TWI887651B - 儲存系統 - Google Patents

儲存系統 Download PDF

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Publication number
TWI887651B
TWI887651B TW112117629A TW112117629A TWI887651B TW I887651 B TWI887651 B TW I887651B TW 112117629 A TW112117629 A TW 112117629A TW 112117629 A TW112117629 A TW 112117629A TW I887651 B TWI887651 B TW I887651B
Authority
TW
Taiwan
Prior art keywords
wafer
box
host unit
slot
semiconductor wafer
Prior art date
Application number
TW112117629A
Other languages
English (en)
Chinese (zh)
Other versions
TW202337802A (zh
Inventor
人見達郎
吉水康人
井上新
堂前宏之
早坂一人
佐貫朋也
Original Assignee
日商鎧俠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商鎧俠股份有限公司 filed Critical 日商鎧俠股份有限公司
Publication of TW202337802A publication Critical patent/TW202337802A/zh
Application granted granted Critical
Publication of TWI887651B publication Critical patent/TWI887651B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02—Addressing or allocation; Relocation
    • G06F12/06—Addressing a physical block of locations, e.g. base addressing, module addressing, memory dedication
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Memory System (AREA)
  • Robotics (AREA)
  • Valve Device For Special Equipments (AREA)
  • Vehicle Body Suspensions (AREA)
  • Memory System Of A Hierarchy Structure (AREA)
TW112117629A 2021-03-23 2021-06-15 儲存系統 TWI887651B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2021/011856 2021-03-23
PCT/JP2021/011856 WO2022201283A1 (ja) 2021-03-23 2021-03-23 ストレージシステム

Publications (2)

Publication Number Publication Date
TW202337802A TW202337802A (zh) 2023-10-01
TWI887651B true TWI887651B (zh) 2025-06-21

Family

ID=83396427

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112117629A TWI887651B (zh) 2021-03-23 2021-06-15 儲存系統
TW110121687A TWI804888B (zh) 2021-03-23 2021-06-15 儲存系統

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110121687A TWI804888B (zh) 2021-03-23 2021-06-15 儲存系統

Country Status (7)

Country Link
US (1) US12469729B2 (https=)
EP (1) EP4318246A4 (https=)
JP (1) JP7456065B2 (https=)
CN (1) CN116547654A (https=)
DE (1) DE112021007343T5 (https=)
TW (2) TWI887651B (https=)
WO (1) WO2022201283A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12176228B2 (en) * 2022-04-20 2024-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. High density semiconductor storage system
JP2025001923A (ja) 2023-06-21 2025-01-09 キオクシア株式会社 システム
CN119644093A (zh) * 2023-09-15 2025-03-18 芯卓科技(浙江)有限公司 晶圆测试盒

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197697A (ja) * 2001-12-28 2003-07-11 Hitachi Ltd 半導体装置の製造方法
TWM337741U (en) * 2007-12-20 2008-08-01 Jtron Technology Corp Non-contact type probe card management apparatus
JP2011091262A (ja) * 2009-10-23 2011-05-06 Tokyo Seimitsu Co Ltd プローバおよびプローブ検査方法
TW201135253A (en) * 2009-12-31 2011-10-16 Formfactor Inc Wafer test cassette system
TW201919970A (zh) * 2011-10-26 2019-06-01 美商布魯克斯自動機械公司 基板處理系統
TW201614250A (en) * 2014-08-20 2016-04-16 Tokyo Electron Ltd Wafer inspection apparatus
TW201909301A (zh) * 2017-07-19 2019-03-01 日商東京威力科創股份有限公司 檢查系統
JP2020194889A (ja) * 2019-05-28 2020-12-03 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法

Also Published As

Publication number Publication date
US20240014062A1 (en) 2024-01-11
EP4318246A4 (en) 2025-02-19
TW202337802A (zh) 2023-10-01
JPWO2022201283A1 (https=) 2022-09-29
WO2022201283A1 (ja) 2022-09-29
JP7456065B2 (ja) 2024-03-26
TWI804888B (zh) 2023-06-11
DE112021007343T5 (de) 2024-05-02
CN116547654A (zh) 2023-08-04
US12469729B2 (en) 2025-11-11
TW202237519A (zh) 2022-10-01
EP4318246A1 (en) 2024-02-07

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