WO2013113311A3 - Thermoelektrisches generatormodul, metall-keramik-substrat sowie verfahren zum herstellen eines derartigen metall-keramik-substrates - Google Patents

Thermoelektrisches generatormodul, metall-keramik-substrat sowie verfahren zum herstellen eines derartigen metall-keramik-substrates Download PDF

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Publication number
WO2013113311A3
WO2013113311A3 PCT/DE2013/100020 DE2013100020W WO2013113311A3 WO 2013113311 A3 WO2013113311 A3 WO 2013113311A3 DE 2013100020 W DE2013100020 W DE 2013100020W WO 2013113311 A3 WO2013113311 A3 WO 2013113311A3
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WIPO (PCT)
Prior art keywords
metal
ceramic substrate
ceramic
thermoelectric generator
layer
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PCT/DE2013/100020
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English (en)
French (fr)
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WO2013113311A4 (de
WO2013113311A2 (de
Inventor
Andreas Meyer
Jürgen SCHULZ-HARDER
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Curamik Electronics Gmbh
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Application filed by Curamik Electronics Gmbh filed Critical Curamik Electronics Gmbh
Priority to JP2014553617A priority Critical patent/JP2015511397A/ja
Priority to EP13705093.6A priority patent/EP2810311A2/de
Priority to CN201380007259.2A priority patent/CN104106153A/zh
Priority to KR1020147019019A priority patent/KR20140123484A/ko
Priority to US14/368,372 priority patent/US20140345664A1/en
Publication of WO2013113311A2 publication Critical patent/WO2013113311A2/de
Publication of WO2013113311A3 publication Critical patent/WO2013113311A3/de
Publication of WO2013113311A4 publication Critical patent/WO2013113311A4/de

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/028—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
    • C—CHEMISTRY; METALLURGY
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die Erfindung betrifft ein thermoelektrisches Generatormodul mit einem Heiß- und Kaltbereich (1a, 1b) umfassend zumindest ein erstes, dem Heißbereich zugeordnetes Metall-Keramik-Substrat (2) mit einer ersten Keramikschicht (6) und wenigstens einer auf der ersten Keramikschicht (6) aufgebrachten, strukturierten ersten Metallisierung (4) und zumindest ein zweites, dem Kaltbereich (1b) zugeordnetes Metall-Keramik-Substrat (4) mit einer zweiten Keramikschicht (7) und wenigstens einer auf der zweiten Keramikschicht aufgebrachten, strukturierten zweiten Metallisierung (5) sowie mehreren zwischen der ersten und zweiten strukturierten Metallisierung (4, 5) der Metall-Keramik-Substrate (2, 3) aufgenommenen thermoelektrischen Generatorbauteilen (N, P). Besonders vorteilhaft weist das erste, dem Heißbereich (1a) zugeordnete Metall-Keramik-Substrat (2) zumindest eine Stahl- oder Edelstahlschicht (8) auf, wobei die erste Keramikschicht (6) zwischen der ersten strukturierten Metallisierung (4) und der zumindest einen Stahl- oder Edelstahlschicht (8) angeordnet ist. Ferner ist Gegenstand der Erfindung ein zugehöriges Metall-Keramik-Substrat sowie ein Verfahren zu dessen Herstellung.
PCT/DE2013/100020 2012-01-31 2013-01-22 Thermoelektrisches generatormodul, metall-keramik-substrat sowie verfahren zum herstellen eines derartigen metall-keramik-substrates WO2013113311A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014553617A JP2015511397A (ja) 2012-01-31 2013-01-22 熱電発電機モジュ−ル、金属−セラミック基板ならびにそのような種類の金属−セラミック基板の製造方法
EP13705093.6A EP2810311A2 (de) 2012-01-31 2013-01-22 Thermoelektrisches generatormodul, metall-keramik-substrat sowie verfahren zum herstellen eines derartigen metall-keramik-substrates
CN201380007259.2A CN104106153A (zh) 2012-01-31 2013-01-22 热电的发电模块、金属-陶瓷基体以及用于制造金属-陶瓷基体的方法
KR1020147019019A KR20140123484A (ko) 2012-01-31 2013-01-22 열전 발전기 모듈, 금속-세라믹 기판 및 금속 세라믹 기판을 생산하기 위한 방법
US14/368,372 US20140345664A1 (en) 2012-01-31 2013-01-22 Thermoelectric generator module, metal-ceramic substrate and method of producing such a metal-ceramic substrate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102012100752.7 2012-01-31
DE102012100752 2012-01-31
DE102012102090.6 2012-03-13
DE102012102090A DE102012102090A1 (de) 2012-01-31 2012-03-13 Thermoelektrisches Generatormodul, Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates

Publications (3)

Publication Number Publication Date
WO2013113311A2 WO2013113311A2 (de) 2013-08-08
WO2013113311A3 true WO2013113311A3 (de) 2013-10-03
WO2013113311A4 WO2013113311A4 (de) 2013-11-28

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PCT/DE2013/100020 WO2013113311A2 (de) 2012-01-31 2013-01-22 Thermoelektrisches generatormodul, metall-keramik-substrat sowie verfahren zum herstellen eines derartigen metall-keramik-substrates

Country Status (7)

Country Link
US (1) US20140345664A1 (de)
EP (1) EP2810311A2 (de)
JP (1) JP2015511397A (de)
KR (1) KR20140123484A (de)
CN (1) CN104106153A (de)
DE (1) DE102012102090A1 (de)
WO (1) WO2013113311A2 (de)

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JP2015097227A (ja) * 2013-11-15 2015-05-21 イビデン株式会社 複合配線板
JP2015097226A (ja) * 2013-11-15 2015-05-21 イビデン株式会社 複合配線板
DE102014203176A1 (de) * 2014-02-21 2015-09-10 MAHLE Behr GmbH & Co. KG Thermoelektrische Vorrichtung, insbesondere thermoelektrischer Generator oder Wärmepumpe
CN111998572B (zh) * 2014-05-23 2022-05-03 莱尔德热管理系统股份有限公司 包括电阻加热器的热电加热/冷却装置
CN105827149A (zh) * 2015-01-06 2016-08-03 厦门兰智科技有限公司 一种对热源能量进行多次吸收转换的热电转换装置
DE102016005368A1 (de) * 2016-05-04 2017-11-09 Gentherm Gmbh Hybride Thermoelektrische Vorrichtung
DE102016006063B4 (de) * 2016-05-19 2018-05-30 Gentherm Gmbh Einrichtung zum Wandeln elektrischer Energie in thermische Energie
EP3417982A1 (de) * 2017-06-21 2018-12-26 Heraeus Deutschland GmbH & Co. KG Laserschneiden von metall-keramik-substraten
KR20190088701A (ko) 2018-01-19 2019-07-29 엘지이노텍 주식회사 열전 소자
US20200370965A1 (en) * 2018-02-28 2020-11-26 Arthur Beckman Thermopile Assembly Providing a Massive Electrical Series of Thermocouple Elements
DE102020114290A1 (de) * 2020-05-28 2021-12-02 Eagleburgmann Germany Gmbh & Co. Kg Gleitringdichtungsanordnung mit Peltier-Element
CN112752394A (zh) * 2020-11-20 2021-05-04 仁诚科技(深圳)有限公司 一种具有散热层的金属印刷电路板
CN112599653B (zh) * 2020-12-04 2023-03-10 杭州大和热磁电子有限公司 一种适于冷热交变的热电模块及其制作方法

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WO2013113311A2 (de) 2013-08-08
US20140345664A1 (en) 2014-11-27
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