US20020036066A1 - Method and apparatus for processing substrates - Google Patents
Method and apparatus for processing substrates Download PDFInfo
- Publication number
- US20020036066A1 US20020036066A1 US09/960,947 US96094701A US2002036066A1 US 20020036066 A1 US20020036066 A1 US 20020036066A1 US 96094701 A US96094701 A US 96094701A US 2002036066 A1 US2002036066 A1 US 2002036066A1
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- Prior art keywords
- gas
- natural oxide
- oxide film
- processing chamber
- wafers
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- Abandoned
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- 239000000758 substrate Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title description 60
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- 238000009826 distribution Methods 0.000 claims description 34
- 238000002347 injection Methods 0.000 claims description 16
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/335—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Definitions
- the present invention relates to a substrate processing apparatus; and, more particularly, to a method and apparatus for removing a natural oxide film formed on a substrate to be processed in the course of manufacturing, e.g., a semiconductor device.
- a batch type vertical hot wall furnace (hereinafter, referred to as a heat-treating apparatus) is widely used to perform a heat-treatment such as a film formation, an annealing process, an oxide film forming process or a diffusion process on silicon wafers (hereinafter, referred to as wafers).
- a natural oxide film is formed on the wafer due to oxygen or moisture in the air.
- the natural oxide film formed on the wafer is a silicon oxide film having an incomplete crystallinity.
- a film quality of the natural oxide film is inferior to that of a silicon oxide film formed through a controlled thermal oxidization process. Accordingly, semiconductor devices manufactured by using the wafer having the natural oxide film formed thereon exhibit many an adverse effect on their device characteristics as follows.
- a natural film formed on a wafer is generally removed by cleaning the wafer with a hydrogen fluoride (hereinafter, HF) before being subject to a desired heat-treatment (hereinafter, a main treatment) process in a heat treating apparatus.
- HF hydrogen fluoride
- a desired heat-treatment hereinafter, a main treatment
- a natural oxide film having a thickness of 1 to 2 atomic layers can be formed again on the cleaned wafer.
- a degree of design freedom of the processing line may be limited.
- minute trenches of scaled-down semiconductor devices may not be properly cleaned through the HF cleaning process because the HF cleaning is a wet process.
- the remote plasma cleaning is a technique for removing residual by-products attached to the process room by introducing into the processing chamber radicals activated in a remote plasma unit disposed outside the processing chamber.
- the natural oxide film removing method through the use of the remote plasma cleaning technique has certain drawbacks as follows. If a natural oxide film removing gas for dry-etching the natural oxide film is not properly activated, plasma damage may occur on the wafer or an etching selectivity may not be obtained, resulting in the failure to remove the natural oxide film. Further, when a plurality of wafers are simultaneously processed so as to improve a throughput, if the uniformity of natural oxide film removing gas is not maintained between the wafers and within each wafer, the natural oxide films may not be removed uniformly.
- a substrate processing apparatus including:
- a natural oxide film removing gas including a first gas activated by a second gas activated by a plasma discharge is supplied to the processing chamber through the gas supply line to remove a natural oxide film on a wafer
- first gas and the second gas are supplied to the gas supply line along a first direction and a second direction and an angle between the first and the second direction ranges from about 90° to 180°.
- a substrate processing apparatus including;
- a remote plasma unit disposed outside the processing chamber for supplying an activated natural oxide film removing gas to the processing chamber;
- a distribution device which distributes the natural oxide film removing gas to flow parallel to the wafers.
- FIG. 1 is a side cross sectional view of a batch type natural oxide film removing apparatus in accordance with a first embodiment of the present invention
- FIGS. 2A to 2 C explain a natural oxide film removing process
- FIG. 3 provides a side cross sectional view of a single wafer type natural oxide film removing apparatus in accordance with a second embodiment of the present invention
- FIGS. 4A to 4 C illustrate various locations of a gas supply line in accordance with the present invention
- FIG. 5 sets forth a side cross sectional view of a batch type natural oxide film removing apparatus in accordance with a third embodiment of the present invention
- FIG. 6 offers a top cross sectional view of the natural oxide film removing apparatus shown in FIG. 5;
- FIGS. 7A to 7 C show various types of distribution plates in accordance with the present invention.
- FIG. 8 gives a side cross sectional view of a batch type natural oxide film removing apparatus in accordance with a fourth embodiment of the present invention.
- FIG. 9 exhibits a cross sectional view of a batch type natural oxide film removing apparatus in accordance with still another embodiment of the present invention.
- a substrate processing apparatus in accordance with a first preferred embodiment of the present invention, which is a natural oxide films removing apparatus for removing a natural oxide film formed on a surface of a semiconductor wafer by using a remote plasma cleaning technique.
- the natural oxide film removing apparatus 10 is configured to perform a batch process in which a plurality of the semiconductor wafers are simultaneously subject to a natural oxide film removing process.
- the natural oxide film removing apparatus 10 performing a batch process includes a process tube 11 forming therein a processing chamber 12 in which the natural oxide film removing process is carried out.
- the process tube 11 is of a single-bodied right circular cylinder made of quartz with both ends thereof closed.
- the process tube 11 is vertically installed such that the axial line thereof is perpendicular to the ground.
- the bottom end of the process tube 11 has a turntable 13 rotatably installed thereon for holding a boat 15 .
- the turntable 13 is concentric with the bottom end and rotated by a rotary actuator 14 installed outside the process tube 11 at a lower surface of the bottom end.
- the boat 15 is disposed on the turntable 13 in order to accommodate therein a plurality of the wafers 1 , wherein the turntable 13 rotates in unison with the boat 15 .
- the boat 15 has an upper and a lower plate 16 , 17 and support rods 18 (three support rods in this embodiment) vertically arranged therebetween.
- the support rods 18 have a plurality of vertically arranged wafer mount groove portions 19 , such that a number of wafers can be held horizontally with an identical gap therebetween by the groove portions 19 .
- the lower plate 17 of the boat 15 is removably fixed on an upper surface of the turntable 13 .
- the wafers 1 are transferred into the process tube 11 through a wafer transfer opening (not shown) formed at a portion of the side wall of the processing chamber 12 by a wafer transfer device (not shown) in such a manner that the wafers 1 are horizontally and concentrically inserted into the wafer mount groove portions 19 .
- an exhaust port 20 is connected to the side wall of the process tube 11 in such a manner that the exhaust port 20 communicates with the processing chamber 12 , wherein height of the exhaust port 20 is approximately identical to that of the process tube 11 .
- an exhaust line 21 Connected to the exhaust port 20 is an exhaust line 21 for evacuating the process tube 11 .
- a gas supply port 22 is connected to a portion of the side wall of the process tube 11 opposite to the exhaust port 20 in such a manner that the gas supply port 22 communicates with the processing chamber 12 , wherein the height of the gas supply port 22 is approximately same as that of the process tube 11 .
- One end of a gas supply line 23 is connected to a middle portion of the gas supply port 22 in such a manner that the gas supply line 23 can horizontally supply gases into the processing chamber 12 .
- the other end of the gas supply line 23 is connected to a plasma chamber 25 in which plasma 24 is formed.
- a plasma generator 26 is installed outside the plasma chamber 25 to generate the plasma 24 therein.
- the plasma generator 26 can be any of known types including inductively coupling types, such as an inductively coupled plasma (ICP) generation apparatus, capacitively coupled plasma (CCP) generation apparatus, an electron cyclotron resonance (ECR) type plasma generation apparatus, and a micro-surface wave plasma generation apparatus.
- ICP inductively coupled plasma
- CCP capacitively coupled plasma
- ECR electron cyclotron resonance
- a hydrogen gas (hereinafter referred to as H 2 gas) supply source 27 and a nitrogen gas (hereinafter N 2 gas) supply source 28 are connected to the plasma chamber 25 to supply H 2 and N 2 gases thereto.
- NH 3 gas may also be used alone or together with H 2 and/or N 2 gas.
- etching gas input line 29 In the gas supply line 23 connecting the plasma chamber 25 with the gas supply port 22 , one end portion of an etching gas input line 29 is inserted and the other end thereof is connected to an NF 3 gas supply source 30 for supplying NF 3 gas to be activated.
- the inserted end portion of the etching gas input line 29 (hereinafter referred to as the NF 3 gas input line) is L-shaped such that an NF 3 gas injection hole 29 a at the end of the NF 3 gas input line 29 faces the plasma chamber 25 along an axial line of the gas supply line 23 in order to inject NF 3 gas toward the plasma chamber 25 .
- a heater unit (not shown) including, e.g., a lamp heater for heating the processing chamber 12 is installed in such a manner that it does not interfere with the wafer transfer opening, the exhaust port 20 and the gas supply port 22 .
- a plurality of such wafers 1 having natural oxide films 3 thereon are loaded in the boat 15 by the wafer transfer device to remove the natural oxide films.
- the wafer transfer opening is then airtightly closed by a gate valve (not shown).
- the processing chamber 12 is evacuated through the exhaust line 21 and the turntable 13 holding the boat 15 is rotated by the rotary actuator 14 .
- a plasma 24 is created in the plasma chamber 25 by the plasma generator 26 with H 2 gas and N 2 gas (hereafter, a mixed gas 31 ) being supplied to the plasma chamber 25 from the H 2 gas and N 2 gas supply sources 27 and 28 .
- Active gas species 32 are generated from the mixed gas 31 supplied to the plasma chamber 25 by the plasma discharge.
- the NF 3 gas blown from a NF 3 gas injection hole 29 a of the NF 3 gas input line 29 is supplied toward the plasma chamber 25 through the gas supply line 23 .
- the NF 3 gas is mixed with and activated by the active gas species 32 .
- a natural oxide film removing gas 34 including the activated NF 3 gas, the mixed gas 31 and active gas species 32 flows into the processing chamber 12 through the gas supply port 22 .
- the natural oxide film removing gas 34 introduced into the processing chamber 12 is uniformly diffused across the processing chamber 12 to react with the natural oxide films 3 on the wafers 1 to thereby form reacted films 4 containing Si, N, H, F (hereinafter, a surface treated layer) as shown in FIG. 2B. Since the boat 15 holding the wafers 1 is rotated by the turntable 13 during the processing steps described above, the natural oxide film removing gas 34 can uniformly contact with front surfaces of the wafers 1 .
- the processing chamber 12 is heated by the heater unit to a predetermined temperature, e.g., 100° C., enabling the surface treated film 4 to be sublimated as shown in FIG. 2C. Consequently, the natural oxide films 3 formed on the wafers 1 are removed and Si surfaces 5 are exposed.
- a mechanism applied to the natural oxide film removing process is as follows: First, the natural oxide film removing gas including H 2 , N 2 and NF 3 gases and active gas species thereof reacts with the natural oxide film (SiO 2 ) and then forms the surface treated film 4 , i.e., a polymer containing Si, N, H and F. Next, the polymer is sublimated at a temperature of 100 ° C. or higher.
- the heater unit stops heating and the remaining gas in the processing chamber 12 is exhausted through the exhaust line 21 .
- the wafers 1 are unloaded from the boat 15 and transferred to a wafer carrier (not shown) by the wafer transfer device through the wafer transfer opening opened by the gate valve.
- the inventors of the present invention have found that plasma damage may occur on the wafer or a desired etching selectivity may not be obtained if the NF 3 gas 33 , which greatly contributes to the natural oxide removing process, is directly supplied to the processing chamber 12 without going through the gas supply line 23 and mixed with and activated by the active gas species 32 of the mixed gas 31 in the processing chamber 12 .
- the NF 3 gas 33 is injected toward the plasma chamber 25 and indirectly activated by the active gas species 32 after being introduced into the gas supply line 23 and the plasma chamber 25 in accordance with the preferred embodiment of the present invention, the plasma damage can be prevented and the required etching selectivity can be obtained.
- the natural oxide removing gas 34 can be introduced into the processing chamber 12 at a controlled decomposition rate of the NF 3 gas 33 , so that the plasma damage on the wafer can be prevented and the desired etching selectivity can be achieved.
- the degree of decomposition reaction of the NF 3 gas 33 can be controlled in a wide range by varying the distance L between the NF 3 gas injection hole 29 a of the NF 3 gas input line 29 and the plasma chamber 25 .
- the distance L between the NF 3 gas injection hole 29 a of the NF 3 gas input line 29 and the plasma chamber 25 .
- the amount of NF 3 gas entering the plasma chamber 25 is increased so that the degree of decomposition or activation of the NF 3 gas is increased.
- the amount of NF 3 gas entering the plasma chamber 25 is decreased so that the degree of decomposition or activation of the NF 3 gas is decreased.
- the distance L is determined by an empirical method, e.g., experimentation or computer simulation by considering several conditions, e.g., a relation between an estimated volume of the natural oxide films to be removed and an area of the SiO 2 film not to be removed, a supply amount of the mixed gas 31 or NF 3 gas 33 , and the like.
- etching selectivity between the natural oxide film and silicon can be 8 by controlling the degree of decomposition rate of the NF 3 gas, which greatly contributes to the natural oxide film removal, the natural oxide film can be removed completely.
- the natural oxide film can be removed with an etching rate equal to or greater than 3 ⁇ /min.
- the natural oxide film removing gas By supplying the natural oxide film removing gas parallel to main surfaces of the wafers loaded in the boat, the natural oxide film removing gas can be uniformly distributed across the main surfaces of the wafers, so the natural oxide film can be removed uniformly.
- FIG. 3 there is shown a cross sectional view of a single wafer type natural oxide film removing apparatus in accordance with a second preferred embodiment of the present invention.
- the natural oxide film removing apparatus 10 A in accordance with the second preferred embodiment includes a process tube 11 A configured of a short right circular cylinder shape to form a processing chamber 12 A of a low height.
- a wafer support 15 A, instead of a boat, holding two wafers 1 is installed on a turntable 13 A.
- Reference numeral 35 represents a heater unit formed of a lamp.
- This preferred embodiment has the same effect as in the first preferred embodiment.
- the NF 3 gas 33 by blowing the NF 3 gas 33 to the plasma chamber 25 through the gas supply line 23 , the NF 3 gas can be activated in the gas supply line 23 and the plasma chamber 25 by the active gas species 32 of the mixed gas 31 , so that the plasma damage can be prevented from occurring on the wafer 1 and the desired etching selectivity can be obtained.
- the NF 3 gas input line can also be inserted in the gas supply line 23 as shown in FIGS. 4A to 4 C.
- FIG. 4A there is shown an NF 3 gas input line 29 A, which is inserted along the axial line of the gas supply line 23 at the end thereof abutting the processing chamber 12 .
- FIG. 4B there is shown an NF 3 gas input line 29 B, which is inserted in the gas supply line 23 at a sloping angle ⁇ .
- ⁇ the degree of activation or decomposition rate of the NF 3 gas can be adequately controlled in a wide range.
- FIG. 4C there is shown an NF 3 gas input line 29 C, which is connected to the gas supply line 23 with an axial line thereof being perpendicular to that of the gas supply line 23 .
- the NF 3 gas input line 29 C is not protruded into the gas supply line 23 .
- the substrates to be processed can be photomasks, printed circuit substrates, liquid crystal panels, compact disks, magnetic disks or the wafers.
- ClF 3 , CF 4 , C 2 F 6 or other halogen gas can be used as an etching gas in lieu of the NF 3 gas.
- the natural oxide film can be completely removed while preventing plasma damages as described above.
- FIGS. 5 and 6 there are respectively illustrated a side and a top cross sectional views of the third preferred embodiment.
- Natural oxide film removing apparatus in accordance with the third preferred embodiment removes natural oxide films formed on wafers by using a remote plasma cleaning method.
- the apparatus is configured as shown in FIGS. 5 and 6 and performs a batch process in which a plurality of wafers are simultaneously subject to a natural oxide film removing process.
- the batch type natural oxide film removing apparatus 40 includes a process tube 41 for forming therein a processing chamber 42 in which natural oxide film removing process is performed.
- the process tube 41 is of a hexahedral box shape hermetically sealed to maintain vacuum inside and is installed vertically in such a manner that its central line is perpendicular to the ground.
- the process tube 41 includes a bottom wall having a boat loading/unloading opening 43 .
- the boat loading/unloading opening 43 is opened and closed by a sealing cap 44 , which can be vertically moved away from and toward the process tube 41 and lowered by a boat elevator (not shown).
- a rotary actuator 45 is installed and its rotor is inserted into the processing chamber 42 through the sealing cap 44 .
- a turntable 46 is horizontally disposed on an upper end of the rotor to thereby rotate in unison therewith.
- a boat 47 for holding a plurality of wafers 1 is installed on the turntable 46 so that the boat 47 and the turntable 46 can rotate in unison.
- the boat 47 is made of a ceramic such as quartz, alumina or aluminum nitride (AlN) to prevent, e.g., metal contamination of the wafers 1 .
- the boat 47 includes an upper plate 47 a , a lower plate 47 b and several support rods 47 c (three, in this embodiment) vertically disposed therebetween.
- the support rods 47 c have a plurality of vertically arranged wafer mount groove portions 47 d , such that a number of wafers 1 can be held horizontally with an identical gap therebetween by the groove portions 47 d .
- the lower plate 47 b of the boat 47 is removably fixed on an upper surface of the turntable 46 .
- an exhaust port 50 is connected to a portion of the side wall of the process tube 41 in such a manner that the exhaust port 20 communicates with the processing chamber 42 , wherein height of the exhaust port 50 is approximately identical to that of the process tube 41 .
- a gas supply port 52 is connected to a portion of the side wall of the process tube 41 opposite to the exhaust port 50 in such a manner that the gas supply port 52 communicates with the processing chamber 42 , wherein the height of the supply port 52 is approximately same as that of the process tube 41 .
- One end of a gas supply line 53 is connected to a middle portion of the gas supply port 52 in such a manner that the gas supply line 53 can horizontally supply gases into the processing chamber 42 .
- the other end of the gas supply line 53 is connected to a remote plasma unit 55 , which activates NF 3 gas by using a high frequency electric power wave and so on.
- a distribution plate 57 for distributing a natural oxide film removing gas 54 in parallel to the wafers 1 .
- a buffer portion 56 for distributing the gas flow of the natural oxide film removing gas 54 is provided by the distribution plate 57 .
- the distribution plate 57 has a vertical slit forming a gas injection opening 58 , so that the natural oxide film removing gas can be distributed vertically therethrough and be horizontally introduced into the processing chamber 42 .
- the distribution plate 57 is installed in such a manner that the distance L between the distribution plate 57 and proximal periphery of the wafer 1 is equal to or less than 50 mm.
- the distribution plate 57 not only serves to form the buffer portion 56 but also controls ion or radical energy
- a conductance plate 59 is provided at the end portion of the exhaust port 50 facing toward the processing chamber 42 to uniformly evacuate the processing chamber 42 across the height thereof.
- the conductance plate 59 is provided with a gas exhaust opening 59 a of a vertically elongated slit.
- the distance between the conductance plate 59 and the proximal periphery of the wafer 1 loaded in the boat 47 is set to be equal to or less than 50 mm.
- a plurality of wafers 1 required to be subject to the natural oxide film removing process are loaded in the boat 47 outside the processing chamber 42 by a wafer transfer device (not shown) and the boat 47 holding the wafers 1 is transferred to the processing chamber 42 through the boat loading/unloading opening 43 .
- the processing chamber 42 is airtightly closed by the sealing cap 44 and exhausted through an exhaust line 51 .
- the turntable 46 holding the boat 47 is turned by the rotary actuator 45 .
- the natural oxide film removing gas 54 including the activated NF 3 gas is introduced into the gas supply port 52 from the remote plasma unit 55 .
- the natural oxide film removing gas 54 introduced into the gas supply port 52 is uniformly distributed across the whole volume of the buffer portion 56 and flows into the processing chamber 42 uniformly across the height thereof through the gas injection opening 58 formed of the vertical slit.
- the flow of the natural oxide film removing gas 54 is distributed and its ion and radical energy are controlled to be reduced by the distribution plate 57 .
- the conductance plate 59 uniformly distributes along the height thereof the exhausting force of the exhaust line 51 , so that the natural oxide films removing gas 54 can be distributed more uniformly in the processing chamber 42 .
- the natural oxide film removing gas 54 introduced into the processing chamber 42 contacts the wafers 1 loaded in the boat 47 to react with and remove the natural oxide film with the preferable etching selectivity.
- the natural oxide film removing gas 54 is uniformly distributed in the processing chamber 42 by the distribution plate 57 , the wafers 1 loaded in the boat 47 can contact equally with the natural oxide film removing gas 54 in regardless of their position, i.e., height, in the boat 47 .
- the natural oxide film removing gas 54 is also uniformly distributed across the entire surface of each wafer. Accordingly, even though the wafers 1 are disposed in the boat one above another, the natural oxide films of the wafers 1 can be entirely and uniformly removed.
- the ion and radical energy of the natural oxide film removing gas 54 activated by the remote plasma unit 55 are controlled to be decreased by the distribution plate 57 , the plasma damage can be prevented from occurring and the desired etching selectivity can be obtained.
- the inner side wall of the processing chamber is of a circular shape, the natural oxide film removing gas 54 flows along the inner side wall. Therefore, it is preferable that the inner side wall is configured to be concentric with the wafers and the gap between the inner side wall and the periphery of the wafers is small. However, the reduced gap between the inner side wall and the wafers requires high installation accuracy of the boat.
- a distance between periphery of the wafer 1 and the distribution plate 57 and that between periphery of the wafer 1 and the conductance plate 59 are set to be equal to or less than 50 mm. Therefore, even though the inner side wall of the processing chamber 42 is not configured to be of a circular shape and a distance between the inner side wall and the periphery of the wafers is not small, the natural oxide film removing gas 54 can efficiently flow and also can be supplied to the center portions of the wafer 1 . Accordingly, the decrease of the etching rate of the natural oxide film can be prevented and at the same time etching uniformity can be improved. Further, since the gab between the inner side wall and wafer need not be small, the high installation accuracy of the boat is not required.
- the boat 47 holding the processed wafers 1 is unloaded from the processing chamber 42 by the descent of the sealing cap 44 .
- the processed wafers 1 are unloaded from the boat 47 by the wafer transfer device.
- the wafers loaded in the boat can contact uniformly with the natural oxide film removing gas in regardless of their position, i.e., height, in the boat. Accordingly, even though the wafers are disposed in the boat one above another, the natural oxide films of the wafers can be removed entirely and uniformly. Namely, natural oxide films formed on a plurality of wafers in the boat can be removed at a time, so throughput can be higher when compared to that of the single wafer type natural oxide film removing apparatus.
- the ion and radical energy of the natural oxide film removing gas can be controlled by setting the distance between the diffusion plate and the periphery of the wafer within 50 mm, the etching selectivity between the natural oxide film and the silicon can be over 8. Therefore, the natural oxide film can be removed completely. For example, the natural oxide film can be removed at 3 ⁇ /min.
- the distance between periphery of the wafer and the distribution plate 57 and between periphery of the wafer and the conductance plate are set to be equal to or less than 50 mm, even though the inner side wall of the processing chamber is not configured to be of a circular shape and the gap between the inner wall and the periphery of the wafer is not small, the natural oxide film removing gas can efficiently flow. As a result, the decrease of the removal rate of the natural oxide film removing gas can be prevented and removal uniformity thereof can be increased.
- the natural oxide film removing gas By supplying the natural oxide film removing gas parallel to main surfaces of the wafers loaded on the boat, the natural oxide film removing gas can be uniformly distributed across the main surfaces of the wafers, so the natural oxide film can be removed uniformly.
- a distribution plate 57 A shown in FIG. 7B having a plurality of gas injection openings 58 A made of circular holes can be used in lieu of the distribution plate 57 shown in FIG. 7A, which has the vertical slit as the gas injection opening 58 .
- the number of the distribution plate is not limited to one.
- two parallel distribution plates 57 A can be used as shown in FIG. 7C.
- two or more distribution plates e.g., having different structures, including the distribution plate 57 with the gas injection opening 58 of the vertically extended slit and the distribution plate 57 A with the gas injection openings 58 A of a plurality of holes.
- two or more distribution plates which are not disposed in parallel.
- the gas supply line 53 can be installed to be vertically extended into the processing chamber 42 wherein a plurality of gas injection openings 58 B can be formed along the gas supply line 53 inserted in the processing chamber 42 . Since the natural oxide film removing gas is evenly supplied between the wafers held in the boat 47 and also uniformly contacts with the whole surface of each wafer, the same effects as in the preferred embodiments described above can also be obtained in this case.
- the HSG film is not formed well on the wafer having the natural oxide film thereon, it is necessary to remove the natural oxide film before forming the HSG layer.
- the HSG film is not adequately formed even after subjecting the wafer to the HSG film forming process in a substrate processing apparatus, e.g., CVD apparatus.
- a substrate processing apparatus e.g., CVD apparatus.
- the reason why the HSG film is not formed is not clearly revealed, it is suspected that the by-product is attached on the wafer when the natural oxide film is removed and thereafter reacts with certain elements in the ambient air to prevent the HSG film from forming. Accordingly, it is preferable that the byproduct is sublimated before the by-product reacts with the elements in the ambient air.
- FIG. 9 there is shown a batch type natural oxide film removing apparatus 40 A in accordance with another preferred embodiment of the present invention, which is capable of sublimating the by-product in the processing chamber 42 before the by-product reacts with the elements in the ambient air.
- the apparatus 40 A of the instant preferred embodiment is different from the apparatus 40 shown in FIG. 6 in that lamp heaters 60 are configured to heat the processing chamber 42 through irradiation windows 61 .
- the processing chamber 42 is heated to 80° C. or higher by the irradiation of the lamp heaters 60 through the irradiation windows 61 made of quartz glass to sublimate the by-product attached on the wafers 1 after the removal of the natural oxide film by the natural oxide film removing gas 54 . It was found that the HSG film was formed adequately during the subsequent HSG forming process after the aforementioned heat treatment. The natural oxide film removed surface of the wafer can be further stabilized by being subject to a hydrogenation process.
- the by-products has been described as being removed in the processing chamber being heated. Since, however, the HSG film forming process can be accomplished as long as the by-product is removed before being exposed to the ambient air, the natural oxide film removing process and the by-product removing process need not be necessarily carried in a single chamber.
- the heater unit may be installed at a different heat treatment chamber connected to the processing chamber having no heater unit. In that case, the natural oxide film is removed in the processing chamber first and then transferred in vacuum or in the inert gas atmosphere to the heat treatment chamber to remove the by-product therein.
- the present invention can be applied to heat treating photomasks, printed circuit board or liquid crystal panel, compact disk or magnetic disk as well.
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Also Published As
Publication number | Publication date |
---|---|
KR20020024554A (ko) | 2002-03-30 |
JP2002170813A (ja) | 2002-06-14 |
JP3929261B2 (ja) | 2007-06-13 |
US20070062646A1 (en) | 2007-03-22 |
KR100644000B1 (ko) | 2006-11-10 |
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