WO2011111989A3 - 금속접합 세라믹기판 - Google Patents

금속접합 세라믹기판 Download PDF

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Publication number
WO2011111989A3
WO2011111989A3 PCT/KR2011/001609 KR2011001609W WO2011111989A3 WO 2011111989 A3 WO2011111989 A3 WO 2011111989A3 KR 2011001609 W KR2011001609 W KR 2011001609W WO 2011111989 A3 WO2011111989 A3 WO 2011111989A3
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WO
WIPO (PCT)
Prior art keywords
metal
ceramic substrate
metal layers
circuit pattern
present
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Application number
PCT/KR2011/001609
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English (en)
French (fr)
Other versions
WO2011111989A2 (ko
Inventor
김경환
한문수
박준희
Original Assignee
주식회사 케이씨씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 케이씨씨 filed Critical 주식회사 케이씨씨
Priority to JP2012556974A priority Critical patent/JP5642808B2/ja
Priority to EP11753594.8A priority patent/EP2546870A4/en
Publication of WO2011111989A2 publication Critical patent/WO2011111989A2/ko
Publication of WO2011111989A3 publication Critical patent/WO2011111989A3/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/365—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 금속접합 세라믹기판에 관한 것이다. 본 발명은 표면에 금속층이 접합되어 회로패턴을 형성하는 세라믹기판에 관한 것이다. 회로패턴을 형성하는 금속층은 다수개가 열 및 행으로 배치된다. 그리고, 세라믹기판의 적어도 일면에는 금속층의 외곽에 위치하도록 추가 금속층이 가장자리를 따라 형성된다. 또한, 금속층 사이의 간격은 금속층과 추가 금속층 사이의 간격과 동일하게 형성됨이 바람직하다. 이와 같은 본 발명에 의하면, 본 발명에 의하면, 회로를 형성하기 위한 에칭공정 중 회로패턴의 편차를 줄여 치수 정밀도를 개선하고, 반도체 칩을 실장하기 위한 납재층 열처리 시 온도편차를 줄여 반도체 칩의 접합특성을 향상시킬 수 있으며, 금속과 세라믹의 열팽창계수 차이에 의해 발생되는 휨을 완화 또는 인위적으로 조절할 수 있는 효과가 있다.
PCT/KR2011/001609 2010-03-09 2011-03-09 금속접합 세라믹기판 WO2011111989A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012556974A JP5642808B2 (ja) 2010-03-09 2011-03-09 金属接合セラミック基板
EP11753594.8A EP2546870A4 (en) 2010-03-09 2011-03-09 Metal-bonded ceramic substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100020879A KR101675727B1 (ko) 2010-03-09 2010-03-09 금속접합 세라믹기판
KR10-2010-0020879 2010-03-09

Publications (2)

Publication Number Publication Date
WO2011111989A2 WO2011111989A2 (ko) 2011-09-15
WO2011111989A3 true WO2011111989A3 (ko) 2012-01-05

Family

ID=44563992

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001609 WO2011111989A2 (ko) 2010-03-09 2011-03-09 금속접합 세라믹기판

Country Status (4)

Country Link
EP (1) EP2546870A4 (ko)
JP (1) JP5642808B2 (ko)
KR (1) KR101675727B1 (ko)
WO (1) WO2011111989A2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101733442B1 (ko) * 2014-12-29 2017-05-10 주식회사 케이씨씨 기판의 휨 방지 구조체
CN108059485B (zh) * 2017-12-05 2023-06-13 上海铠琪科技有限公司 一种微型超薄氮化铝陶瓷电路板及制备方法
WO2019225273A1 (ja) * 2018-05-23 2019-11-28 住友ベークライト株式会社 回路基板の製造方法
CN113614261A (zh) * 2019-03-25 2021-11-05 京瓷株式会社 电路衬底及具备它的散热衬底或电子设备
KR20200127511A (ko) * 2019-05-02 2020-11-11 주식회사 아모센스 세라믹 기판 및 그의 제조방법
KR102244833B1 (ko) 2019-12-10 2021-04-27 주식회사 유텔 적층형 lcp 전자소자
CN113764292B (zh) * 2021-11-08 2022-03-01 上海曦智科技有限公司 半导体装置及其制造方法
CN117116775B (zh) * 2023-09-25 2024-03-26 江苏富乐华半导体科技股份有限公司 一种厚金属层陶瓷基板的图形设计方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019126A (ja) * 2005-07-06 2007-01-25 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体
JP2007019123A (ja) * 2005-07-06 2007-01-25 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体
JP2007324277A (ja) * 2006-05-31 2007-12-13 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0398485B1 (en) * 1989-05-16 1995-08-09 Gec-Marconi Limited A method of making a Flip Chip Solder bond structure for devices with gold based metallisation
JP2876989B2 (ja) * 1994-05-31 1999-03-31 松下電工株式会社 プリント配線板の製造方法
JP4077888B2 (ja) * 1995-07-21 2008-04-23 株式会社東芝 セラミックス回路基板
WO1998054761A1 (fr) * 1997-05-26 1998-12-03 Sumitomo Electric Industries, Ltd. Substrat jonction de circuit en cuivre et procede de production de ce substrat
JP4168114B2 (ja) * 2001-09-28 2008-10-22 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019126A (ja) * 2005-07-06 2007-01-25 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体
JP2007019123A (ja) * 2005-07-06 2007-01-25 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体
JP2007324277A (ja) * 2006-05-31 2007-12-13 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体

Also Published As

Publication number Publication date
KR20110101692A (ko) 2011-09-16
JP5642808B2 (ja) 2014-12-17
EP2546870A4 (en) 2017-11-29
KR101675727B1 (ko) 2016-11-14
JP2013522872A (ja) 2013-06-13
EP2546870A2 (en) 2013-01-16
WO2011111989A2 (ko) 2011-09-15

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