wt % to 2 wt %, preferably from 0.1 wt % to 1.5 wt %.
  • the liquid radiation curable resin for additive fabrication includes a cationic photoinitiator in addition to an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator.
  • Any suitable cationic photoinitiator can be used, for example, those selected from the group consisting of onium salts, halonium salts, iodosyl salts, selenium salts, sulfonium salts, sulfoxonium salts, diazonium salts, metallocene salts, isoquinolinium salts, phosphonium salts, arsonium salts, tropylium salts, dialkylphenacylsulfonium salts, thiopyrilium salts, diaryl iodonium salts, triaryl sulfonium salts, sulfonium antimonate salts, ferrocenes, di(cyclopentadienyliron)arene salt compounds, and pyridinium salts, and any combination thereof.
  • onium salts halonium salts, iodosyl salts, selenium salts, sulfonium salts, sulfoxon
  • Onium salts e.g., iodonium salts, sulfonium salts and ferrocenes, have the advantage that they are thermally-stable. Thus, any residual photoinitiator does not continue to cure after the removal of the irradiating light.
  • Cationic photoinitiators offer the advantage that they are not sensitive to oxygen present in the atmosphere.
  • Preferred mixtures of cationic photoinitiators include a mixture of: bis[4-diphenylsulfoniumphenyl]sulfide bishexafluoroantimonate; thiophenoxyphenylsulfonium hexafluoroantimonate (available as Chivacure 1176 from Chitec); tris(4-(4-acetylphenyl)thiophenyl)sulfonium tetrakis(pentafluorophenyl)borate (Irgacure PAG-290 or GSID4480-1 from Ciba/BASF), iodonium, [4-(1-methylethyl)phenyl](4-methylphenyl)-, tetrakis(pentafluorophenyl)borate (available as Rhodorsil 2074 from Rhodia), 4-[4-(2-chlorobenzoyl)phenylthio]phenylbis(4-fluoropheny
  • the liquid radiation curable resin for additive fabrication it is desirable for the liquid radiation curable resin for additive fabrication to include a photosensitizer.
  • the term “photosensitizer” is used to refer to any substance that either increases the rate of photoinitiated polymerization or shifts the wavelength at which polymerization occurs; see textbook by G. Odian, Principles of Polymerization, 3 rd Ed., 1991, page 222.
  • Examples of photosensitizers include those selected from the group consisting of methanones, xanthenones, pyrenemethanols, anthracenes, pyrene, perylene, quinones, xanthones, thioxanthones, benzoyl esters, benzophenones, and any combination thereof.
  • photosensitizers include those selected from the group consisting of [4-[(4-methylphenyl)thio]phenyl]phenyl ⁇ methanone, isopropyl-9H-thioxanthen-9-one, 1-pyrenemethanol, 9-(hydroxymethyl)anthracene, 9,10-diethoxyanthracene, 9,10-dimethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutyloxyanthracene, 9-anthracenemethanol acetate, 2-ethyl-9,10-dimethoxyanthracene, 2-methyl-9,10-dimethoxyanthracene, 2-t-butyl-9,10-dimethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene and 2-methyl-9,10-diethoxyanthracene, anthracene, anthraquinones, 2-methylanthraquinone
  • photosensitizers are useful in combination with photoinitiators in effecting cure with LED light sources emitting in the wavelength range of 300-475 nm.
  • suitable photosensitizers include: anthraquinones, such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tertbutylanthraquinone, 1-chloroanthraquinone, and 2-amylanthraquinone, thioxanthones and xanthones, such as isopropyl thioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, and 1-chloro-4-propoxythioxanthone, methyl benzoyl formate (Darocur MBF from Ciba), methyl-2-benzoyl benzoate (Chivacure OMB from Chitec), 4-benzoyl-4′-methyl diphenyl sulphide (Chivacure
  • the photosensitizer is a fluorone, e.g., 5,7-diiodo-3-butoxy-6-fluorone, 5,7-diiodo-3-hydroxy-6-fluorone, 9-cyano-5,7-diiodo-3-hydroxy-6-fluorone, or a photosensitizer is
  • the liquid radiation curable resin for additive fabrication can include any suitable amount of the photosensitizer, for example, in certain embodiments, in an amount up to about 10% by weight of the composition, in certain embodiments, up to about 5% by weight of the composition, and in further embodiments from about 0.05% to about 2% by weight of the composition.
  • photoinitiators When photosensitizers are employed, other photoinitiators absorbing at shorter wavelengths can be used.
  • photoinitiators include: benzophenones, such as benzophenone, 4-methyl benzophenone, 2,4,6-trimethyl benzophenone, and dimethoxybenzophenone, and 1-hydroxyphenyl ketones, such as 1-hydroxycyclohexyl phenyl ketone, phenyl (1-hydroxyisopropyl)ketone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 4-isopropylphenyl(1-hydroxyisopropyl)ketone, benzil dimethyl ketal, and oligo-[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone] (Esacure KIP 150 from Lamberti).
  • These photoinitiators when used in combination with a photosensitizer are suitable for use with LED
  • a photosensitizer or co-initiator may be used to improve the activity of the cationic photoinitiator. It is for either increasing the rate of photoinitiated polymerization or shifting the wavelength at which polymerization occurs.
  • the sensitizer used in combination with the above-mentioned cationic photoinitiator is not particularly limited.
  • a variety of compounds can be used as photosensitizers, including heterocyclic and fused-ring aromatic hydrocarbons, organic dyes, and aromatic ketones. Examples of sensitizers include compounds disclosed by J. V. Crivello in Advances in Polymer Science, 62, 1 (1984), and by J. V. Crivello & K.
  • Dietliker “Photoinitiators for Cationic Polymerization” in Chemistry & technology of UV & EB formulation for coatings, inks & paints. Volume III, Photoinitiators for free radical and cationic polymerization. by K. Dietliker; [Ed. by P. K. T. Oldring], SITA Technology Ltd, London, 1991. Specific examples include polyaromatic hydrocarbons and their derivatives such as anthracene, pyrene, perylene and their derivatives, thioxanthones, ⁇ -hydroxyalkylphenones, 4-benzoyl-4′-methyldiphenyl sulfide, acridine orange, and benzoflavin.
  • the liquid radiation curable resin for additive fabrication can include any suitable amount of the other cationic photoinitiator or photosensitizer, for example, in certain embodiments, in an amount an amount from 0.1 to 10 wt % of the composition, in certain embodiments, from about 1 to about 8 wt % of the composition, and in further embodiments from about 2 to about 6 wt % of the composition. In an embodiment, the above ranges are particularly suitable for use with epoxy monomers.
  • the liquid radiation curable resin for additive fabrication includes a photoinitiating system that is a photoinitiator having both cationic initiating function and free radical initiating function.
  • the liquid radiation curable resins for additive fabrication of the invention comprise at least one cationically polymerizable component, that is, a component which undergoes polymerization initiated by cations or in the presence of acid generators.
  • the cationically polymerizable components may be monomers, oligomers, and/or polymers, and may contain aliphatic, aromatic, cycloaliphatic, arylaliphatic, heterocyclic moiety(ies), and any combination thereof.
  • Suitable cyclic ether compounds can comprise cyclic ether groups as side groups or groups that form part of an alicyclic or heterocyclic ring system.
  • the cationic polymerizable component is selected from the group consisting of cyclic ether compounds, cyclic acetal compounds, cyclic thioethers compounds, spiro-orthoester compounds, cyclic lactone compounds, and vinyl ether compounds, and any combination thereof.
  • cationically polymerizable components include cyclic ether compounds such as epoxy compounds and oxetanes, cyclic lactone compounds, cyclic acetal compounds, cyclic thioether compounds, spiro orthoester compounds, and vinylether compounds.
  • cationically polymerizable components include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl ether, epoxy novolac resins, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)-cyclohexane-1,4-dioxane, bis(3,4-epoxycyclohexylmethyl)adipate, vinylcyclohexene oxide, 4-vinylepoxycyclohexane
  • dendritic polymers may contain one type of polymerizable functional group or different types of polymerizable functional groups, for example, epoxy and oxetane functions.
  • the cationic polymerizable component is at least one selected from the group consisting of a cycloaliphatic epoxy and an oxetane.
  • the cationic polymerizable component is an oxetane, for example, an oxetane containing 2 or more than 2 oxetane groups.
  • the cationic polymerizable component is a cycloaliphatic epoxy, for example, a cycloaliphatic epoxy with 2 or more than 2 epoxy groups.
  • the epoxide is 3,4-epoxycyclohexylmethyl-3′,4-epoxycyclohexanecarboxylate (available as CELLOXIDETM 2021P from Daicel Chemical, or as CYRACURETM UVR-6105 from Dow Chemical), hydrogenated bisphenol A-epichlorohydrin based epoxy resin (available as EPONEXTM 1510 from Hexion), 1,4-cyclohexanedimethanol diglycidyl ether (available as HELOXYTM 107 from Hexion), a mixture of dicyclohexyl diepoxide and nanosilica (available as NANOPDXTM), and any combination thereof.
  • CELLOXIDETM 2021P from Daicel Chemical, or as CYRACURETM UVR-6105 from Dow Chemical
  • hydrogenated bisphenol A-epichlorohydrin based epoxy resin available as EPONEXTM 1510 from Hexion
  • the above-mentioned cationically polymerizable compounds can be used singly or in combination of two or more thereof.
  • the liquid radiation curable resin for additive fabrication can include any suitable amount of the cationic polymerizable component, for example, in certain embodiments, in an amount an amount up to about 80 wt % of the composition, in certain embodiments, from about 10 to about 80% by weight of the composition, and in further embodiments from about 20 to about 70 wt % of the composition.
  • the polymerizable component of the liquid radiation curable resin for additive fabrication is polymerizable by both free-radical polymerization and cationic polymerization.
  • a polymerizable component is a vinyloxy compound, for example, one selected from the group consisting of bis(4-vinyloxybutyl)isophthalate, tris(4-vinyloxybutyl)trimellitate, and combinations thereof.
  • Other examples of such a polymerizable component include those contain an acrylate and an epoxy group, or an acrylate and an oxetane group, on a same molecule.
  • the liquid radiation curable resin for additive fabrication of the present invention includes a photoinitiating system.
  • the photoinitiating system can be a free-radical photoinitiator or a cationic photoinitiator or a photoinitiator that contains both free-radical initiating function and cationic initiating function on the same molecule.
  • the photoinitiator is a compound that chemically changes due to the action of light or the synergy between the action of light and the electronic excitation of a sensitizing dye to produce at least one of a radical, an acid, and a base.
  • free radical photoinitiators are divided into those that form radicals by cleavage, known as “Norrish Type I” and those that form radicals by hydrogen abstraction, known as “Norrish type II”.
  • the Norrish type II photoinitiators require a hydrogen donor, which serves as the free radical source.
  • the Norrrish type II photoinitiators are generally slower than Norrish type I photoinitiators which are based on the unimolecular formation of radicals.
  • Norrish type II photoinitiators possess better optical absorption properties in the near-UV spectroscopic region.
  • Photolysis of aromatic ketones such as benzophenone, thioxanthones, benzil, and quinones
  • hydrogen donors such as alcohols, amines, or thiols
  • the photopolymerization of vinyl monomers is usually initiated by the radicals produced from the hydrogen donor.
  • the ketyl radicals are usually not reactive toward vinyl monomers because of the steric hindrance and the delocalization of an unpaired electron.
  • the liquid radiation curable resin for additive fabrication includes at least one free radical photoinitiator, e.g., those selected from the group consisting of benzoylphosphine oxides, aryl ketones, benzophenones, hydroxylated ketones, 1-hydroxyphenyl ketones, ketals, metallocenes, and any combination thereof.
  • at least one free radical photoinitiator e.g., those selected from the group consisting of benzoylphosphine oxides, aryl ketones, benzophenones, hydroxylated ketones, 1-hydroxyphenyl ketones, ketals, metallocenes, and any combination thereof.
  • the liquid radiation curable resin for additive fabrication includes at least one free-radical photoinitiator selected from the group consisting of 2,4,6-trimethylbenzoyl diphenylphosphine oxide and 2,4,6-trimethylbenzoyl phenyl, ethoxy phosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1,2-benzyl-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 4-benzoyl-4′-methyl diphenyl sulphide, 4,4′-bis(diethylamino)benzophenone, and 4,4′-bis(N,N′-
  • suitable free-radical photoinitiators absorbing in this area include: benzoylphosphine oxides, such as, for example, 2,4,6-trimethylbenzoyl diphenylphosphine oxide (Lucirin TPO from BASF) and 2,4,6-trimethylbenzoyl phenyl, ethoxy phosphine oxide (Lucirin TPO-L from BASF), bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide (Irgacure 819 or BAPO from Ciba), 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1 (Irgacure 907 from Ciba), 2-benzyl-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl
  • benzoylphosphine oxides such as, for example, 2,4,6-trimethylbenzoyl diphenylphosphine oxide (Lucirin
  • photosensitizers are useful in conjunction with photoinitiators in effecting cure with LED light sources emitting in this wavelength range.
  • suitable photosensitizers include: anthraquinones, such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-tertbutylanthraquinone, 1-chloroanthraquinone, and 2-amylanthraquinone, thioxanthones and xanthones, such as isopropyl thioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, and 1-chloro-4-propoxythioxanthone, methyl benzoyl formate (Darocur MBF from Ciba), methyl-2-benzoyl benzoate (Chivacure OMB from Chitec), 4-benzoyl-4′-methyl diphenyl sulphide (Chivacure BMS from Chitec), 4,
  • LED UV light sources it is possible for LED UV light sources to be designed to emit light at shorter wavelengths.
  • LED light sources emitting at wavelengths from between about 100 and about 300 nm it is desirable to employ a photosensitizer with a photoinitiator.
  • photosensitizers such as those previously listed are present in the formulation, other photoinitiators absorbing at shorter wavelengths can be used.
  • photoinitiators include: benzophenones, such as benzophenone, 4-methyl benzophenone, 2,4,6-trimethyl benzophenone, and dimethoxybenzophenone, and, 1-hydroxyphenyl ketones, such as 1-hydroxycyclohexyl phenyl ketone, phenyl (1-hydroxyisopropyl)ketone, 2-hydroxy-1-[4-(2-hroxyethoxy)phenyl]-2-methyl-1-propanone, and 4-isopropylphenyl(1-hydroxyisopropyl)ketone, benzil dimethyl ketal, and oligo-[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone] (Esacure KIP 150 from Lamberti).
  • benzophenones such as benzophenone, 4-methyl benzophenone, 2,4,6-trimethyl benzophenone, and dimethoxybenzophenone
  • 1-hydroxyphenyl ketones such as 1-hydroxycyclo
  • LED light sources can also be designed to emit visible light.
  • suitable free radical photoinitiators include: camphorquinone, 4,4′-bis(diethylamino)benzophenone (Chivacure EMK from Chitec), 4,4′-bis(N,N′-dimethylamino)benzophenone (Michler's ketone), bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide (Irgacure 819 or BAPO from Ciba), metallocenes such as bis(eta 5-2-4-cyclopentadien-1-yl)bis[2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl]titanium (Irgacure 784 from Ciba), and the visible light photoinitiators from Spectra Group Limited, Inc. such as H-Nu 470, H-
  • the light emitted by the LED is UVA radiation, which is radiation with a wavelength between about 320 and about 400 nm. In one embodiment of the instant claimed invention, the light emitted by the LED is UVB radiation, which is radiation with a wavelength between about 280 and about 320 nm. In one embodiment of the instant claimed invention, the light emitted by the LED is UVC radiation, which is radiation with a wavelength between about 100 and about 280 nm.
  • the liquid radiation curable resin for additive fabrication can include any suitable amount of the free-radical photoinitiator, for example, in certain embodiments, in an amount up to about 10 wt % of the composition, in certain embodiments, from about 0.1 to about 10 wt % of the composition, and in further embodiments from about 1 to about 6 wt % of the composition.
  • the liquid radiation curable resin for additive fabrication of the invention comprises at least one free-radical polymerizable component, that is, a component which undergoes polymerization initiated by free radicals.
  • the free-radical polymerizable components are monomers, oligomers, and/or polymers; they are monofunctional or polyfunctional materials, i.e., have 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 100, or more functional groups that can polymerize by free radical initiation, may contain aliphatic, aromatic, cycloaliphatic, arylaliphatic, heterocyclic moiety(ies), or any combination thereof.
  • polyfunctional materials include dendritic polymers such as dendrimers, linear dendritic polymers, dendrigraft polymers, hyperbranched polymers, star branched polymers, and hypergraft polymers; see US 2009/0093564 A1.
  • the dendritic polymers may contain one type of polymerizable functional group or different types of polymerizable functional groups, for example, acrylates and methacrylate functions.
  • free-radical polymerizable components include acrylates and methacrylates such as isobornyl(meth)acrylate, bornyl(meth)acrylate, tricyclodecanyl(meth)acrylate, dicyclopentanyl(meth)acrylate, dicyclopentenyl(meth)acrylate, cyclohexyl(meth)acrylate, benzyl(meth)acrylate, 4-butylcyclohexyl(meth)acrylate, acryloyl morpholine, (meth)acrylic acid, 2-hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, methyl(meth)acrylate, ethyl(meth)acrylate, propyl(meth)acrylate, isopropyl(meth)acrylate, butyl(meth)acrylate, amyl(meth)acrylate, isobutyl(meth)acrylate,
  • polyfunctional free-radical polymerizable components include those with (meth)acryloyl groups such as trimethylolpropane tri(meth)acrylate, pentaerythritol(meth)acrylate, ethylene glycol di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate, dicyclopentadiene dimethanol di(meth)acrylate, [2-[1,1-dimethyl-2-[(1-oxoallyl)oxy]ethyl]-5-ethyl-1,3-dioxan-5-yl]methyl acrylate; 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane di(meth)acrylate; dipentaerythritol monohydroxypenta(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, propoxylated neopen
  • the polyfunctional (meth)acrylates of the polyfunctional component may include all methacryloyl groups, all acryloyl groups, or any combination of methacryloyl and acryloyl groups.
  • the free-radical polymerizable component is selected from the group consisting of bisphenol A diglycidyl ether di(meth)acrylate, ethoxylated or propoxylated bisphenol A or bisphenol F di(meth)acrylate, dicyclopentadiene dimethanol di(meth)acrylate, [2-[1,1-dimethyl-2-[(1-oxoallyl)oxy]ethyl]-5-ethyl-1,3-dioxan-5-yl]methyl acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)crylate, propoxylated trimethylolpropane tri(meth)acrylate,
  • the free-radical polymerizable component is selected from the group consisting of bisphenol A diglycidyl ether diacrylate, dicyclopentadiene dimethanol diacrylate, [2-[1,1-dimethyl-2-[(1-oxoallyl)oxy]ethyl]-5-ethyl-1,3-dioxan-5-yl]methyl acrylate, dipentaerythritol monohydroxypentaacrylate, propoxylated trimethylolpropane triacrylate, and propoxylated neopentyl glycol diacrylate, and any combination thereof.
  • the liquid radiation curable resins for additive fabrication of the invention include one or more of bisphenol A diglycidyl ether di(meth)acrylate, dicyclopentadiene dimethanol di(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, and/or propoxylated neopentyl glycol di(meth)acrylate, and more specifically one or more of bisphenol A diglycidyl ether diacrylate, dicyclopentadiene dimethanol diacrylate, dipentaerythritol monohydroxypentaacrylate, propoxylated trimethylolpropane triacrylate, and/or propoxylated neopentyl glycol diacrylate.
  • the liquid radiation curable resin for additive fabrication can include any suitable amount of the free-radical polymerizable component, for example, in certain embodiments, in an amount up to about 40 wt % of the composition, in certain embodiments, from about 2 to about 40 wt % of the composition, in other embodiments from about 10 to about 40 wt %, and in further embodiments from about 10 to about 25 wt % of the composition.
  • the liquid radiation curable resins for additive fabrication include a stabilizer.
  • Stabilizers are often added to the compositions in order to prevent a viscosity build-up, for instance a viscosity build-up during usage in a solid imaging process.
  • Useful stabilizers include those described in U.S. Pat. No. 5,665,792, the entire disclosure of which is hereby incorporated by reference.
  • Such stabilizers are usually hydrocarbon carboxylic acid salts of group IA and IIA metals. Most preferred examples of these salts are sodium bicarbonate, potassium bicarbonate, and rubidium carbonate. Solid stabilizers are generally not preferred in filled compositions.
  • a 15-23% sodium carbonate solution is preferred for formulations of this invention with recommended amounts varying between 0.05 to 3.0% by weight of composition, more preferably from 0.05 to 1.0 wt %, more preferably from 0.1 to 0.5% by weight of composition.
  • Alternative stabilizers include polyvinylpyrrolidones and polyacrylonitriles.
  • additives include dyes, pigments, talc, glass powder, alumina, alumina hydrate, magnesium oxide, magnesium hydroxide, barium sulfate, calcium sulfate, calcium carbonate, magnesium carbonate, silicate mineral, diatomaceous earth, silica sand, silica powder, titanium oxide, aluminum powder, bronze powder, zinc powder, copper powder, lead powder, gold powder, silver dust, glass fiber, titanic acid potassium whisker, carbon whisker, sapphire whisker, beryllia whisker, boron carbide whisker, silicon carbide whisker, silicon nitride whisker, glass beads, hollow glass beads, metaloxides and potassium titanate whisker), antioxidants, wetting agents, photosensitizers for the free-radical photoinitiator, chain transfer agents, leveling agents, defoamers, surfactants and the like.
  • the liquid radiation curable resin for additive fabrication can further include a chain transfer agent, particularly a chain transfer agent for a cationic monomer.
  • the chain transfer agent has a functional group containing active hydrogen. Examples of the active hydrogen-containing functional group include an amino group, an amide group, a hydroxyl group, a sulfo group, and a thiol group.
  • the chain transfer agent terminates the propagation of one type of polymerization, i.e., either cationic polymerization or free-radical polymerization and initiates a different type of polymerization, i.e., either free-radical polymerization or cationic polymerization.
  • chain transfer to a different monomer is a preferred mechanism.
  • chain transfer tends to produce branched molecules or crosslinked molecules.
  • chain transfer offers a way of controlling the molecular weight distribution, crosslink density, thermal properties, and/or mechanical properties of the cured resin composition.
  • the chain transfer agent for a cationic polymerizable component is a hydroxyl-containing compound, such as a compound containing 2 or more than 2 hydroxyl-groups.
  • the chain transfer agent is selected from the group consisting of a polyether polyol, polyester polyol, polycarbonate polyol, ethoxylated or propoxylated aliphatic or aromatic compounds having hydroxyl groups, dendritic polyols, hyperbranched polyols.
  • An example of a polyether polyol is a polyether polyol comprising an alkoxy ether group of the formula [(CH 2 ) n O] m , wherein n can be 1 to 6 and m can be 1 to 100.
  • a particular example of a chain transfer agent is polytetrahydrofuran such as TERATHANETM.
  • the liquid radiation curable resin for additive fabrication can include any suitable amount of the chain transfer agent, for example, in certain embodiments, in an amount up to about 50% by weight of the composition, in certain embodiments, up to about 30% by weight of the composition, and in certain other embodiments from about 10% to about 20% by weight of the composition.
  • the liquid radiation curable resin for additive fabrication of the invention can further include one or more additives selected from the group consisting of bubble breakers, antioxidants, surfactants, acid scavengers, pigments, dyes, thickneners, flame retardants, silane coupling agents, ultraviolet absorbers, resin particles, core-shell particle impact modifiers, soluble polymers and block polymers, organic fillers, inorganic fillers, or organic-inorganic hybrid fillers of sizes ranging from about 8 nanometers to about 50 microns.
  • additives selected from the group consisting of bubble breakers, antioxidants, surfactants, acid scavengers, pigments, dyes, thickneners, flame retardants, silane coupling agents, ultraviolet absorbers, resin particles, core-shell particle impact modifiers, soluble polymers and block polymers, organic fillers, inorganic fillers, or organic-inorganic hybrid fillers of sizes ranging from about 8 nanometers to about 50 microns.
  • an inorganic filler is present in an amount from 5 wt % to about 90 wt %, preferably from 10 wt % to 75 wt %, more preferably from 30 to 75 wt %.
  • the inorganic filler preferably comprises silica (SiO 2 ) nanoparticles or microparticles, or nanoparticles or microparticles that are substantially silica based, for instance, greater than 80 wt %, more preferably 90 wt %, more preferably 95 wt % of silica.
  • Preferred silica nanoparticles are Nanopox products from Nanoresins, such as Nanopox A610.
  • silica microparticles are NP-30 and NP-100 from AGC Chemicals, SUNSPACERTM 04.X and 0.4 ⁇ ST-3 from Suncolor Corporation.
  • silica nanoparticles are SUNSPHERESTM 200 nm such as 0.2 and 0.2-STP-10. Please see U.S. Pat. No. 6,013,714 for further examples of silica particles.
  • the thermal-stability of the liquid radiation curable resin may decrease when certain silica nanoparticles or microparticles are added to the liquid radiation curable resin due to the acidity of the silica.
  • the inventors have found a surprising combination of a triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator, preferably, tris(4-(4-acetylphenyl)thiophenyl)sulfonium tetrakis(pentafluorophenyl)borate, and high amounts of inorganic filler, preferably silica filler which comprises greater than 80 wt %, more preferably 90 wt %, more preferably 95 wt % of silica.
  • the combination yields liquid radiation curable resins for additive fabrication that attain excellent photo-stability and thermal-stability.
  • Nanoparticles are defined herein as particles having an average particle diameter in the range from 1 nm to 999 nm as measured using laser diffraction particle size analysis in accordance with ISO13320:2009.
  • a suitable device for measuring the average particle diameter of nanoparticles is the LB-550 machine, available from Horiba Instruments, Inc, which measures particle diameter by dynamic light scattering.
  • Microparticles are defined herein as particles that have an average particle diameter in the range from 1 to about 100 microns as measured in accordance with ISO13320:2009.
  • the second aspect of the instant claimed invention is a process of forming a three-dimensional object comprising the steps of forming and selectively curing a layer of a liquid radiation curable resin for additive fabrication comprising a triaryl sulfonium tetrakis(pentafluorophenyl)borate photoinitiator and repeating the steps of forming and selectively curing a layer of a liquid radiation curable resin for additive fabrication comprising a triaryl sulfonium tetrakis(pentafluorophenyl)borate photoinitiator a plurality of times to obtain a three-dimensional object.
  • the process can be performed using any suitable means of imaging radiation, such as an LED, a lamp, or a laser.
  • the process can be performed on a liquid radiation curable resin contained in a vat or coated on a substrate.
  • the process is performed by one or more LEDs.
  • the LEDs preferably operate from 200 nm-460 nm, preferably from 300 nm-400 nm, more preferably from 340 nm-370 nm.
  • the third aspect of the instant claimed invention is a three-dimensional object formed from a liquid radiation curable resin for additive fabrication that comprises a triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator.
  • the fourth aspect of the instant claimed invention is a liquid radiation curable resin for additive fabrication comprising 5 wt % to about 90 wt %, preferably from 10 wt % to 75 wt %, more preferably from 30 to 75 wt % of inorganic filler, said inorganic filler preferably comprising greater than 80 wt %, preferably greater than 90 wt %, more preferably greater than 95 wt % of silica, that has a Dp of from about 4.5 mils to about 7.0 mils, preferably from 4.5 mils to about 6.0 mils, more preferably from 4.5 mils to about 5.5 mils, wherein the liquid radiation curable resin for additive fabrication, when placed on a shaker table set at 240 rpm and exposed to two 15 watt plant and aquarium lamps hung 8 inches above the surface of the liquid radiation curable resin for additive fabrication, has a gel time of greater than 200 hours, preferably greater than 250 hours.
  • the fifth aspect of the instant claimed invention is the use of an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator with a tetrakis(pentafluorophenyl)borate anion and a cation of the following formula (I):
  • Y1, Y2, and Y3 are the same or different and where Y1, Y2, or Y3 are R-substituted aromatic thioether with R being an acetyl or halogen group, on metal and metal alloys, such as alluminum alloy, steels, stainless steels, copper alloys, tin, or tin-plated steels.
  • Table 1 describes the various components of the liquid radiation curable resins for additive fabrication used in the present examples.
  • Nanopox A610 Filler in reactive 40% 15 nm of SiO 2 Particle in epoxy Nanoresins monomer monomer OXT-101 Cationic 3-Ethyl-3-oxetanemethanol Toagosei Polymerizable Compound Polyvinyl pyrrolidone Acid Poly[N-vinylpyrrolidinone]; PVP Sigma scavenger Aldrich Rhodorsil 2074 Photoacid Iodonium, [4-(1-methylethyl)phenyl](4- Rhodia generator methylphenyl)-, tetrakis(pentafluorophenyl)borate Rubidium carbonate Acid Dirubidium carbonate; Rb 2 CO 3 Sigma scavenger Aldrich Silwet L 7600 Leveling Polyalkyleneoxide modified Momentive agent polydimethylsiloxane SR-399LV, J Radical Dipentaerythritol Sartomer Polymerizable monohydroxypentaacrylate Compound SR
  • the photo cure speed test using 365 nm LED light is used to measure values for Ec and Dp of the example and comparative example compositions in Table 2 and Table 3.
  • a single UV LED “bare bulb” (Model No. NCSU033A; Nichia Corporation, Japan) having a peak wavelength of 365 nm is used as the LED light source in a light curing apparatus, wherein the single LED light is bottom-mounted on a flat surface inside a 30° C. chamber and positioned in an upward-looking arrangement and pointing vertically.
  • the LED light is powered by a 3.30 V/0.050
  • a DC output from a Programmable Power Supply (Model No. PSS-3203; GW Instek).
  • a 10-mil sheet of polyester film (Melinex #515, Polybase Mylar D, 0.010 gauge) is placed at a distance of 12 mm above from the bottom of the LED light bulb.
  • a drop of the liquid resin is placed on the polyester film over the center of the LED light.
  • the resin is exposed to the LED light through the polyester film for a specific time interval. The process is repeated with fresh resin for 2, 4, 6, 8, 10 second exposure times or up to 12, 16, or 20 seconds for slow curing resin formulations.
  • the exposure energy mJ/cm 2
  • the exposure time in seconds
  • RT-DMA Real Time Dynamic Mechanical Analysis
  • G′ storage shear modulus
  • RT-DMA is carried out under ambient lab conditions (20-23° C. and 25-35% RH), on compositions undergoing curing using a StressTech Rheometer (Reologicia Instruments AB, Sweden) with an 8 mm plate, a gap of 0.1 mm, and modified to include a mercury lamp light source (OMNICURE Series 2000 available from EXFO), fitted with a 365 nm interference filter (also available from EXFO) placed in the light path and a liquid-filled light guide for conveying light from the source to the rheometer.
  • the 365 nm interference filter produces the spectral output shown in FIG. 1 .
  • the samples are evaluated under the following parameters: 10 s of equilibrium time; frequency of 10 Hz; 50 mW/cm2 light intensity by the IL 1400 radiometer with XRL140B detector (International Light, Newburyport, Mass.); 1.0 s exposure that starts at 2.1 seconds from the beginning of data collection; FFT smoothing of curves; G′ taken at 2.5, 2.7, 3, 4, and 6 s from the beginning of data collection by using the accompanying software for data analysis.
  • FIG. 2 shows a schematic of the RT-DMA apparatus.
  • the liquid radiation curable resin (1) is placed on a plane (2).
  • the amount of liquid resin used should be approximately the amount indicated in the figure.
  • the plane is a quartz plate that is sold with the StressTech Rheometer.
  • the 8 mm plate (3) is positioned with a 0.1 mm gap (4) between the plate and the plane. The gap is set via the software accompanying the StressTech Rheometer.
  • Light (5) is provided though the plane (2).
  • the publication “Dynamic Mechanical Analysis of UV-Curable Coatings While Curing” by Robert W. Johnson available at http://reologicainstruments.com/PDF%20files/BobJohnsonUVpaper.pdf and hereby incorporated by reference in its entirety, for more information on RT-DMA.
  • Photo-stability data (hrs until gel time), and thermal-stability data (initial viscosity, 15 day viscosity, and 24 days viscosity) were measured in accordance with the below methods.
  • the details of the compositions of each example (Ex) and comparative example (Comp) are specified in Table 4 with each component represented as weight percent of the total composition.
  • the working curve is a measure of the photospeed of the particular material. It represents the relationship between the thickness of a layer of liquid radiation curable resin produced as a function of the exposure given.
  • the exposure-working curve of the formula is determined using methods well known in the art.
  • the exposure response for each formulation is measured using a 20 g sample of the formulation in a 100 mm diameter petri dish held at 30° C. and 30% RH.
  • the surface of the formulation is exposed with the indicated light source.
  • the exposures are made in half-inch squares (exposure regions) which are scanned out by drawing consecutive parallel lines approximately 25.4 microns apart on the surface of the liquid in the petri dish at 72 mW. Different exposure regions are exposed to different levels of known incident energy to obtain different cured thicknesses.
  • the spot diameter at the liquid surface is approximately 0.0277 cm in diameter.
  • Film thickness is measured with a Mitutoyo Model ID-C112CE Indicator Micrometer. Film thickness is a linear function of the natural logarithm of the exposure energy; the slope of the regression is Dp (units of micron or mil) and Ec is the x-axis intercept of the regression fit (units of mJ/cm 2 ). E10 is the energy required to cure a ten mil (254 micron) layer.
  • each sample is added into 60 mL clear jars with a wide open top, available from FlackTek, Inc.
  • the sample containing jars are placed uniformly across an Excella E5 platform shaker available from New Brunswick Scientific Co., Inc.
  • Each sample containing jar is secured with clamps to the platform shaker.
  • the light bank containing two 15 watt plant & aquarium lamps (General Electric, F15T8 PL/AQ) is hung 8 inches high over the shaker platform.
  • the shaker speed is set to 240 rpm.
  • the samples are exposed right under the lamps and rotated daily until the liquid sample is gelled.
  • the liquid sample is gelled when a solid layer has formed on the surface of the liquid sample.
  • the gel time is collected to the nearest hour.
  • the liquid radiation curable resin After the liquid radiation curable resin is made, it is allowed to sit for between 30 and 60 minutes or until it is degassed. Light tapping of the container holding the liquid radiation curable resin is performed to accelerate the degassing process. The initial viscosity is then measured using a Rheometer from Paar Physica (Rheolab, MC10, Z3 cup and 1/50 s shear rate). The samples are held in the machine at the specified shear rate for 15 minutes before data is collected.
  • each sample is added into 60 mL clear jars with a wide open top available from FlackTek, Inc. The jar is capped loosely. The sample containing jars are placed in a 55° C. oven for a specified number of days. The samples containing jars are removed from the oven and allowed to cool to ambient conditions. The samples are then remixed and the viscosity is measured using the same equipment and technique mentioned above.
  • the percentage change in viscosity is calculated by dividing the viscosity at a specified day by the initial viscosity. The result is then multiplied by 100.
  • Comparative Example 8 uses a typical amount of a common cationic photoinitiator used in many commercial liquid radiation curable resins for additive fabrication. Consequently, an E10 and Dp that is suitable for an additive fabrication process is achieved.
  • Example 8 was designed to demonstrate the effects of a direct swap of an R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl)borate cationic photoinitiator for Chivacure 1176.
  • Example 8 shows a very low Dp and very high E10 due to the increased absorbance of the R-substituted aromatic thioether triaryl sulfonium tetrakis(pentafluorophenyl) borate cationic photoinitiator over Chivacure 1176.
  • the Dp is too low and the E10 far too high compared to Comparative Example 8.
  • Example 8 and Comparative Example 8 would thus not perform similarly in an additive fabrication process. Consequently, the photo-stability of Example 8 is less than the photo-stability of Comparative Example 8. However, the thermal-stability of Example 8 is greatly improved over the thermal-stability of Comparative Example 8.
  • Example 9 and Comparative Example 9 use a much lower amount of cationic photoinitiator. Again, the Dp is significantly lower than in Comparative Example 8. The reduced amount of cationic photoinitiators in Example 9 and Comparative Example 9 yield additional improvement in the thermal-stability of the liquid radiation curable resin over Example 8 and Comparative Example 8, respectively.
  • Example 10 A stabilizer is added in Example 10, Example 11, and Comparative Example 10.
  • the stabilizer greatly improves the photo-stability of the liquid radiation curable resin for additive fabrication.
  • Example 10 is able to achieve a photo-stability that is similar to Comparative Example 10 which has a much more desirable Dp and E10.
  • Example 11 demonstrates a Dp that is comparable to Example 8 and a greatly improved photo-stability over any other example or Comparative Example.
  • Example 10 and Example 11 also demonstrate improved thermal-stability over Comparative Example 10.

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US20120259031A1 (en) 2012-10-11
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US9034236B2 (en) 2015-05-19
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