KR20210144882A - 반송 장치 - Google Patents

반송 장치 Download PDF

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Publication number
KR20210144882A
KR20210144882A KR1020217035723A KR20217035723A KR20210144882A KR 20210144882 A KR20210144882 A KR 20210144882A KR 1020217035723 A KR1020217035723 A KR 1020217035723A KR 20217035723 A KR20217035723 A KR 20217035723A KR 20210144882 A KR20210144882 A KR 20210144882A
Authority
KR
South Korea
Prior art keywords
guide
semiconductor chip
probe
guide probe
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020217035723A
Other languages
English (en)
Korean (ko)
Inventor
진 리
히로시 키쿠치
사토시 에노키도
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20210144882A publication Critical patent/KR20210144882A/ko
Ceased legal-status Critical Current

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Classifications

    • H01L21/67144—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H01L21/67721—
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
KR1020217035723A 2019-04-15 2020-04-13 반송 장치 Ceased KR20210144882A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019076885 2019-04-15
JPJP-P-2019-076885 2019-04-15
PCT/JP2020/016291 WO2020213566A1 (ja) 2019-04-15 2020-04-13 搬送装置

Publications (1)

Publication Number Publication Date
KR20210144882A true KR20210144882A (ko) 2021-11-30

Family

ID=72837464

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217035723A Ceased KR20210144882A (ko) 2019-04-15 2020-04-13 반송 장치

Country Status (7)

Country Link
US (1) US12217996B2 (https=)
JP (1) JP7161251B2 (https=)
KR (1) KR20210144882A (https=)
CN (1) CN114026677A (https=)
SG (1) SG11202110943XA (https=)
TW (1) TWI747225B (https=)
WO (1) WO2020213566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022157830A1 (ja) * 2021-01-19 2022-07-28 株式会社新川 半導体装置の製造装置
US12519003B2 (en) * 2021-03-08 2026-01-06 Yamaha Robotics Co., Ltd. Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuck
JP7831931B2 (ja) * 2022-03-11 2026-03-17 東京エレクトロン株式会社 チップキャリアおよびチップ処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127538A (ja) 1987-11-13 1989-05-19 Hitachi Ltd 板状物受け渡し装置
JP2014003238A (ja) 2012-06-20 2014-01-09 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2014165470A (ja) 2013-02-28 2014-09-08 Nikon Corp 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1214033B (it) * 1987-02-03 1990-01-05 Carlomagno Giovanni Maria Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura
JPH06321351A (ja) 1993-05-14 1994-11-22 Hiroshi Akashi 無接触ピックアップ装置
JP4766824B2 (ja) * 2000-12-05 2011-09-07 日本空圧システム株式会社 保持具
JP5027399B2 (ja) * 2005-10-12 2012-09-19 日本特殊陶業株式会社 配線基板の搬送方法および搬送装置
GB0522552D0 (en) * 2005-11-04 2005-12-14 Univ Salford The Handling device
JP3122750U (ja) 2006-04-13 2006-06-29 博 明石 昇降ストッパーを付設した非接触搬送装置
JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置
KR101261313B1 (ko) 2010-05-12 2013-05-07 주식회사 에이엠에이치시스템즈 평판 이송물 정렬픽업 이송장치
JP5452413B2 (ja) * 2010-08-13 2014-03-26 株式会社アイエスエンジニアリング 非接触吸着装置
JP5846734B2 (ja) * 2010-11-05 2016-01-20 株式会社ディスコ 搬送装置
JP5660316B2 (ja) 2011-03-07 2015-01-28 村田機械株式会社 基板移載装置
JP5417467B2 (ja) 2012-02-28 2014-02-12 エルジー シーエヌエス カンパニー リミテッド Ｌｅｄウェハーピッカー
WO2016052631A1 (ja) * 2014-09-30 2016-04-07 株式会社カネカ 試料保持装置、太陽電池の製造方法及び太陽電池モジュールの製造方法
JP6948860B2 (ja) * 2017-07-14 2021-10-13 株式会社荏原製作所 基板保持装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127538A (ja) 1987-11-13 1989-05-19 Hitachi Ltd 板状物受け渡し装置
JP2014003238A (ja) 2012-06-20 2014-01-09 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2014165470A (ja) 2013-02-28 2014-09-08 Nikon Corp 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法

Also Published As

Publication number Publication date
TWI747225B (zh) 2021-11-21
SG11202110943XA (en) 2021-10-28
WO2020213566A1 (ja) 2020-10-22
TW202040739A (zh) 2020-11-01
JPWO2020213566A1 (https=) 2020-10-22
CN114026677A (zh) 2022-02-08
US12217996B2 (en) 2025-02-04
JP7161251B2 (ja) 2022-10-26
US20220216089A1 (en) 2022-07-07

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St.27 status event code: A-2-3-E10-E13-lim-X000

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PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000