SG11202110943XA - Conveying device - Google Patents

Conveying device

Info

Publication number
SG11202110943XA
SG11202110943XA SG11202110943XA SG11202110943XA SG11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA
Authority
SG
Singapore
Prior art keywords
conveying device
conveying
Prior art date
Application number
SG11202110943XA
Inventor
Jin Li
Hiroshi Kikuchi
Satoshi Enokido
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202110943XA publication Critical patent/SG11202110943XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
SG11202110943XA 2019-04-15 2020-04-13 Conveying device SG11202110943XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019076885 2019-04-15
PCT/JP2020/016291 WO2020213566A1 (en) 2019-04-15 2020-04-13 Conveying device

Publications (1)

Publication Number Publication Date
SG11202110943XA true SG11202110943XA (en) 2021-10-28

Family

ID=72837464

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202110943XA SG11202110943XA (en) 2019-04-15 2020-04-13 Conveying device

Country Status (7)

Country Link
US (1) US20220216089A1 (en)
JP (1) JP7161251B2 (en)
KR (1) KR20210144882A (en)
CN (1) CN114026677A (en)
SG (1) SG11202110943XA (en)
TW (1) TWI747225B (en)
WO (1) WO2020213566A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022157830A1 (en) * 2021-01-19 2022-07-28 株式会社新川 Method for manufacturing semiconductor device
JP7418387B2 (en) 2021-12-15 2024-01-19 矢崎総業株式会社 Grommet and wire harness

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2524776B2 (en) 1987-11-13 1996-08-14 株式会社日立製作所 Plate transfer device
JPH06321351A (en) * 1993-05-14 1994-11-22 Hiroshi Akashi Noncontact pickup device
JP4766824B2 (en) * 2000-12-05 2011-09-07 日本空圧システム株式会社 Retainer
JP3122750U (en) * 2006-04-13 2006-06-29 博 明石 Non-contact transfer device with lifting stopper
JP5403247B2 (en) * 2009-09-07 2014-01-29 村田機械株式会社 Substrate transfer device
KR101261313B1 (en) * 2010-05-12 2013-05-07 주식회사 에이엠에이치시스템즈 Apparatus for aligning and pick up transporting of moving object
JP5846734B2 (en) * 2010-11-05 2016-01-20 株式会社ディスコ Transport device
JP5417467B2 (en) 2012-02-28 2014-02-12 エルジー シーエヌエス カンパニー リミテッド LED wafer picker
JP5830440B2 (en) 2012-06-20 2015-12-09 東京エレクトロン株式会社 Peeling system, peeling method, program, and computer storage medium
US9092059B2 (en) 2012-10-26 2015-07-28 Immersion Corporation Stream-independent sound to haptic effect conversion system
JP2014165470A (en) 2013-02-28 2014-09-08 Nikon Corp Conveyance system and method, exposure apparatus and method, and device manufacturing method
JP6948860B2 (en) * 2017-07-14 2021-10-13 株式会社荏原製作所 Board holding device

Also Published As

Publication number Publication date
TW202040739A (en) 2020-11-01
JP7161251B2 (en) 2022-10-26
US20220216089A1 (en) 2022-07-07
CN114026677A (en) 2022-02-08
TWI747225B (en) 2021-11-21
JPWO2020213566A1 (en) 2020-10-22
KR20210144882A (en) 2021-11-30
WO2020213566A1 (en) 2020-10-22

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