CN111096087B - 布线电路基板及其制造方法 - Google Patents

布线电路基板及其制造方法 Download PDF

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Publication number
CN111096087B
CN111096087B CN201880059596.9A CN201880059596A CN111096087B CN 111096087 B CN111096087 B CN 111096087B CN 201880059596 A CN201880059596 A CN 201880059596A CN 111096087 B CN111096087 B CN 111096087B
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CN
China
Prior art keywords
layer
thickness
insulating
insulating layer
circuit board
Prior art date
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Active
Application number
CN201880059596.9A
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English (en)
Chinese (zh)
Other versions
CN111096087A (zh
Inventor
河邨良广
柴田周作
高仓隼人
伊藤正树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
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Publication date
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Publication of CN111096087A publication Critical patent/CN111096087A/zh
Application granted granted Critical
Publication of CN111096087B publication Critical patent/CN111096087B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
CN201880059596.9A 2017-09-15 2018-09-05 布线电路基板及其制造方法 Active CN111096087B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017177786A JP7407498B2 (ja) 2017-09-15 2017-09-15 配線回路基板およびその製造方法
JP2017-177786 2017-09-15
PCT/JP2018/032849 WO2019054246A1 (ja) 2017-09-15 2018-09-05 配線回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
CN111096087A CN111096087A (zh) 2020-05-01
CN111096087B true CN111096087B (zh) 2023-11-24

Family

ID=65723582

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880059596.9A Active CN111096087B (zh) 2017-09-15 2018-09-05 布线电路基板及其制造方法

Country Status (5)

Country Link
US (1) US11297711B2 (enExample)
JP (1) JP7407498B2 (enExample)
CN (1) CN111096087B (enExample)
TW (1) TWI786184B (enExample)
WO (1) WO2019054246A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7424802B2 (ja) * 2019-11-12 2024-01-30 日東電工株式会社 配線回路基板およびその製造方法
US20230014046A1 (en) * 2021-07-13 2023-01-19 Mediatek Inc. Semiconductor devices with in-package PGS for coupling noise suppression
US20230076844A1 (en) * 2021-09-09 2023-03-09 Qualcomm Incorporated Semiconductor die module packages with void-defined sections in a metal structure(s) in a package substrate to reduce die-substrate mechanical stress, and related methods

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330692A (ja) * 1998-05-20 1999-11-30 Fujitsu Ltd 回路基板の製造方法
JP2001044639A (ja) * 1999-05-27 2001-02-16 Hoya Corp 多層プリント配線板及びその製造方法
JP2008192978A (ja) * 2007-02-07 2008-08-21 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2009278048A (ja) * 2008-05-19 2009-11-26 Kyocera Chemical Corp シールド被覆フレキシブルプリント配線板の製造方法
JP2014067851A (ja) * 2012-09-26 2014-04-17 Sumitomo Electric Printed Circuit Inc プリント配線板及び該プリント配線板の製造方法
CN106409781A (zh) * 2015-07-31 2017-02-15 株式会社东芝 半导体装置及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04165696A (ja) * 1990-10-30 1992-06-11 Fujitsu Ltd 薄膜多層基板の製造方法
TW448524B (en) * 1997-01-17 2001-08-01 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
JP4369684B2 (ja) * 2003-05-26 2009-11-25 大日本印刷株式会社 多層配線基板およびその製造方法
JP4366292B2 (ja) * 2004-11-04 2009-11-18 北川工業株式会社 電磁波シールドフィルム
JP2006339661A (ja) * 2006-06-13 2006-12-14 Kaneka Corp 多層ボンディングシート及びフレキシブル両面金属張積層板の製造方法
JP4790558B2 (ja) 2006-10-02 2011-10-12 日東電工株式会社 配線回路基板の製造方法
JP2009295850A (ja) * 2008-06-06 2009-12-17 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
JP2011103414A (ja) * 2009-11-12 2011-05-26 Toray Advanced Film Co Ltd 金属パターン積層基材の製造方法。
CN102959948A (zh) * 2011-04-05 2013-03-06 松下电器产业株式会社 固态成像装置和固态成像装置的制造方法
JP5829100B2 (ja) 2011-10-27 2015-12-09 日東電工株式会社 配線回路基板
JP5975364B2 (ja) 2015-08-10 2016-08-23 大日本印刷株式会社 サスペンション用基板の製造方法
JP6713784B2 (ja) * 2016-02-18 2020-06-24 日鉄ケミカル＆マテリアル株式会社 ポリイミド、ポリイミド溶液、樹脂フィルム、ポリイミド組成物、架橋ポリイミド、カバーレイフィルム及び回路基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330692A (ja) * 1998-05-20 1999-11-30 Fujitsu Ltd 回路基板の製造方法
JP2001044639A (ja) * 1999-05-27 2001-02-16 Hoya Corp 多層プリント配線板及びその製造方法
US6339197B1 (en) * 1999-05-27 2002-01-15 Hoya Corporation Multilayer printed circuit board and the manufacturing method
JP2008192978A (ja) * 2007-02-07 2008-08-21 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2009278048A (ja) * 2008-05-19 2009-11-26 Kyocera Chemical Corp シールド被覆フレキシブルプリント配線板の製造方法
JP2014067851A (ja) * 2012-09-26 2014-04-17 Sumitomo Electric Printed Circuit Inc プリント配線板及び該プリント配線板の製造方法
CN106409781A (zh) * 2015-07-31 2017-02-15 株式会社东芝 半导体装置及其制造方法

Also Published As

Publication number Publication date
US20210084750A1 (en) 2021-03-18
WO2019054246A1 (ja) 2019-03-21
US11297711B2 (en) 2022-04-05
JP7407498B2 (ja) 2024-01-04
JP2019054130A (ja) 2019-04-04
TWI786184B (zh) 2022-12-11
CN111096087A (zh) 2020-05-01
TW201933954A (zh) 2019-08-16

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