JP7456065B2 - ストレージシステム - Google Patents

ストレージシステム Download PDF

Info

Publication number
JP7456065B2
JP7456065B2 JP2023508200A JP2023508200A JP7456065B2 JP 7456065 B2 JP7456065 B2 JP 7456065B2 JP 2023508200 A JP2023508200 A JP 2023508200A JP 2023508200 A JP2023508200 A JP 2023508200A JP 7456065 B2 JP7456065 B2 JP 7456065B2
Authority
JP
Japan
Prior art keywords
wafer
cassette
stocker
host unit
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023508200A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022201283A1 (https=
JPWO2022201283A5 (https=
Inventor
達郎 人見
康人 吉水
新 井上
宏之 堂前
一人 早坂
朋也 佐貫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Publication of JPWO2022201283A1 publication Critical patent/JPWO2022201283A1/ja
Publication of JPWO2022201283A5 publication Critical patent/JPWO2022201283A5/ja
Application granted granted Critical
Publication of JP7456065B2 publication Critical patent/JP7456065B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02—Addressing or allocation; Relocation
    • G06F12/06—Addressing a physical block of locations, e.g. base addressing, module addressing, memory dedication
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Memory System (AREA)
  • Robotics (AREA)
  • Valve Device For Special Equipments (AREA)
  • Vehicle Body Suspensions (AREA)
  • Memory System Of A Hierarchy Structure (AREA)
JP2023508200A 2021-03-23 2021-03-23 ストレージシステム Active JP7456065B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/011856 WO2022201283A1 (ja) 2021-03-23 2021-03-23 ストレージシステム

Publications (3)

Publication Number Publication Date
JPWO2022201283A1 JPWO2022201283A1 (https=) 2022-09-29
JPWO2022201283A5 JPWO2022201283A5 (https=) 2023-07-12
JP7456065B2 true JP7456065B2 (ja) 2024-03-26

Family

ID=83396427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508200A Active JP7456065B2 (ja) 2021-03-23 2021-03-23 ストレージシステム

Country Status (7)

Country Link
US (1) US12469729B2 (https=)
EP (1) EP4318246A4 (https=)
JP (1) JP7456065B2 (https=)
CN (1) CN116547654A (https=)
DE (1) DE112021007343T5 (https=)
TW (2) TWI887651B (https=)
WO (1) WO2022201283A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12176228B2 (en) * 2022-04-20 2024-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. High density semiconductor storage system
JP2025001923A (ja) 2023-06-21 2025-01-09 キオクシア株式会社 システム
CN119644093A (zh) * 2023-09-15 2025-03-18 芯卓科技(浙江)有限公司 晶圆测试盒

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197697A (ja) 2001-12-28 2003-07-11 Hitachi Ltd 半導体装置の製造方法
JP2020194889A (ja) 2019-05-28 2020-12-03 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
WO2021095252A1 (ja) 2019-11-15 2021-05-20 キオクシア株式会社 ストレージデバイスおよびストレージシステム

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0140034B1 (ko) 1993-12-16 1998-07-15 모리시다 요이치 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법
JP2925964B2 (ja) 1994-04-21 1999-07-28 松下電器産業株式会社 半導体ウェハ収納器及び半導体集積回路の検査方法
JP3251194B2 (ja) 1997-04-03 2002-01-28 松下電器産業株式会社 半導体ウェハ収納器
JP3784148B2 (ja) 1997-10-17 2006-06-07 松下電器産業株式会社 ウェハカセット
JP3758833B2 (ja) 1997-10-20 2006-03-22 松下電器産業株式会社 ウェハカセット
JP3364134B2 (ja) 1997-10-20 2003-01-08 松下電器産業株式会社 ウェハカセット
JP3456877B2 (ja) 1997-10-20 2003-10-14 松下電器産業株式会社 ウェハカセット
JP3249078B2 (ja) 1997-10-20 2002-01-21 松下電器産業株式会社 半導体ウェハの取出し装置
JPH11121569A (ja) 1997-10-21 1999-04-30 Matsushita Electric Ind Co Ltd バーンイン装置
JP3467394B2 (ja) 1997-10-31 2003-11-17 松下電器産業株式会社 バーンイン用ウェハカセット及びプローブカードの製造方法
JP3368461B2 (ja) 1997-11-05 2003-01-20 東京エレクトロン株式会社 シェル
JP3294175B2 (ja) 1997-11-05 2002-06-24 東京エレクトロン株式会社 信頼性試験用ウエハ収納室
EP0915499B1 (en) 1997-11-05 2011-03-23 Tokyo Electron Limited Semiconductor wafer holding apparatus
JP3467548B2 (ja) 1997-11-05 2003-11-17 東京エレクトロン株式会社 温度制御体の接合装置及びウエハ収納室
JPH11145217A (ja) 1997-11-13 1999-05-28 Matsushita Electric Ind Co Ltd ウェハ一括型測定検査のための温度制御方法及びその装置ならびにバーンイン装置
JP3282796B2 (ja) 1998-04-13 2002-05-20 東京エレクトロン株式会社 アライナー
JP3282800B2 (ja) 1998-05-20 2002-05-20 東京エレクトロン株式会社 アライナー
JP3515904B2 (ja) 1998-06-25 2004-04-05 オリオン機械株式会社 半導体ウェーハの温度試験装置
JP2000164647A (ja) 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd ウエハカセット及び半導体集積回路の検査装置
US6580283B1 (en) 1999-07-14 2003-06-17 Aehr Test Systems Wafer level burn-in and test methods
EP1218765B1 (en) 1999-07-14 2006-01-18 AEHR Test Systems Wafer-level burn-in and test cartridge
JP4088401B2 (ja) 2000-05-29 2008-05-21 松下電器産業株式会社 ウェハカセット装置
US6441606B1 (en) 2000-10-17 2002-08-27 Micron Technology, Inc. Dual zone wafer test apparatus
JP2002228718A (ja) 2001-01-31 2002-08-14 Orion Mach Co Ltd 検査装置用検査体挿入器
JP4173306B2 (ja) 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
JP2003297887A (ja) 2002-04-01 2003-10-17 Hitachi Ltd 半導体集積回路装置の製造方法および半導体検査装置
JP3820224B2 (ja) 2003-01-22 2006-09-13 オリオン機械株式会社 半導体ウェーハ用検査装置及び同装置の真空接続方法
JP3820226B2 (ja) 2003-01-22 2006-09-13 オリオン機械株式会社 半導体ウェーハ用検査装置
JP4069099B2 (ja) 2004-06-29 2008-03-26 松下電器産業株式会社 ウェハカセット
MY140086A (en) * 2004-07-23 2009-11-30 Advantest Corp Electronic device test apparatus and method of configuring electronic device test apparatus
EP1959265A1 (en) 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
JP2008227148A (ja) 2007-03-13 2008-09-25 Micronics Japan Co Ltd 半導体ウエハの試験方法およびその装置
WO2008144437A1 (en) 2007-05-15 2008-11-27 Seubert Ronald C Wafer probe test and inspection system
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
TWM337741U (en) * 2007-12-20 2008-08-01 Jtron Technology Corp Non-contact type probe card management apparatus
JP4907513B2 (ja) 2007-12-28 2012-03-28 パナソニック株式会社 ウェハカセット装置
JP2010093085A (ja) 2008-10-08 2010-04-22 Elfinote Technology Corp 半導体ウェハの検査方法及び半導体ウェハ保持体
US7884631B2 (en) * 2009-02-25 2011-02-08 Kingston Technology Corp. Parking structure memory-module tester that moves test motherboards along a highway for remote loading/unloading
JP2011091262A (ja) * 2009-10-23 2011-05-06 Tokyo Seimitsu Co Ltd プローバおよびプローブ検査方法
US8872532B2 (en) 2009-12-31 2014-10-28 Formfactor, Inc. Wafer test cassette system
TWI719331B (zh) * 2011-10-26 2021-02-21 美商布魯克斯自動機械公司 基板處理系統
JP6333112B2 (ja) * 2014-08-20 2018-05-30 東京エレクトロン株式会社 ウエハ検査装置
EP3589965B1 (en) 2017-03-03 2023-12-06 AEHR Test Systems Electronics tester
JP2018207022A (ja) * 2017-06-08 2018-12-27 株式会社ディスコ 加工装置
JP6887332B2 (ja) * 2017-07-19 2021-06-16 東京エレクトロン株式会社 検査システム
KR102014334B1 (ko) 2017-09-28 2019-08-26 한국생산기술연구원 기판 검사 카트리지 및 이의 제조 방법
US10910249B2 (en) * 2017-11-13 2021-02-02 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for automated wafer handling
JP7267111B2 (ja) 2019-05-31 2023-05-01 東京エレクトロン株式会社 位置決め機構及び位置決め方法
WO2021095251A1 (ja) 2019-11-15 2021-05-20 キオクシア株式会社 ストレージデバイスおよび制御方法
WO2021095232A1 (ja) 2019-11-15 2021-05-20 キオクシア株式会社 ストレージシステム及びウェハ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197697A (ja) 2001-12-28 2003-07-11 Hitachi Ltd 半導体装置の製造方法
JP2020194889A (ja) 2019-05-28 2020-12-03 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
WO2021095252A1 (ja) 2019-11-15 2021-05-20 キオクシア株式会社 ストレージデバイスおよびストレージシステム

Also Published As

Publication number Publication date
US20240014062A1 (en) 2024-01-11
EP4318246A4 (en) 2025-02-19
TW202337802A (zh) 2023-10-01
JPWO2022201283A1 (https=) 2022-09-29
WO2022201283A1 (ja) 2022-09-29
TWI804888B (zh) 2023-06-11
DE112021007343T5 (de) 2024-05-02
CN116547654A (zh) 2023-08-04
US12469729B2 (en) 2025-11-11
TW202237519A (zh) 2022-10-01
TWI887651B (zh) 2025-06-21
EP4318246A1 (en) 2024-02-07

Similar Documents

Publication Publication Date Title
US12469729B2 (en) Storage system
US11003609B2 (en) Multi-protocol IO infrastructure for a flexible storage platform
US11102902B2 (en) Data storage system connectors with parallel array of dense memory cards and high airflow
US8681489B2 (en) Storage control apparatus
US11422712B2 (en) Storage device and storage system including a memory to store a check code for an integrity check
TW201430986A (zh) 具有整合式樞軸架座的微型拾取陣列
JPWO2004106945A1 (ja) 電子部品試験装置
US6829658B2 (en) Compatible signal-to-pin connector assignments for usage with fibre channel and advanced technology attachment disk drives
JPWO2022201283A5 (https=)
US12334473B2 (en) Stacked semiconductor, wafer stack, method of manufacturing stacked semiconductor, assistance device, and program
US20240134814A1 (en) Scaling midplane bandwidth between storage processors via network devices
CN118173132A (zh) 固态驱动装置以及包括该固态驱动装置的数据存储装置
JP7585507B2 (ja) ストレージシステム
CN113168847B (zh) 包括沿着磁盘护罩的弧安装的印刷电路板的数据存储装置
CN120220744A (zh) 用于改变存储设备的形状因子的扩展存储模块及包括该扩展存储模块的存储设备
CN116093080A (zh) 半导体存储装置
JP2005093657A (ja) 基板処理装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230323

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230323

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240213

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240313

R151 Written notification of patent or utility model registration

Ref document number: 7456065

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151