US20090162991A1 - Process for assembling substrates with low-temperature heat treatments - Google Patents

Process for assembling substrates with low-temperature heat treatments Download PDF

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Publication number
US20090162991A1
US20090162991A1 US12/296,250 US29625007A US2009162991A1 US 20090162991 A1 US20090162991 A1 US 20090162991A1 US 29625007 A US29625007 A US 29625007A US 2009162991 A1 US2009162991 A1 US 2009162991A1
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US
United States
Prior art keywords
temperature
process according
levels
substrate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US12/296,250
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English (en)
Inventor
Rémi Beneyton
Hubert Moriceau
Frank Fournel
Francois Rieutord
Yannick Le Tiec
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
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Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE reassignment COMMISSARIAT A L'ENERGIE ATOMIQUE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BENEYTON, REMI, FOURNEL, FRANK, LE TIEC, YANNICK, MORICEAU, HUBERT, RIEUTORD, FRANCOIS
Publication of US20090162991A1 publication Critical patent/US20090162991A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1059—Splitting sheet lamina in plane intermediate of faces

Definitions

  • the invention relates to techniques for assembling substrates.
  • These are, for example, silicon plates, plain or covered with fine silicon oxide, with a thickness below 50 nm.
  • Substrates 1 and 2 are assembled, one on the other, by the assembly faces 6 and 8 prepared before.
  • a complementary treatment, of the bonding or fracture reinforcement type does not necessarily immediately follow a treatment according to the invention.
  • a step of another intermediate treatment may take place in the meantime.
  • an implantation is produced at a dose of 6 ⁇ 10 16 H + ions at 210 keV through a thermal oxide, which will enable the transfer of 1.56 ⁇ m of Si.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Element Separation (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
US12/296,250 2006-04-10 2007-04-06 Process for assembling substrates with low-temperature heat treatments Abandoned US20090162991A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0651290 2006-04-10
FR0651290A FR2899594A1 (fr) 2006-04-10 2006-04-10 Procede d'assemblage de substrats avec traitements thermiques a basses temperatures
PCT/EP2007/053428 WO2007116038A1 (fr) 2006-04-10 2007-04-06 Procede d'assemblage de substrats avec traitements thermiques a basses temperatures

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/053428 A-371-Of-International WO2007116038A1 (fr) 2006-04-10 2007-04-06 Procede d'assemblage de substrats avec traitements thermiques a basses temperatures

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/273,982 Continuation US8530331B2 (en) 2006-04-10 2011-10-14 Process for assembling substrates with low-temperature heat treatments

Publications (1)

Publication Number Publication Date
US20090162991A1 true US20090162991A1 (en) 2009-06-25

Family

ID=37544382

Family Applications (2)

Application Number Title Priority Date Filing Date
US12/296,250 Abandoned US20090162991A1 (en) 2006-04-10 2007-04-06 Process for assembling substrates with low-temperature heat treatments
US13/273,982 Active US8530331B2 (en) 2006-04-10 2011-10-14 Process for assembling substrates with low-temperature heat treatments

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/273,982 Active US8530331B2 (en) 2006-04-10 2011-10-14 Process for assembling substrates with low-temperature heat treatments

Country Status (7)

Country Link
US (2) US20090162991A1 (de)
EP (1) EP2004768B1 (de)
JP (1) JP5230601B2 (de)
AT (1) ATE440922T1 (de)
DE (1) DE602007002178D1 (de)
FR (1) FR2899594A1 (de)
WO (1) WO2007116038A1 (de)

Cited By (20)

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US20080277266A1 (en) * 2007-05-11 2008-11-13 Layman Frederick P Shape of cone and air input annulus
WO2011081834A1 (en) * 2009-12-15 2011-07-07 Sdcmaterials Llc Pinning and affixing nano-active material
US8470112B1 (en) 2009-12-15 2013-06-25 SDCmaterials, Inc. Workflow for novel composite materials
US8481449B1 (en) 2007-10-15 2013-07-09 SDCmaterials, Inc. Method and system for forming plug and play oxide catalysts
US8545652B1 (en) 2009-12-15 2013-10-01 SDCmaterials, Inc. Impact resistant material
US8557727B2 (en) 2009-12-15 2013-10-15 SDCmaterials, Inc. Method of forming a catalyst with inhibited mobility of nano-active material
US8669202B2 (en) 2011-02-23 2014-03-11 SDCmaterials, Inc. Wet chemical and plasma methods of forming stable PtPd catalysts
US8668803B1 (en) 2009-12-15 2014-03-11 SDCmaterials, Inc. Sandwich of impact resistant material
US8679433B2 (en) 2011-08-19 2014-03-25 SDCmaterials, Inc. Coated substrates for use in catalysis and catalytic converters and methods of coating substrates with washcoat compositions
US8803025B2 (en) 2009-12-15 2014-08-12 SDCmaterials, Inc. Non-plugging D.C. plasma gun
US9126191B2 (en) 2009-12-15 2015-09-08 SDCmaterials, Inc. Advanced catalysts for automotive applications
US9149797B2 (en) 2009-12-15 2015-10-06 SDCmaterials, Inc. Catalyst production method and system
US9156025B2 (en) 2012-11-21 2015-10-13 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
US9427732B2 (en) 2013-10-22 2016-08-30 SDCmaterials, Inc. Catalyst design for heavy-duty diesel combustion engines
US9437474B2 (en) 2012-09-05 2016-09-06 Commissariat à l'énergie atomique et aux énergies alternative Method for fabricating microelectronic devices with isolation trenches partially formed under active regions
US9511352B2 (en) 2012-11-21 2016-12-06 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
US9517448B2 (en) 2013-10-22 2016-12-13 SDCmaterials, Inc. Compositions of lean NOx trap (LNT) systems and methods of making and using same
US9586179B2 (en) 2013-07-25 2017-03-07 SDCmaterials, Inc. Washcoats and coated substrates for catalytic converters and methods of making and using same
US9687811B2 (en) 2014-03-21 2017-06-27 SDCmaterials, Inc. Compositions for passive NOx adsorption (PNA) systems and methods of making and using same
US11081463B2 (en) 2018-11-09 2021-08-03 Commissariat à l'énergie atomique et aux énergies alternatives Bonding method with electron-stimulated desorption

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JP2010045156A (ja) * 2008-08-12 2010-02-25 Toshiba Corp 半導体装置の製造方法
FR2938119B1 (fr) * 2008-10-30 2011-04-22 Soitec Silicon On Insulator Procede de detachement de couches semi-conductrices a basse temperature
FR2942910B1 (fr) * 2009-03-06 2011-09-30 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure visant a reduire l'etat de contrainte en tension du substrat donneur
FR2990054B1 (fr) * 2012-04-27 2014-05-02 Commissariat Energie Atomique Procede de collage dans une atmosphere de gaz presentant un coefficient de joule-thomson negatif.
JP2014103291A (ja) * 2012-11-21 2014-06-05 Renesas Electronics Corp 半導体装置の製造方法
FR3040108B1 (fr) 2015-08-12 2017-08-11 Commissariat Energie Atomique Procede de fabrication d'une structure semi-conductrice avec collage direct temporaire exploitant une couche poreuse
FR3085957B1 (fr) 2018-09-14 2021-01-29 Commissariat Energie Atomique Procede de collage temporaire avec adhesif thermoplastique incorporant une couronne rigide

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US20060055003A1 (en) * 2004-05-19 2006-03-16 Sumco Corporation Bonded SOI substrate, and method for manufacturing the same
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US8759248B2 (en) 2007-10-15 2014-06-24 SDCmaterials, Inc. Method and system for forming plug and play metal catalysts
US9597662B2 (en) 2007-10-15 2017-03-21 SDCmaterials, Inc. Method and system for forming plug and play metal compound catalysts
US8575059B1 (en) 2007-10-15 2013-11-05 SDCmaterials, Inc. Method and system for forming plug and play metal compound catalysts
US9089840B2 (en) 2007-10-15 2015-07-28 SDCmaterials, Inc. Method and system for forming plug and play oxide catalysts
US8507401B1 (en) 2007-10-15 2013-08-13 SDCmaterials, Inc. Method and system for forming plug and play metal catalysts
US8481449B1 (en) 2007-10-15 2013-07-09 SDCmaterials, Inc. Method and system for forming plug and play oxide catalysts
US9302260B2 (en) 2007-10-15 2016-04-05 SDCmaterials, Inc. Method and system for forming plug and play metal catalysts
US9592492B2 (en) 2007-10-15 2017-03-14 SDCmaterials, Inc. Method and system for forming plug and play oxide catalysts
US8865611B2 (en) 2009-12-15 2014-10-21 SDCmaterials, Inc. Method of forming a catalyst with inhibited mobility of nano-active material
US8906498B1 (en) 2009-12-15 2014-12-09 SDCmaterials, Inc. Sandwich of impact resistant material
US8932514B1 (en) 2009-12-15 2015-01-13 SDCmaterials, Inc. Fracture toughness of glass
US8877357B1 (en) 2009-12-15 2014-11-04 SDCmaterials, Inc. Impact resistant material
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EP2004768B1 (de) 2009-08-26
FR2899594A1 (fr) 2007-10-12
JP5230601B2 (ja) 2013-07-10
ATE440922T1 (de) 2009-09-15
WO2007116038A1 (fr) 2007-10-18
US20120088352A1 (en) 2012-04-12
DE602007002178D1 (de) 2009-10-08

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