DE112021007343T5 - Speichersystem - Google Patents

Speichersystem Download PDF

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Publication number
DE112021007343T5
DE112021007343T5 DE112021007343.5T DE112021007343T DE112021007343T5 DE 112021007343 T5 DE112021007343 T5 DE 112021007343T5 DE 112021007343 T DE112021007343 T DE 112021007343T DE 112021007343 T5 DE112021007343 T5 DE 112021007343T5
Authority
DE
Germany
Prior art keywords
wafer
cassette
unit
semiconductor
wafer cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021007343.5T
Other languages
German (de)
English (en)
Inventor
Tatsuro Hitomi
Yasuhito Yoshimizu
Arata Inoue
Hiroyuki Dohmae
Kazuhito Hayasaka
Tomoya Sanuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Publication of DE112021007343T5 publication Critical patent/DE112021007343T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02—Addressing or allocation; Relocation
    • G06F12/06—Addressing a physical block of locations, e.g. base addressing, module addressing, memory dedication
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Memory System (AREA)
  • Robotics (AREA)
  • Valve Device For Special Equipments (AREA)
  • Vehicle Body Suspensions (AREA)
  • Memory System Of A Hierarchy Structure (AREA)
DE112021007343.5T 2021-03-23 2021-03-23 Speichersystem Pending DE112021007343T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/011856 WO2022201283A1 (ja) 2021-03-23 2021-03-23 ストレージシステム

Publications (1)

Publication Number Publication Date
DE112021007343T5 true DE112021007343T5 (de) 2024-05-02

Family

ID=83396427

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021007343.5T Pending DE112021007343T5 (de) 2021-03-23 2021-03-23 Speichersystem

Country Status (7)

Country Link
US (1) US12469729B2 (https=)
EP (1) EP4318246A4 (https=)
JP (1) JP7456065B2 (https=)
CN (1) CN116547654A (https=)
DE (1) DE112021007343T5 (https=)
TW (2) TWI887651B (https=)
WO (1) WO2022201283A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12176228B2 (en) * 2022-04-20 2024-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. High density semiconductor storage system
JP2025001923A (ja) 2023-06-21 2025-01-09 キオクシア株式会社 システム
CN119644093A (zh) * 2023-09-15 2025-03-18 芯卓科技(浙江)有限公司 晶圆测试盒

Citations (3)

* Cited by examiner, † Cited by third party
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JP2020194889A (ja) 2019-05-28 2020-12-03 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
JP2020198354A (ja) 2019-05-31 2020-12-10 東京エレクトロン株式会社 位置決め機構及び位置決め方法

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JP2925964B2 (ja) 1994-04-21 1999-07-28 松下電器産業株式会社 半導体ウェハ収納器及び半導体集積回路の検査方法
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JPH11121569A (ja) 1997-10-21 1999-04-30 Matsushita Electric Ind Co Ltd バーンイン装置
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JPH11145217A (ja) 1997-11-13 1999-05-28 Matsushita Electric Ind Co Ltd ウェハ一括型測定検査のための温度制御方法及びその装置ならびにバーンイン装置
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JP3515904B2 (ja) 1998-06-25 2004-04-05 オリオン機械株式会社 半導体ウェーハの温度試験装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227148A (ja) 2007-03-13 2008-09-25 Micronics Japan Co Ltd 半導体ウエハの試験方法およびその装置
JP2020194889A (ja) 2019-05-28 2020-12-03 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
JP2020198354A (ja) 2019-05-31 2020-12-10 東京エレクトロン株式会社 位置決め機構及び位置決め方法

Also Published As

Publication number Publication date
US20240014062A1 (en) 2024-01-11
EP4318246A4 (en) 2025-02-19
TW202337802A (zh) 2023-10-01
JPWO2022201283A1 (https=) 2022-09-29
WO2022201283A1 (ja) 2022-09-29
JP7456065B2 (ja) 2024-03-26
TWI804888B (zh) 2023-06-11
CN116547654A (zh) 2023-08-04
US12469729B2 (en) 2025-11-11
TW202237519A (zh) 2022-10-01
TWI887651B (zh) 2025-06-21
EP4318246A1 (en) 2024-02-07

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