JPWO2022201283A1 - - Google Patents
Info
- Publication number
- JPWO2022201283A1 JPWO2022201283A1 JP2023508200A JP2023508200A JPWO2022201283A1 JP WO2022201283 A1 JPWO2022201283 A1 JP WO2022201283A1 JP 2023508200 A JP2023508200 A JP 2023508200A JP 2023508200 A JP2023508200 A JP 2023508200A JP WO2022201283 A1 JPWO2022201283 A1 JP WO2022201283A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/06—Addressing a physical block of locations, e.g. base addressing, module addressing, memory dedication
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Memory System (AREA)
- Robotics (AREA)
- Valve Device For Special Equipments (AREA)
- Vehicle Body Suspensions (AREA)
- Memory System Of A Hierarchy Structure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/011856 WO2022201283A1 (ja) | 2021-03-23 | 2021-03-23 | ストレージシステム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022201283A1 true JPWO2022201283A1 (https=) | 2022-09-29 |
| JPWO2022201283A5 JPWO2022201283A5 (https=) | 2023-07-12 |
| JP7456065B2 JP7456065B2 (ja) | 2024-03-26 |
Family
ID=83396427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023508200A Active JP7456065B2 (ja) | 2021-03-23 | 2021-03-23 | ストレージシステム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12469729B2 (https=) |
| EP (1) | EP4318246A4 (https=) |
| JP (1) | JP7456065B2 (https=) |
| CN (1) | CN116547654A (https=) |
| DE (1) | DE112021007343T5 (https=) |
| TW (2) | TWI887651B (https=) |
| WO (1) | WO2022201283A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12176228B2 (en) * | 2022-04-20 | 2024-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | High density semiconductor storage system |
| JP2025001923A (ja) | 2023-06-21 | 2025-01-09 | キオクシア株式会社 | システム |
| CN119644093A (zh) * | 2023-09-15 | 2025-03-18 | 芯卓科技(浙江)有限公司 | 晶圆测试盒 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197697A (ja) * | 2001-12-28 | 2003-07-11 | Hitachi Ltd | 半導体装置の製造方法 |
| JP2020194889A (ja) * | 2019-05-28 | 2020-12-03 | 東京エレクトロン株式会社 | 搬送システム、検査システム及び検査方法 |
| WO2021095252A1 (ja) * | 2019-11-15 | 2021-05-20 | キオクシア株式会社 | ストレージデバイスおよびストレージシステム |
Family Cites Families (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0140034B1 (ko) | 1993-12-16 | 1998-07-15 | 모리시다 요이치 | 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법 |
| JP2925964B2 (ja) | 1994-04-21 | 1999-07-28 | 松下電器産業株式会社 | 半導体ウェハ収納器及び半導体集積回路の検査方法 |
| JP3251194B2 (ja) | 1997-04-03 | 2002-01-28 | 松下電器産業株式会社 | 半導体ウェハ収納器 |
| JP3784148B2 (ja) | 1997-10-17 | 2006-06-07 | 松下電器産業株式会社 | ウェハカセット |
| JP3758833B2 (ja) | 1997-10-20 | 2006-03-22 | 松下電器産業株式会社 | ウェハカセット |
| JP3364134B2 (ja) | 1997-10-20 | 2003-01-08 | 松下電器産業株式会社 | ウェハカセット |
| JP3456877B2 (ja) | 1997-10-20 | 2003-10-14 | 松下電器産業株式会社 | ウェハカセット |
| JP3249078B2 (ja) | 1997-10-20 | 2002-01-21 | 松下電器産業株式会社 | 半導体ウェハの取出し装置 |
| JPH11121569A (ja) | 1997-10-21 | 1999-04-30 | Matsushita Electric Ind Co Ltd | バーンイン装置 |
| JP3467394B2 (ja) | 1997-10-31 | 2003-11-17 | 松下電器産業株式会社 | バーンイン用ウェハカセット及びプローブカードの製造方法 |
| JP3368461B2 (ja) | 1997-11-05 | 2003-01-20 | 東京エレクトロン株式会社 | シェル |
| JP3294175B2 (ja) | 1997-11-05 | 2002-06-24 | 東京エレクトロン株式会社 | 信頼性試験用ウエハ収納室 |
| EP0915499B1 (en) | 1997-11-05 | 2011-03-23 | Tokyo Electron Limited | Semiconductor wafer holding apparatus |
| JP3467548B2 (ja) | 1997-11-05 | 2003-11-17 | 東京エレクトロン株式会社 | 温度制御体の接合装置及びウエハ収納室 |
| JPH11145217A (ja) | 1997-11-13 | 1999-05-28 | Matsushita Electric Ind Co Ltd | ウェハ一括型測定検査のための温度制御方法及びその装置ならびにバーンイン装置 |
| JP3282796B2 (ja) | 1998-04-13 | 2002-05-20 | 東京エレクトロン株式会社 | アライナー |
| JP3282800B2 (ja) | 1998-05-20 | 2002-05-20 | 東京エレクトロン株式会社 | アライナー |
| JP3515904B2 (ja) | 1998-06-25 | 2004-04-05 | オリオン機械株式会社 | 半導体ウェーハの温度試験装置 |
| JP2000164647A (ja) | 1998-11-24 | 2000-06-16 | Matsushita Electric Ind Co Ltd | ウエハカセット及び半導体集積回路の検査装置 |
| US6580283B1 (en) | 1999-07-14 | 2003-06-17 | Aehr Test Systems | Wafer level burn-in and test methods |
| EP1218765B1 (en) | 1999-07-14 | 2006-01-18 | AEHR Test Systems | Wafer-level burn-in and test cartridge |
| JP4088401B2 (ja) | 2000-05-29 | 2008-05-21 | 松下電器産業株式会社 | ウェハカセット装置 |
| US6441606B1 (en) | 2000-10-17 | 2002-08-27 | Micron Technology, Inc. | Dual zone wafer test apparatus |
| JP2002228718A (ja) | 2001-01-31 | 2002-08-14 | Orion Mach Co Ltd | 検査装置用検査体挿入器 |
| JP4173306B2 (ja) | 2001-11-30 | 2008-10-29 | 東京エレクトロン株式会社 | 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法 |
| JP2003297887A (ja) | 2002-04-01 | 2003-10-17 | Hitachi Ltd | 半導体集積回路装置の製造方法および半導体検査装置 |
| JP3820224B2 (ja) | 2003-01-22 | 2006-09-13 | オリオン機械株式会社 | 半導体ウェーハ用検査装置及び同装置の真空接続方法 |
| JP3820226B2 (ja) | 2003-01-22 | 2006-09-13 | オリオン機械株式会社 | 半導体ウェーハ用検査装置 |
| JP4069099B2 (ja) | 2004-06-29 | 2008-03-26 | 松下電器産業株式会社 | ウェハカセット |
| MY140086A (en) * | 2004-07-23 | 2009-11-30 | Advantest Corp | Electronic device test apparatus and method of configuring electronic device test apparatus |
| EP1959265A1 (en) | 2007-02-16 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof |
| JP2008227148A (ja) | 2007-03-13 | 2008-09-25 | Micronics Japan Co Ltd | 半導体ウエハの試験方法およびその装置 |
| WO2008144437A1 (en) | 2007-05-15 | 2008-11-27 | Seubert Ronald C | Wafer probe test and inspection system |
| US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
| TWM337741U (en) * | 2007-12-20 | 2008-08-01 | Jtron Technology Corp | Non-contact type probe card management apparatus |
| JP4907513B2 (ja) | 2007-12-28 | 2012-03-28 | パナソニック株式会社 | ウェハカセット装置 |
| JP2010093085A (ja) | 2008-10-08 | 2010-04-22 | Elfinote Technology Corp | 半導体ウェハの検査方法及び半導体ウェハ保持体 |
| US7884631B2 (en) * | 2009-02-25 | 2011-02-08 | Kingston Technology Corp. | Parking structure memory-module tester that moves test motherboards along a highway for remote loading/unloading |
| JP2011091262A (ja) * | 2009-10-23 | 2011-05-06 | Tokyo Seimitsu Co Ltd | プローバおよびプローブ検査方法 |
| US8872532B2 (en) | 2009-12-31 | 2014-10-28 | Formfactor, Inc. | Wafer test cassette system |
| TWI719331B (zh) * | 2011-10-26 | 2021-02-21 | 美商布魯克斯自動機械公司 | 基板處理系統 |
| JP6333112B2 (ja) * | 2014-08-20 | 2018-05-30 | 東京エレクトロン株式会社 | ウエハ検査装置 |
| EP3589965B1 (en) | 2017-03-03 | 2023-12-06 | AEHR Test Systems | Electronics tester |
| JP2018207022A (ja) * | 2017-06-08 | 2018-12-27 | 株式会社ディスコ | 加工装置 |
| JP6887332B2 (ja) * | 2017-07-19 | 2021-06-16 | 東京エレクトロン株式会社 | 検査システム |
| KR102014334B1 (ko) | 2017-09-28 | 2019-08-26 | 한국생산기술연구원 | 기판 검사 카트리지 및 이의 제조 방법 |
| US10910249B2 (en) * | 2017-11-13 | 2021-02-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for automated wafer handling |
| JP7267111B2 (ja) | 2019-05-31 | 2023-05-01 | 東京エレクトロン株式会社 | 位置決め機構及び位置決め方法 |
| WO2021095251A1 (ja) | 2019-11-15 | 2021-05-20 | キオクシア株式会社 | ストレージデバイスおよび制御方法 |
| WO2021095232A1 (ja) | 2019-11-15 | 2021-05-20 | キオクシア株式会社 | ストレージシステム及びウェハ |
-
2021
- 2021-03-23 EP EP21932893.7A patent/EP4318246A4/en active Pending
- 2021-03-23 JP JP2023508200A patent/JP7456065B2/ja active Active
- 2021-03-23 DE DE112021007343.5T patent/DE112021007343T5/de active Pending
- 2021-03-23 WO PCT/JP2021/011856 patent/WO2022201283A1/ja not_active Ceased
- 2021-03-23 CN CN202180078885.5A patent/CN116547654A/zh active Pending
- 2021-06-15 TW TW112117629A patent/TWI887651B/zh active
- 2021-06-15 TW TW110121687A patent/TWI804888B/zh active
-
2023
- 2023-09-22 US US18/371,669 patent/US12469729B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197697A (ja) * | 2001-12-28 | 2003-07-11 | Hitachi Ltd | 半導体装置の製造方法 |
| JP2020194889A (ja) * | 2019-05-28 | 2020-12-03 | 東京エレクトロン株式会社 | 搬送システム、検査システム及び検査方法 |
| WO2021095252A1 (ja) * | 2019-11-15 | 2021-05-20 | キオクシア株式会社 | ストレージデバイスおよびストレージシステム |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240014062A1 (en) | 2024-01-11 |
| EP4318246A4 (en) | 2025-02-19 |
| TW202337802A (zh) | 2023-10-01 |
| WO2022201283A1 (ja) | 2022-09-29 |
| JP7456065B2 (ja) | 2024-03-26 |
| TWI804888B (zh) | 2023-06-11 |
| DE112021007343T5 (de) | 2024-05-02 |
| CN116547654A (zh) | 2023-08-04 |
| US12469729B2 (en) | 2025-11-11 |
| TW202237519A (zh) | 2022-10-01 |
| TWI887651B (zh) | 2025-06-21 |
| EP4318246A1 (en) | 2024-02-07 |
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