TWI786184B - 配線電路基板及其製造方法 - Google Patents

配線電路基板及其製造方法 Download PDF

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Publication number
TWI786184B
TWI786184B TW107132161A TW107132161A TWI786184B TW I786184 B TWI786184 B TW I786184B TW 107132161 A TW107132161 A TW 107132161A TW 107132161 A TW107132161 A TW 107132161A TW I786184 B TWI786184 B TW I786184B
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TW
Taiwan
Prior art keywords
layer
mentioned
thickness
circuit board
thickness direction
Prior art date
Application number
TW107132161A
Other languages
English (en)
Chinese (zh)
Other versions
TW201933954A (zh
Inventor
河邨良広
柴田周作
高倉隼人
伊藤正樹
Original Assignee
日商日東電工股份有限公司
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Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201933954A publication Critical patent/TW201933954A/zh
Application granted granted Critical
Publication of TWI786184B publication Critical patent/TWI786184B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
TW107132161A 2017-09-15 2018-09-13 配線電路基板及其製造方法 TWI786184B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017177786A JP7407498B2 (ja) 2017-09-15 2017-09-15 配線回路基板およびその製造方法
JP2017-177786 2017-09-15

Publications (2)

Publication Number Publication Date
TW201933954A TW201933954A (zh) 2019-08-16
TWI786184B true TWI786184B (zh) 2022-12-11

Family

ID=65723582

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107132161A TWI786184B (zh) 2017-09-15 2018-09-13 配線電路基板及其製造方法

Country Status (5)

Country Link
US (1) US11297711B2 (enExample)
JP (1) JP7407498B2 (enExample)
CN (1) CN111096087B (enExample)
TW (1) TWI786184B (enExample)
WO (1) WO2019054246A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7424802B2 (ja) * 2019-11-12 2024-01-30 日東電工株式会社 配線回路基板およびその製造方法
US20230014046A1 (en) * 2021-07-13 2023-01-19 Mediatek Inc. Semiconductor devices with in-package PGS for coupling noise suppression
US20230076844A1 (en) * 2021-09-09 2023-03-09 Qualcomm Incorporated Semiconductor die module packages with void-defined sections in a metal structure(s) in a package substrate to reduce die-substrate mechanical stress, and related methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04165696A (ja) * 1990-10-30 1992-06-11 Fujitsu Ltd 薄膜多層基板の製造方法
JP2014067851A (ja) * 2012-09-26 2014-04-17 Sumitomo Electric Printed Circuit Inc プリント配線板及び該プリント配線板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW448524B (en) * 1997-01-17 2001-08-01 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
JP3702646B2 (ja) * 1998-05-20 2005-10-05 富士通株式会社 回路基板の製造方法
JP3756041B2 (ja) * 1999-05-27 2006-03-15 Ｈｏｙａ株式会社 多層プリント配線板の製造方法
JP4369684B2 (ja) * 2003-05-26 2009-11-25 大日本印刷株式会社 多層配線基板およびその製造方法
JP4366292B2 (ja) * 2004-11-04 2009-11-18 北川工業株式会社 電磁波シールドフィルム
JP2006339661A (ja) * 2006-06-13 2006-12-14 Kaneka Corp 多層ボンディングシート及びフレキシブル両面金属張積層板の製造方法
JP4790558B2 (ja) 2006-10-02 2011-10-12 日東電工株式会社 配線回路基板の製造方法
JP2008192978A (ja) * 2007-02-07 2008-08-21 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2009278048A (ja) * 2008-05-19 2009-11-26 Kyocera Chemical Corp シールド被覆フレキシブルプリント配線板の製造方法
JP2009295850A (ja) * 2008-06-06 2009-12-17 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
JP2011103414A (ja) * 2009-11-12 2011-05-26 Toray Advanced Film Co Ltd 金属パターン積層基材の製造方法。
CN102959948A (zh) * 2011-04-05 2013-03-06 松下电器产业株式会社 固态成像装置和固态成像装置的制造方法
JP5829100B2 (ja) 2011-10-27 2015-12-09 日東電工株式会社 配線回路基板
JP6418605B2 (ja) * 2015-07-31 2018-11-07 東芝メモリ株式会社 半導体装置および半導体装置の製造方法
JP5975364B2 (ja) 2015-08-10 2016-08-23 大日本印刷株式会社 サスペンション用基板の製造方法
JP6713784B2 (ja) * 2016-02-18 2020-06-24 日鉄ケミカル＆マテリアル株式会社 ポリイミド、ポリイミド溶液、樹脂フィルム、ポリイミド組成物、架橋ポリイミド、カバーレイフィルム及び回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04165696A (ja) * 1990-10-30 1992-06-11 Fujitsu Ltd 薄膜多層基板の製造方法
JP2014067851A (ja) * 2012-09-26 2014-04-17 Sumitomo Electric Printed Circuit Inc プリント配線板及び該プリント配線板の製造方法

Also Published As

Publication number Publication date
US20210084750A1 (en) 2021-03-18
WO2019054246A1 (ja) 2019-03-21
US11297711B2 (en) 2022-04-05
CN111096087B (zh) 2023-11-24
JP7407498B2 (ja) 2024-01-04
JP2019054130A (ja) 2019-04-04
CN111096087A (zh) 2020-05-01
TW201933954A (zh) 2019-08-16

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