CN114026677A - 搬送装置 - Google Patents

搬送装置 Download PDF

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Publication number
CN114026677A
CN114026677A CN202080027920.6A CN202080027920A CN114026677A CN 114026677 A CN114026677 A CN 114026677A CN 202080027920 A CN202080027920 A CN 202080027920A CN 114026677 A CN114026677 A CN 114026677A
Authority
CN
China
Prior art keywords
guide
semiconductor chip
probe
guide probe
holding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080027920.6A
Other languages
English (en)
Chinese (zh)
Inventor
李瑾
菊地広
榎戸聡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of CN114026677A publication Critical patent/CN114026677A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN202080027920.6A 2019-04-15 2020-04-13 搬送装置 Pending CN114026677A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019076885 2019-04-15
JP2019-076885 2019-04-15
PCT/JP2020/016291 WO2020213566A1 (ja) 2019-04-15 2020-04-13 搬送装置

Publications (1)

Publication Number Publication Date
CN114026677A true CN114026677A (zh) 2022-02-08

Family

ID=72837464

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080027920.6A Pending CN114026677A (zh) 2019-04-15 2020-04-13 搬送装置

Country Status (7)

Country Link
US (1) US12217996B2 (https=)
JP (1) JP7161251B2 (https=)
KR (1) KR20210144882A (https=)
CN (1) CN114026677A (https=)
SG (1) SG11202110943XA (https=)
TW (1) TWI747225B (https=)
WO (1) WO2020213566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022157830A1 (ja) * 2021-01-19 2022-07-28 株式会社新川 半導体装置の製造装置
US12519003B2 (en) * 2021-03-08 2026-01-06 Yamaha Robotics Co., Ltd. Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuck
JP7831931B2 (ja) * 2022-03-11 2026-03-17 東京エレクトロン株式会社 チップキャリアおよびチップ処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109748A (ja) * 2005-10-12 2007-04-26 Ngk Spark Plug Co Ltd 配線基板の搬送方法および搬送装置
JP2012040621A (ja) * 2010-08-13 2012-03-01 Is Engineering:Kk 非接触吸着装置
JP2012099755A (ja) * 2010-11-05 2012-05-24 Disco Abrasive Syst Ltd 搬送装置
JP2012183620A (ja) * 2011-03-07 2012-09-27 Murata Machinery Ltd 基板移載装置
US20170200631A1 (en) * 2014-09-30 2017-07-13 Kaneka Corporation Sample-holding device, method for manufacturing solar cell, and method for manufacturing solar cell module
TW201908538A (zh) * 2017-07-14 2019-03-01 日商荏原製作所股份有限公司 基板保持装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1214033B (it) * 1987-02-03 1990-01-05 Carlomagno Giovanni Maria Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura
JP2524776B2 (ja) 1987-11-13 1996-08-14 株式会社日立製作所 板状物受け渡し装置
JPH06321351A (ja) 1993-05-14 1994-11-22 Hiroshi Akashi 無接触ピックアップ装置
JP4766824B2 (ja) * 2000-12-05 2011-09-07 日本空圧システム株式会社 保持具
GB0522552D0 (en) * 2005-11-04 2005-12-14 Univ Salford The Handling device
JP3122750U (ja) 2006-04-13 2006-06-29 博 明石 昇降ストッパーを付設した非接触搬送装置
JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置
KR101261313B1 (ko) 2010-05-12 2013-05-07 주식회사 에이엠에이치시스템즈 평판 이송물 정렬픽업 이송장치
JP5417467B2 (ja) 2012-02-28 2014-02-12 エルジー シーエヌエス カンパニー リミテッド Ｌｅｄウェハーピッカー
JP5830440B2 (ja) 2012-06-20 2015-12-09 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2014165470A (ja) 2013-02-28 2014-09-08 Nikon Corp 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109748A (ja) * 2005-10-12 2007-04-26 Ngk Spark Plug Co Ltd 配線基板の搬送方法および搬送装置
JP2012040621A (ja) * 2010-08-13 2012-03-01 Is Engineering:Kk 非接触吸着装置
JP2012099755A (ja) * 2010-11-05 2012-05-24 Disco Abrasive Syst Ltd 搬送装置
JP2012183620A (ja) * 2011-03-07 2012-09-27 Murata Machinery Ltd 基板移載装置
US20170200631A1 (en) * 2014-09-30 2017-07-13 Kaneka Corporation Sample-holding device, method for manufacturing solar cell, and method for manufacturing solar cell module
TW201908538A (zh) * 2017-07-14 2019-03-01 日商荏原製作所股份有限公司 基板保持装置

Also Published As

Publication number Publication date
TWI747225B (zh) 2021-11-21
SG11202110943XA (en) 2021-10-28
WO2020213566A1 (ja) 2020-10-22
TW202040739A (zh) 2020-11-01
JPWO2020213566A1 (https=) 2020-10-22
KR20210144882A (ko) 2021-11-30
US12217996B2 (en) 2025-02-04
JP7161251B2 (ja) 2022-10-26
US20220216089A1 (en) 2022-07-07

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