WO2012057517A3 - 화합물 반도체 장치 및 화합물 반도체 제조방법 - Google Patents
화합물 반도체 장치 및 화합물 반도체 제조방법 Download PDFInfo
- Publication number
- WO2012057517A3 WO2012057517A3 PCT/KR2011/008019 KR2011008019W WO2012057517A3 WO 2012057517 A3 WO2012057517 A3 WO 2012057517A3 KR 2011008019 W KR2011008019 W KR 2011008019W WO 2012057517 A3 WO2012057517 A3 WO 2012057517A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- compound semiconductor
- manufacturing
- layer
- semiconductor device
- graphene
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 3
- 229910021389 graphene Inorganic materials 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/02444—Carbon, e.g. diamond-like carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02499—Monolayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/38—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013536510A JP5676004B2 (ja) | 2010-10-26 | 2011-10-26 | 化合物半導体の製造方法 |
EP11836609.5A EP2634825B1 (en) | 2010-10-26 | 2011-10-26 | Method for manufacturing a compound semiconductor device |
US13/880,708 US9214596B2 (en) | 2010-10-26 | 2011-10-26 | Compound semiconductor devices and methods for fabricating the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100104552A KR101180176B1 (ko) | 2010-10-26 | 2010-10-26 | 화합물 반도체 장치 및 그 제조 방법 |
KR10-2010-0104552 | 2010-10-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012057517A2 WO2012057517A2 (ko) | 2012-05-03 |
WO2012057517A3 true WO2012057517A3 (ko) | 2012-07-26 |
Family
ID=45994548
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/008019 WO2012057517A2 (ko) | 2010-10-26 | 2011-10-26 | 화합물 반도체 장치 및 화합물 반도체 제조방법 |
PCT/KR2011/008009 WO2012057512A2 (ko) | 2010-10-26 | 2011-10-26 | 화합물 반도체 장치 및 그 제조 방법 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/008009 WO2012057512A2 (ko) | 2010-10-26 | 2011-10-26 | 화합물 반도체 장치 및 그 제조 방법 |
Country Status (5)
Country | Link |
---|---|
US (2) | US9214596B2 (ko) |
EP (2) | EP2634824B1 (ko) |
JP (2) | JP5676004B2 (ko) |
KR (1) | KR101180176B1 (ko) |
WO (2) | WO2012057517A2 (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103378223B (zh) * | 2012-04-25 | 2016-07-06 | 清华大学 | 外延结构体的制备方法 |
CN103378224B (zh) | 2012-04-25 | 2016-06-29 | 清华大学 | 外延结构的制备方法 |
CN103378239B (zh) * | 2012-04-25 | 2016-06-08 | 清华大学 | 外延结构体 |
JP2014237570A (ja) * | 2013-06-10 | 2014-12-18 | 日本電信電話株式会社 | 窒化物半導体基板の製造方法 |
KR101498688B1 (ko) * | 2013-07-08 | 2015-03-06 | 전북대학교산학협력단 | 그라핀층을 갖는 발광소자와 그 제조방법 |
JP6143598B2 (ja) * | 2013-08-01 | 2017-06-07 | 株式会社東芝 | 半導体装置 |
CN103741220A (zh) * | 2014-01-20 | 2014-04-23 | 山东大学 | 利用石墨烯或氧化石墨烯生长高质量氮化镓晶体的方法 |
CN106028874B (zh) | 2014-02-14 | 2020-01-31 | 金瑟姆股份公司 | 传导对流气候控制座椅 |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
CN107251247B (zh) * | 2014-11-14 | 2021-06-01 | 查尔斯·J·柯西 | 加热和冷却技术 |
KR102651544B1 (ko) * | 2016-11-21 | 2024-03-28 | 삼성전자주식회사 | 광대역 다기능 광학소자와 그 제조 및 동작방법 |
KR102115599B1 (ko) | 2016-12-27 | 2020-05-26 | 주식회사 엘지화학 | 분리막 및 이를 포함하는 리튬-황 전지 |
KR102115598B1 (ko) * | 2016-12-27 | 2020-05-26 | 주식회사 엘지화학 | 분리막 및 이를 포함하는 리튬-황 전지 |
KR102545880B1 (ko) * | 2017-04-12 | 2023-06-20 | 도쿄엘렉트론가부시키가이샤 | 유전체 기판 상에서의 유전체 물질의 선택적인 수직 성장 방법 |
US11034847B2 (en) | 2017-07-14 | 2021-06-15 | Samsung Electronics Co., Ltd. | Hardmask composition, method of forming pattern using hardmask composition, and hardmask formed from hardmask composition |
KR102433666B1 (ko) | 2017-07-27 | 2022-08-18 | 삼성전자주식회사 | 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크 |
KR102486388B1 (ko) * | 2017-07-28 | 2023-01-09 | 삼성전자주식회사 | 그래핀 양자점의 제조방법, 상기 제조방법에 따라 얻어진 그래핀 양자점을 포함한 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크 |
US10991869B2 (en) | 2018-07-30 | 2021-04-27 | Gentherm Incorporated | Thermoelectric device having a plurality of sealing materials |
CN109037404B (zh) * | 2018-08-01 | 2019-06-18 | 广东旭宇光电有限公司 | 植物萌芽照射二极管及其制备方法和植物萌芽照射灯 |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
CN110246943B (zh) * | 2019-06-17 | 2021-12-07 | 湘能华磊光电股份有限公司 | 基于石墨烯的led外延生长方法 |
EP3940763A1 (en) * | 2020-07-14 | 2022-01-19 | IMEC vzw | Method of manufacturing a semiconductor structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040029165A (ko) * | 1998-03-12 | 2004-04-03 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자 |
KR20090059871A (ko) * | 2007-12-07 | 2009-06-11 | 삼성전자주식회사 | 도펀트로 도핑된 산화그라펜의 환원물, 이를 포함하는 박막및 투명전극 |
KR20100042122A (ko) * | 2008-10-15 | 2010-04-23 | 고려대학교 산학협력단 | 반도체 발광 소자 및 그 제조 방법 |
KR20100055098A (ko) * | 2008-11-17 | 2010-05-26 | 천승현 | 대면적 그래핀 층을 포함하는 전자 장치 및 이의 제조방법 |
KR20100094908A (ko) * | 2009-02-19 | 2010-08-27 | 양원동 | 그라핀 소재가 인설된 엘이디 조명기구 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2645768B2 (ja) | 1991-07-22 | 1997-08-25 | コパル電子株式会社 | 動圧空気軸受型光偏向器 |
JP3620269B2 (ja) | 1998-02-27 | 2005-02-16 | 豊田合成株式会社 | GaN系半導体素子の製造方法 |
JP3650531B2 (ja) * | 1998-08-24 | 2005-05-18 | 三菱電線工業株式会社 | GaN系結晶基材およびその製造方法 |
JP2001057463A (ja) * | 1999-06-07 | 2001-02-27 | Sharp Corp | 窒素化合物半導体膜構造及び窒素化合物半導体素子並びにそれらの製造方法 |
JP3589200B2 (ja) * | 2000-06-19 | 2004-11-17 | 日亜化学工業株式会社 | 窒化物半導体基板及びその製造方法、並びにその窒化物半導体基板を用いた窒化物半導体素子 |
JP2002033512A (ja) * | 2000-07-13 | 2002-01-31 | Nichia Chem Ind Ltd | 窒化物半導体発光ダイオード |
JP2002299249A (ja) * | 2001-03-29 | 2002-10-11 | Sanyo Electric Co Ltd | 半導体基板、半導体素子および半導体層の形成方法 |
JP2004055864A (ja) * | 2002-07-22 | 2004-02-19 | Fuji Photo Film Co Ltd | 半導体素子用基板の製造方法および半導体素子用基板ならびに半導体素子 |
JP2003078214A (ja) | 2002-08-26 | 2003-03-14 | Nec Corp | 窒化物半導体発光素子 |
JP2006344618A (ja) * | 2005-06-07 | 2006-12-21 | Fujifilm Holdings Corp | 機能性膜含有構造体、及び、機能性膜の製造方法 |
JP2008277430A (ja) | 2007-04-26 | 2008-11-13 | Matsushita Electric Ind Co Ltd | 窒化物半導体発光素子 |
JP5276852B2 (ja) | 2008-02-08 | 2013-08-28 | 昭和電工株式会社 | Iii族窒化物半導体エピタキシャル基板の製造方法 |
JP5326336B2 (ja) * | 2008-04-18 | 2013-10-30 | 三菱瓦斯化学株式会社 | 導電体及びその製造方法 |
JP2009302314A (ja) | 2008-06-13 | 2009-12-24 | Rohm Co Ltd | GaN系半導体装置 |
TW201012749A (en) * | 2008-08-19 | 2010-04-01 | Univ Rice William M | Methods for preparation of graphene nanoribbons from carbon nanotubes and compositions, thin films and devices derived therefrom |
US8368118B2 (en) | 2008-12-16 | 2013-02-05 | Hewlett-Packard Development Company, L.P. | Semiconductor structure having an ELOG on a thermally and electrically conductive mask |
JP2010232464A (ja) * | 2009-03-27 | 2010-10-14 | Showa Denko Kk | Iii族窒化物半導体発光素子及びその製造方法、並びにレーザダイオード |
KR101156620B1 (ko) * | 2009-04-08 | 2012-06-14 | 한국전자통신연구원 | 그라핀 채널층을 가지는 전계 효과 트랜지스터 |
US8317984B2 (en) * | 2009-04-16 | 2012-11-27 | Northrop Grumman Systems Corporation | Graphene oxide deoxygenation |
JP5070247B2 (ja) * | 2009-06-23 | 2012-11-07 | 株式会社沖データ | 半導体装置の製造方法、及び半導体装置 |
US8409366B2 (en) * | 2009-06-23 | 2013-04-02 | Oki Data Corporation | Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof |
JP4527194B1 (ja) * | 2009-12-11 | 2010-08-18 | エンパイア テクノロジー ディベロップメント エルエルシー | グラフェン構造体、グラフェン構造体の製造方法、及び電子デバイス |
-
2010
- 2010-10-26 KR KR1020100104552A patent/KR101180176B1/ko active IP Right Grant
-
2011
- 2011-10-26 JP JP2013536510A patent/JP5676004B2/ja active Active
- 2011-10-26 EP EP11836604.6A patent/EP2634824B1/en active Active
- 2011-10-26 US US13/880,708 patent/US9214596B2/en active Active
- 2011-10-26 EP EP11836609.5A patent/EP2634825B1/en active Active
- 2011-10-26 US US13/880,706 patent/US8878233B2/en active Active
- 2011-10-26 WO PCT/KR2011/008019 patent/WO2012057517A2/ko active Application Filing
- 2011-10-26 JP JP2013536509A patent/JP5779655B2/ja active Active
- 2011-10-26 WO PCT/KR2011/008009 patent/WO2012057512A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040029165A (ko) * | 1998-03-12 | 2004-04-03 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물 반도체 소자 |
KR20090059871A (ko) * | 2007-12-07 | 2009-06-11 | 삼성전자주식회사 | 도펀트로 도핑된 산화그라펜의 환원물, 이를 포함하는 박막및 투명전극 |
KR20100042122A (ko) * | 2008-10-15 | 2010-04-23 | 고려대학교 산학협력단 | 반도체 발광 소자 및 그 제조 방법 |
KR20100055098A (ko) * | 2008-11-17 | 2010-05-26 | 천승현 | 대면적 그래핀 층을 포함하는 전자 장치 및 이의 제조방법 |
KR20100094908A (ko) * | 2009-02-19 | 2010-08-27 | 양원동 | 그라핀 소재가 인설된 엘이디 조명기구 |
Also Published As
Publication number | Publication date |
---|---|
US8878233B2 (en) | 2014-11-04 |
WO2012057512A3 (ko) | 2012-07-26 |
JP5779655B2 (ja) | 2015-09-16 |
WO2012057517A2 (ko) | 2012-05-03 |
EP2634824A2 (en) | 2013-09-04 |
EP2634825A2 (en) | 2013-09-04 |
EP2634825A4 (en) | 2016-01-06 |
US9214596B2 (en) | 2015-12-15 |
EP2634825B1 (en) | 2018-12-26 |
KR20120043313A (ko) | 2012-05-04 |
US20130200424A1 (en) | 2013-08-08 |
WO2012057512A2 (ko) | 2012-05-03 |
JP5676004B2 (ja) | 2015-02-25 |
KR101180176B1 (ko) | 2012-09-05 |
EP2634824A4 (en) | 2016-01-06 |
JP2014501035A (ja) | 2014-01-16 |
US20130285013A1 (en) | 2013-10-31 |
EP2634824B1 (en) | 2018-12-12 |
JP2013545299A (ja) | 2013-12-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2012057517A3 (ko) | 화합물 반도체 장치 및 화합물 반도체 제조방법 | |
WO2012040080A3 (en) | Microelectronic transistor having an epitaxial graphene channel layer | |
WO2011075228A3 (en) | Isolation for nanowire devices | |
WO2013051875A3 (ko) | 유기 발광 소자 및 이의 제조방법 | |
WO2009108173A3 (en) | Methods for formation of substrate elements | |
EP2381018A4 (en) | COMPOSITE SUBSTRATE, SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT | |
WO2013009007A3 (en) | Optical member, display device having the same and method of fabricating the same | |
WO2012121940A3 (en) | Methods of forming polycrystalline elements and structures formed by such methods | |
WO2012138903A3 (en) | Dual active layers for semiconductor devices and methods of manufacturing the same | |
WO2012013361A3 (en) | A polymeric substrate having a glass-like surface and a chip made of said polymeric substrate | |
WO2011090570A3 (en) | Semiconductor package with embedded die and its methods of fabrication | |
WO2011109146A3 (en) | Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures | |
EP2908330A4 (en) | GROUP III NITRIDE COMPOUND SUBSTRATE, MANUFACTURING METHOD AND PRODUCTION METHOD FOR A GROUP III NITRIDE SEMICONDUCTOR ELEMENT | |
SG11201406941TA (en) | Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package | |
EP2514858A4 (en) | GROUP III NITRIDE CRYSTAL SUBSTRATE, GROUP III NITRIDE CRYSTAL SUBSTRATE HAVING AN EPITAXIAL LAYER, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF | |
EP2610898A4 (en) | EPITACTICAL SUBSTRATE FOR A SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT, METHOD FOR PRODUCING THE EPITACTIC SUBSTRATE FOR A SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THE SEMICONDUCTOR ELEMENT | |
WO2014049052A3 (de) | Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements | |
EP2503560A4 (en) | Substrate for superconducting compound and method for manufacturing the substrate | |
WO2011124205A3 (de) | Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate | |
WO2014063670A3 (de) | Verfahren zur herstellung einer nanoporösen schicht auf einem substrat | |
EP2631940A4 (en) | Semiconductor chip package, semiconductor module, and method for manufacturing same | |
WO2013056831A3 (de) | Bohrer mit beschichtung | |
WO2012047069A3 (ko) | 발광소자 및 그 제조방법 | |
SG162653A1 (en) | Method for fabricating a semiconductor substrate and semiconductor substrate | |
WO2012105800A3 (ko) | 나노전력발전소자 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11836609 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13880708 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 2013536510 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011836609 Country of ref document: EP |