WO2012120060A3 - Verfahren zur herstellung eines thermoelektrischen moduls - Google Patents
Verfahren zur herstellung eines thermoelektrischen moduls Download PDFInfo
- Publication number
- WO2012120060A3 WO2012120060A3 PCT/EP2012/053945 EP2012053945W WO2012120060A3 WO 2012120060 A3 WO2012120060 A3 WO 2012120060A3 EP 2012053945 W EP2012053945 W EP 2012053945W WO 2012120060 A3 WO2012120060 A3 WO 2012120060A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermoelectric module
- housing element
- production
- metal housing
- fluid
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 abstract 2
- 239000011149 active material Substances 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N5/00—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy
- F01N5/02—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat
- F01N5/025—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat the device being thermoelectric generators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/12—Improving ICE efficiencies
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Coating By Spraying Or Casting (AREA)
- Resistance Heating (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/003,898 US10217923B2 (en) | 2011-03-08 | 2012-03-07 | Method for the production of a thermoelectric module |
CN201280012009.3A CN103460420B (zh) | 2011-03-08 | 2012-03-07 | 一种热电装置 |
EP12708537.1A EP2684226A2 (de) | 2011-03-08 | 2012-03-07 | Verfahren zur herstellung eines thermoelektrischen moduls |
DE112012001140.6T DE112012001140A5 (de) | 2011-03-08 | 2012-03-07 | Verfahren zur Herstellung eines thermoelektrischen Moduls |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011005246.1 | 2011-03-08 | ||
DE102011005246A DE102011005246A1 (de) | 2011-03-08 | 2011-03-08 | Verfahren zur Herstellung eines thermoelektrischen Moduls |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012120060A2 WO2012120060A2 (de) | 2012-09-13 |
WO2012120060A3 true WO2012120060A3 (de) | 2013-05-10 |
Family
ID=45819209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/053945 WO2012120060A2 (de) | 2011-03-08 | 2012-03-07 | Verfahren zur herstellung eines thermoelektrischen moduls |
Country Status (5)
Country | Link |
---|---|
US (1) | US10217923B2 (de) |
EP (1) | EP2684226A2 (de) |
CN (1) | CN103460420B (de) |
DE (2) | DE102011005246A1 (de) |
WO (1) | WO2012120060A2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011079467A1 (de) | 2011-07-20 | 2013-01-24 | Behr Gmbh & Co. Kg | Thermoelektrisches Modul, Verfahren zur Herstellung eines thermoelektrischen Moduls und Verwendung eines metallischen Glases oder eines gesinterten Werkstoffes |
DE102012103968A1 (de) * | 2012-05-07 | 2013-11-07 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Halbleiterelement für ein thermoelektrisches Modul und thermoelektrisches Modul |
DE102013202785A1 (de) | 2013-02-20 | 2014-08-21 | Behr Gmbh & Co. Kg | Thermoelektrisches Modul |
KR20150132209A (ko) * | 2013-03-15 | 2015-11-25 | 베카리우스 인코포레이티드 | 열전 장치 |
DE102013105294A1 (de) * | 2013-05-23 | 2014-11-27 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Wärmeübertrager, thermoelektrische Generatorvorrichtung und Verfahren zur Herstellung eines Wärmeübertragers |
DE102014216974A1 (de) * | 2014-08-26 | 2016-03-03 | Mahle International Gmbh | Thermoelektrisches Modul |
DE102014219756A1 (de) * | 2014-09-30 | 2016-03-31 | Evonik Degussa Gmbh | Plasma-Beschichten von thermoelektrischem Aktivmaterial mit Nickel und Zinn |
DE102015210398A1 (de) * | 2015-06-05 | 2016-12-08 | Bombardier Transportation Gmbh | Thermoelektrischer Generator zur Umwandlung von Wärme eines heißen Gasstroms in elektrische Energie |
DK3196951T3 (en) | 2016-01-21 | 2019-01-21 | Evonik Degussa Gmbh | RATIONAL PROCEDURE FOR POWDER METAL SURGICAL MANUFACTURING THERMOELECTRIC COMPONENTS |
JP2019143621A (ja) * | 2017-12-20 | 2019-08-29 | マグネティ マレッリ ソチエタ ペル アツィオニ | ターボチャージャ付き内燃熱機関のための熱電発電機を備えたインタークーラ |
JP7506054B2 (ja) | 2019-03-25 | 2024-06-25 | リンテック株式会社 | 熱電変換モジュール及び熱電変換モジュールを製造する方法 |
CN112670398B (zh) * | 2020-12-24 | 2022-12-20 | 深圳热电新能源科技有限公司 | 柔性复合热电薄膜及其制备方法和应用 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1103388A (en) * | 1965-07-02 | 1968-02-14 | Siemens Schuckterwerke Ag | Thermoelectric batteries |
GB1204884A (en) * | 1967-02-04 | 1970-09-09 | Ass Eng Ltd | Improvements in thermoelectric devices |
JP2003234515A (ja) * | 2002-02-08 | 2003-08-22 | Komatsu Ltd | 熱電モジュール |
JP2004274072A (ja) * | 2004-04-26 | 2004-09-30 | Yamaha Corp | 熱電モジュール用基板、その製造方法及び熱電モジュール |
US20100154855A1 (en) * | 2008-12-18 | 2010-06-24 | David Nemir | Thin walled thermoelectric devices and methods for production thereof |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3225549A (en) * | 1962-04-18 | 1965-12-28 | Thore M Elfving | Thermoelectric cooling device |
JP2599612B2 (ja) * | 1988-03-23 | 1997-04-09 | 臼井国際産業株式会社 | 排気ガス浄化用触媒を担持するための金属製担持母体 |
US5356484A (en) * | 1992-03-30 | 1994-10-18 | Yater Joseph C | Reversible thermoelectric converter |
US5875098A (en) * | 1995-04-06 | 1999-02-23 | Hi-Z Corporation | Thermoelectric module with gapless eggcrate |
JP3951315B2 (ja) * | 1995-05-26 | 2007-08-01 | 松下電工株式会社 | ペルチェモジュール |
CN1074689C (zh) * | 1996-04-04 | 2001-11-14 | E·O·帕通电子焊接研究院电子束工艺国际中心 | 基体上制备有跨厚度化学组成和结构梯度并陶瓷外层方法 |
DE10022726C2 (de) * | 1999-08-10 | 2003-07-10 | Matsushita Electric Works Ltd | Thermoelektrisches Modul mit verbessertem Wärmeübertragungsvermögen und Verfahren zum Herstellen desselben |
US6474060B2 (en) | 1999-11-17 | 2002-11-05 | Southwest Research Institute | Exhaust gas recirculation filtration system |
US6700053B2 (en) * | 2000-07-03 | 2004-03-02 | Komatsu Ltd. | Thermoelectric module |
EP1384271B1 (de) | 2001-04-24 | 2005-11-09 | Top-Cool Holding B.V. | Elektronisches kühlgerät |
US8426720B2 (en) * | 2004-01-09 | 2013-04-23 | Industrial Technology Research Institute | Micro thermoelectric device and manufacturing method thereof |
JP4686171B2 (ja) * | 2004-10-29 | 2011-05-18 | 株式会社東芝 | 熱−電気直接変換装置 |
JP2008108900A (ja) * | 2006-10-25 | 2008-05-08 | Toshiba Corp | 熱電変換モジュールおよび熱電変換装置 |
US20080149158A1 (en) * | 2006-12-20 | 2008-06-26 | Mark Logan | Thermal diodic devices and methods for manufacturing same |
JP2009117792A (ja) | 2007-10-19 | 2009-05-28 | Ube Ind Ltd | 熱電変換モジュール及びその製造方法 |
EP2180534B1 (de) | 2008-10-27 | 2013-10-16 | Corning Incorporated | Energieumwandlungsvorrichtungen und Verfahren |
US20100229911A1 (en) * | 2008-12-19 | 2010-09-16 | Hi-Z Technology Inc. | High temperature, high efficiency thermoelectric module |
DE102009013535A1 (de) * | 2009-03-19 | 2010-09-23 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung |
AT506262B1 (de) * | 2009-04-02 | 2011-07-15 | Avl List Gmbh | Thermoelektrische generatoreinheit |
DE102009036749A1 (de) | 2009-08-08 | 2011-02-10 | Daimler Ag | Thermoelektrischer Generator |
-
2011
- 2011-03-08 DE DE102011005246A patent/DE102011005246A1/de not_active Withdrawn
-
2012
- 2012-03-07 EP EP12708537.1A patent/EP2684226A2/de not_active Withdrawn
- 2012-03-07 DE DE112012001140.6T patent/DE112012001140A5/de not_active Withdrawn
- 2012-03-07 US US14/003,898 patent/US10217923B2/en not_active Expired - Fee Related
- 2012-03-07 WO PCT/EP2012/053945 patent/WO2012120060A2/de active Application Filing
- 2012-03-07 CN CN201280012009.3A patent/CN103460420B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1103388A (en) * | 1965-07-02 | 1968-02-14 | Siemens Schuckterwerke Ag | Thermoelectric batteries |
GB1204884A (en) * | 1967-02-04 | 1970-09-09 | Ass Eng Ltd | Improvements in thermoelectric devices |
JP2003234515A (ja) * | 2002-02-08 | 2003-08-22 | Komatsu Ltd | 熱電モジュール |
JP2004274072A (ja) * | 2004-04-26 | 2004-09-30 | Yamaha Corp | 熱電モジュール用基板、その製造方法及び熱電モジュール |
US20100154855A1 (en) * | 2008-12-18 | 2010-06-24 | David Nemir | Thin walled thermoelectric devices and methods for production thereof |
Also Published As
Publication number | Publication date |
---|---|
DE112012001140A5 (de) | 2014-01-16 |
US20140060605A1 (en) | 2014-03-06 |
EP2684226A2 (de) | 2014-01-15 |
DE102011005246A1 (de) | 2012-09-13 |
CN103460420B (zh) | 2016-06-08 |
US10217923B2 (en) | 2019-02-26 |
WO2012120060A2 (de) | 2012-09-13 |
CN103460420A (zh) | 2013-12-18 |
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