DE602007002178D1 - Verfahren zum assemblieren von substraten mit wärmebehandlungen bei niedrigen temperaturen - Google Patents

Verfahren zum assemblieren von substraten mit wärmebehandlungen bei niedrigen temperaturen

Info

Publication number
DE602007002178D1
DE602007002178D1 DE602007002178T DE602007002178T DE602007002178D1 DE 602007002178 D1 DE602007002178 D1 DE 602007002178D1 DE 602007002178 T DE602007002178 T DE 602007002178T DE 602007002178 T DE602007002178 T DE 602007002178T DE 602007002178 D1 DE602007002178 D1 DE 602007002178D1
Authority
DE
Germany
Prior art keywords
low temperatures
heat treatments
assembling substrates
substrates
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007002178T
Other languages
English (en)
Inventor
Remi Beneyton
Hubert Moriceau
Frank Fournel
Francois Rieutord
Tiec Yannick Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602007002178D1 publication Critical patent/DE602007002178D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1059—Splitting sheet lamina in plane intermediate of faces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Element Separation (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
DE602007002178T 2006-04-10 2007-04-06 Verfahren zum assemblieren von substraten mit wärmebehandlungen bei niedrigen temperaturen Active DE602007002178D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0651290A FR2899594A1 (fr) 2006-04-10 2006-04-10 Procede d'assemblage de substrats avec traitements thermiques a basses temperatures
PCT/EP2007/053428 WO2007116038A1 (fr) 2006-04-10 2007-04-06 Procede d'assemblage de substrats avec traitements thermiques a basses temperatures

Publications (1)

Publication Number Publication Date
DE602007002178D1 true DE602007002178D1 (de) 2009-10-08

Family

ID=37544382

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007002178T Active DE602007002178D1 (de) 2006-04-10 2007-04-06 Verfahren zum assemblieren von substraten mit wärmebehandlungen bei niedrigen temperaturen

Country Status (7)

Country Link
US (2) US20090162991A1 (de)
EP (1) EP2004768B1 (de)
JP (1) JP5230601B2 (de)
AT (1) ATE440922T1 (de)
DE (1) DE602007002178D1 (de)
FR (1) FR2899594A1 (de)
WO (1) WO2007116038A1 (de)

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WO2014039034A1 (en) 2012-09-05 2014-03-13 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for fabricating microelectronic devices with isolation trenches partially formed under active regions
US9156025B2 (en) 2012-11-21 2015-10-13 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
JP2014103291A (ja) * 2012-11-21 2014-06-05 Renesas Electronics Corp 半導体装置の製造方法
US9511352B2 (en) 2012-11-21 2016-12-06 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
EP3024571B1 (de) 2013-07-25 2020-05-27 Umicore AG & Co. KG Reinigungsbeschichtungen und beschichtete substrate für katalytische wandler
WO2015061477A1 (en) 2013-10-22 2015-04-30 SDCmaterials, Inc. Catalyst design for heavy-duty diesel combustion engines
EP3068517A4 (de) 2013-10-22 2017-07-05 SDCMaterials, Inc. Zusammensetzungen aus mager-nox-falle
CN106470752A (zh) 2014-03-21 2017-03-01 Sdc材料公司 用于被动nox吸附(pna)系统的组合物
FR3040108B1 (fr) 2015-08-12 2017-08-11 Commissariat Energie Atomique Procede de fabrication d'une structure semi-conductrice avec collage direct temporaire exploitant une couche poreuse
FR3085957B1 (fr) 2018-09-14 2021-01-29 Commissariat Energie Atomique Procede de collage temporaire avec adhesif thermoplastique incorporant une couronne rigide
FR3088480B1 (fr) 2018-11-09 2020-12-04 Commissariat Energie Atomique Procede de collage avec desorption stimulee electroniquement

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Also Published As

Publication number Publication date
JP2009533854A (ja) 2009-09-17
WO2007116038A1 (fr) 2007-10-18
ATE440922T1 (de) 2009-09-15
US20120088352A1 (en) 2012-04-12
US8530331B2 (en) 2013-09-10
EP2004768B1 (de) 2009-08-26
US20090162991A1 (en) 2009-06-25
JP5230601B2 (ja) 2013-07-10
FR2899594A1 (fr) 2007-10-12
EP2004768A1 (de) 2008-12-24

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