TWI747225B - 搬送裝置 - Google Patents

搬送裝置 Download PDF

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Publication number
TWI747225B
TWI747225B TW109111322A TW109111322A TWI747225B TW I747225 B TWI747225 B TW I747225B TW 109111322 A TW109111322 A TW 109111322A TW 109111322 A TW109111322 A TW 109111322A TW I747225 B TWI747225 B TW I747225B
Authority
TW
Taiwan
Prior art keywords
probe
guide
semiconductor wafer
holding surface
conveying device
Prior art date
Application number
TW109111322A
Other languages
English (en)
Chinese (zh)
Other versions
TW202040739A (zh
Inventor
李瑾
菊地広
榎戸聡
Original Assignee
日商新川股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商新川股份有限公司 filed Critical 日商新川股份有限公司
Publication of TW202040739A publication Critical patent/TW202040739A/zh
Application granted granted Critical
Publication of TWI747225B publication Critical patent/TWI747225B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW109111322A 2019-04-15 2020-04-01 搬送裝置 TWI747225B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019076885 2019-04-15
JP2019-076885 2019-04-15

Publications (2)

Publication Number Publication Date
TW202040739A TW202040739A (zh) 2020-11-01
TWI747225B true TWI747225B (zh) 2021-11-21

Family

ID=72837464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109111322A TWI747225B (zh) 2019-04-15 2020-04-01 搬送裝置

Country Status (7)

Country Link
US (1) US12217996B2 (https=)
JP (1) JP7161251B2 (https=)
KR (1) KR20210144882A (https=)
CN (1) CN114026677A (https=)
SG (1) SG11202110943XA (https=)
TW (1) TWI747225B (https=)
WO (1) WO2020213566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022157830A1 (ja) * 2021-01-19 2022-07-28 株式会社新川 半導体装置の製造装置
US12519003B2 (en) * 2021-03-08 2026-01-06 Yamaha Robotics Co., Ltd. Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuck
JP7831931B2 (ja) * 2022-03-11 2026-03-17 東京エレクトロン株式会社 チップキャリアおよびチップ処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012099755A (ja) * 2010-11-05 2012-05-24 Disco Abrasive Syst Ltd 搬送装置
TW201908538A (zh) * 2017-07-14 2019-03-01 日商荏原製作所股份有限公司 基板保持装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1214033B (it) * 1987-02-03 1990-01-05 Carlomagno Giovanni Maria Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura
JP2524776B2 (ja) 1987-11-13 1996-08-14 株式会社日立製作所 板状物受け渡し装置
JPH06321351A (ja) 1993-05-14 1994-11-22 Hiroshi Akashi 無接触ピックアップ装置
JP4766824B2 (ja) * 2000-12-05 2011-09-07 日本空圧システム株式会社 保持具
JP5027399B2 (ja) * 2005-10-12 2012-09-19 日本特殊陶業株式会社 配線基板の搬送方法および搬送装置
GB0522552D0 (en) * 2005-11-04 2005-12-14 Univ Salford The Handling device
JP3122750U (ja) 2006-04-13 2006-06-29 博 明石 昇降ストッパーを付設した非接触搬送装置
JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置
KR101261313B1 (ko) 2010-05-12 2013-05-07 주식회사 에이엠에이치시스템즈 평판 이송물 정렬픽업 이송장치
JP5452413B2 (ja) * 2010-08-13 2014-03-26 株式会社アイエスエンジニアリング 非接触吸着装置
JP5660316B2 (ja) 2011-03-07 2015-01-28 村田機械株式会社 基板移載装置
JP5417467B2 (ja) 2012-02-28 2014-02-12 エルジー シーエヌエス カンパニー リミテッド Ｌｅｄウェハーピッカー
JP5830440B2 (ja) 2012-06-20 2015-12-09 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2014165470A (ja) 2013-02-28 2014-09-08 Nikon Corp 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法
WO2016052631A1 (ja) * 2014-09-30 2016-04-07 株式会社カネカ 試料保持装置、太陽電池の製造方法及び太陽電池モジュールの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012099755A (ja) * 2010-11-05 2012-05-24 Disco Abrasive Syst Ltd 搬送装置
TW201908538A (zh) * 2017-07-14 2019-03-01 日商荏原製作所股份有限公司 基板保持装置

Also Published As

Publication number Publication date
SG11202110943XA (en) 2021-10-28
WO2020213566A1 (ja) 2020-10-22
TW202040739A (zh) 2020-11-01
JPWO2020213566A1 (https=) 2020-10-22
CN114026677A (zh) 2022-02-08
KR20210144882A (ko) 2021-11-30
US12217996B2 (en) 2025-02-04
JP7161251B2 (ja) 2022-10-26
US20220216089A1 (en) 2022-07-07

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