US20070007558A1 - Light emitting diode package and method for making same - Google Patents

Light emitting diode package and method for making same Download PDF

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Publication number
US20070007558A1
US20070007558A1 US11/475,292 US47529206A US2007007558A1 US 20070007558 A1 US20070007558 A1 US 20070007558A1 US 47529206 A US47529206 A US 47529206A US 2007007558 A1 US2007007558 A1 US 2007007558A1
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US
United States
Prior art keywords
pwb
led
heat sink
led package
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/475,292
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English (en)
Inventor
Joseph Mazzochette
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lamina Ceramics Inc
Lighting Science Group Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US11/475,292 priority Critical patent/US20070007558A1/en
Application filed by Individual filed Critical Individual
Assigned to LAMINA CERAMICS, INC. reassignment LAMINA CERAMICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAZZOCHETTE, JOSEPH
Publication of US20070007558A1 publication Critical patent/US20070007558A1/en
Assigned to LAMINA LIGHTING, INC. reassignment LAMINA LIGHTING, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: LAMINA CERAMICS, INC.
Priority to US12/135,042 priority patent/US8129734B2/en
Assigned to LIGHTING SCIENCE GROUP CORPORATION reassignment LIGHTING SCIENCE GROUP CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAMINA LIGHTING, INC., LLI ACQUISITION, INC.
Assigned to WELLS FARGO BANK, NATIONAL ASSOCIATION reassignment WELLS FARGO BANK, NATIONAL ASSOCIATION SECURITY AGREEMENT Assignors: LIGHTING SCIENCE GROUP CORPORATION
Assigned to ARES CAPITAL CORPORATION reassignment ARES CAPITAL CORPORATION SECURITY AGREEMENT Assignors: LIGHTING SCIENCE GROUP CORPORATION
Priority to US13/354,684 priority patent/US20120110842A1/en
Assigned to LIGHTING SCIENCE GROUP CORPORATION reassignment LIGHTING SCIENCE GROUP CORPORATION RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: WELLS FARGO BANK, NATIONAL ASSOCIATION
Assigned to LIGHTING SCIENCE GROUP CORPORATION reassignment LIGHTING SCIENCE GROUP CORPORATION RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: ARES CAPITAL CORPORATION
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/13—Severing followed by associating with part from same source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
US11/475,292 2005-06-27 2006-06-27 Light emitting diode package and method for making same Abandoned US20070007558A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/475,292 US20070007558A1 (en) 2005-06-27 2006-06-27 Light emitting diode package and method for making same
US12/135,042 US8129734B2 (en) 2005-06-27 2008-06-06 LED package with stepped aperture
US13/354,684 US20120110842A1 (en) 2005-06-27 2012-01-20 Led package with stepped aperture

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US69478805P 2005-06-27 2005-06-27
US73847805P 2005-11-21 2005-11-21
US76382806P 2006-01-31 2006-01-31
US11/475,292 US20070007558A1 (en) 2005-06-27 2006-06-27 Light emitting diode package and method for making same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/135,042 Division US8129734B2 (en) 2005-06-27 2008-06-06 LED package with stepped aperture

Publications (1)

Publication Number Publication Date
US20070007558A1 true US20070007558A1 (en) 2007-01-11

Family

ID=37595967

Family Applications (3)

Application Number Title Priority Date Filing Date
US11/475,292 Abandoned US20070007558A1 (en) 2005-06-27 2006-06-27 Light emitting diode package and method for making same
US12/135,042 Expired - Fee Related US8129734B2 (en) 2005-06-27 2008-06-06 LED package with stepped aperture
US13/354,684 Abandoned US20120110842A1 (en) 2005-06-27 2012-01-20 Led package with stepped aperture

Family Applications After (2)

Application Number Title Priority Date Filing Date
US12/135,042 Expired - Fee Related US8129734B2 (en) 2005-06-27 2008-06-06 LED package with stepped aperture
US13/354,684 Abandoned US20120110842A1 (en) 2005-06-27 2012-01-20 Led package with stepped aperture

Country Status (6)

Country Link
US (3) US20070007558A1 (ko)
EP (1) EP1897146A2 (ko)
JP (2) JP2009502024A (ko)
KR (1) KR20080042798A (ko)
TW (1) TW200709475A (ko)
WO (1) WO2007002644A2 (ko)

Cited By (47)

* Cited by examiner, † Cited by third party
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US20070081360A1 (en) * 2005-06-28 2007-04-12 Edward Bailey Display backlight with improved light coupling and mixing
US20080062701A1 (en) * 2005-06-28 2008-03-13 Lamina Lighting, Inc. Light efficient led assembly including a shaped reflective cavity and method for making same
US20080203416A1 (en) * 2007-02-22 2008-08-28 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
US20080203417A1 (en) * 2007-02-22 2008-08-28 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
US20080308825A1 (en) * 2007-06-14 2008-12-18 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
WO2009049453A1 (fr) * 2007-10-15 2009-04-23 Foshan Nationstar Optoelectronics Limited Liability Company Structure d'encapsulation de del de puissance
US20090171013A1 (en) * 2007-12-26 2009-07-02 Taguchi Yusuke White heat-curable silicone resin composition, optoelectronic part case, and molding method
US20090239997A1 (en) * 2008-03-18 2009-09-24 Taguchi Yusuke White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case
DE102008026627B3 (de) * 2008-06-03 2009-10-29 Siemens Aktiengesellschaft Kühlsystem für LED-Chip-Anordnung
US20090267086A1 (en) * 2008-04-29 2009-10-29 Wei Shi Thermal Management For LED
US20090301765A1 (en) * 2008-03-31 2009-12-10 Osram Printed circuit board
US20090306263A1 (en) * 2008-06-09 2009-12-10 Taguchi Yusuke White heat-curable silicone resin composition and optoelectronic part case
US20090304961A1 (en) * 2008-06-09 2009-12-10 Taguchi Yusuke White heat-curable silicone resin composition and optoelectronic part case
US20090315059A1 (en) * 2005-04-08 2009-12-24 Sharp Kabushiki Kaisha Light emitting diode
US20100006886A1 (en) * 2008-07-10 2010-01-14 Brilliant Technology Co., Ltd. High power light emitting diode chip package carrier structure
US20100025718A1 (en) * 2008-07-31 2010-02-04 Wei Shi Top contact LED thermal management
US20100060157A1 (en) * 2008-09-10 2010-03-11 Wei Shi Phosphor layer arrangement for use with light emitting diodes
WO2010036759A1 (en) * 2008-09-26 2010-04-01 Bridgelux, Inc. Machined surface led assembly
US20100079994A1 (en) * 2008-09-26 2010-04-01 Wei Shi Multi-cup led assembly
US20100078662A1 (en) * 2008-09-26 2010-04-01 Wei Shi Non-global solder mask led assembly
US20100080006A1 (en) * 2008-09-26 2010-04-01 Alex Shaikevitch Transparent ring led assembly
US20100237790A1 (en) * 2006-05-22 2010-09-23 Permlight Products, Inc. System and method for selectively dimming an led
WO2010112419A1 (de) 2009-03-31 2010-10-07 Siemens Aktiengesellschaft Led-lichtquelle mit einer vielzahl von led-chips und led-chip zur verwendung in selbiger
US20110095310A1 (en) * 2008-03-26 2011-04-28 Shimane Prefectural Government Semiconductor light emitting module and method of manufacturing the same
US20110140083A1 (en) * 2009-12-16 2011-06-16 Daniel Carleton Driscoll Semiconductor Device Structures with Modulated Doping and Related Methods
US7994512B2 (en) 2001-07-23 2011-08-09 Cree, Inc. Gallium nitride based diodes with low forward voltage and low reverse current operation
CN102214769A (zh) * 2010-04-12 2011-10-12 富士迈半导体精密工业（上海）有限公司 固态发光元件及具有该固态发光元件的光源模组
US8058664B2 (en) 2008-09-26 2011-11-15 Bridgelux, Inc. Transparent solder mask LED assembly
WO2012016760A1 (de) * 2010-08-02 2012-02-09 Osram Opto Semiconductors Gmbh Optoelektronisches leuchtmodul und kfz-scheinwerfer
WO2012032012A1 (de) * 2010-09-10 2012-03-15 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauelement und verfahren zu dessen herstellung
EP2447595A1 (en) * 2010-10-27 2012-05-02 LG Innotek Co., Ltd. Light emitting module
US8188503B2 (en) 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
US8354745B2 (en) 2010-04-20 2013-01-15 Intellectual Discovery Co., Ltd. Electronic assembly
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8507924B2 (en) 2004-07-02 2013-08-13 Cree, Inc. Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming
US8519437B2 (en) 2007-09-14 2013-08-27 Cree, Inc. Polarization doping in nitride based diodes
US8536615B1 (en) 2009-12-16 2013-09-17 Cree, Inc. Semiconductor device structures with modulated and delta doping and related methods
US8716735B2 (en) 2011-03-08 2014-05-06 Lextar Electronics Corp. Light-emitting diode with metal structure and heat sink
US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
US20150353733A1 (en) * 2014-06-06 2015-12-10 Shin-Etsu Chemical Co., Ltd. White thermosetting silicone resin composition for a light-emitting semiconductor device and a case for installing a light-emitting semiconductor element
US9236547B2 (en) 2011-08-17 2016-01-12 3M Innovative Properties Company Two part flexible light emitting semiconductor device
US20160013382A1 (en) * 2014-07-08 2016-01-14 Lg Innotek Co., Ltd. Light emitting device package
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US8129734B2 (en) 2012-03-06
US20120110842A1 (en) 2012-05-10
US20080296599A1 (en) 2008-12-04
TW200709475A (en) 2007-03-01
JP2009502024A (ja) 2009-01-22
WO2007002644A2 (en) 2007-01-04
JP5600699B2 (ja) 2014-10-01
WO2007002644A3 (en) 2009-04-16
KR20080042798A (ko) 2008-05-15

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