JPWO2020213566A1 - - Google Patents
Info
- Publication number
- JPWO2020213566A1 JPWO2020213566A1 JP2021514936A JP2021514936A JPWO2020213566A1 JP WO2020213566 A1 JPWO2020213566 A1 JP WO2020213566A1 JP 2021514936 A JP2021514936 A JP 2021514936A JP 2021514936 A JP2021514936 A JP 2021514936A JP WO2020213566 A1 JPWO2020213566 A1 JP WO2020213566A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019076885 | 2019-04-15 | ||
| JP2019076885 | 2019-04-15 | ||
| PCT/JP2020/016291 WO2020213566A1 (ja) | 2019-04-15 | 2020-04-13 | 搬送装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020213566A1 true JPWO2020213566A1 (https=) | 2020-10-22 |
| JPWO2020213566A5 JPWO2020213566A5 (https=) | 2022-06-09 |
| JP7161251B2 JP7161251B2 (ja) | 2022-10-26 |
Family
ID=72837464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021514936A Active JP7161251B2 (ja) | 2019-04-15 | 2020-04-13 | 搬送装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12217996B2 (https=) |
| JP (1) | JP7161251B2 (https=) |
| KR (1) | KR20210144882A (https=) |
| CN (1) | CN114026677A (https=) |
| SG (1) | SG11202110943XA (https=) |
| TW (1) | TWI747225B (https=) |
| WO (1) | WO2020213566A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022157830A1 (ja) * | 2021-01-19 | 2022-07-28 | 株式会社新川 | 半導体装置の製造装置 |
| US12519003B2 (en) * | 2021-03-08 | 2026-01-06 | Yamaha Robotics Co., Ltd. | Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuck |
| JP7831931B2 (ja) * | 2022-03-11 | 2026-03-17 | 東京エレクトロン株式会社 | チップキャリアおよびチップ処理方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01127538A (ja) * | 1987-11-13 | 1989-05-19 | Hitachi Ltd | 板状物受け渡し装置 |
| JPH06321351A (ja) * | 1993-05-14 | 1994-11-22 | Hiroshi Akashi | 無接触ピックアップ装置 |
| JP3122750U (ja) * | 2006-04-13 | 2006-06-29 | 博 明石 | 昇降ストッパーを付設した非接触搬送装置 |
| JP2011060849A (ja) * | 2009-09-07 | 2011-03-24 | Murata Machinery Ltd | 基板移載装置 |
| JP4766824B2 (ja) * | 2000-12-05 | 2011-09-07 | 日本空圧システム株式会社 | 保持具 |
| KR20110125062A (ko) * | 2010-05-12 | 2011-11-18 | 주식회사 에이엠에이치시스템즈 | 평판 이송물 정렬픽업 이송장치 |
| JP2012099755A (ja) * | 2010-11-05 | 2012-05-24 | Disco Abrasive Syst Ltd | 搬送装置 |
| JP2013179139A (ja) * | 2012-02-28 | 2013-09-09 | Egcns Co Ltd | Ｌｅｄウェハーピッカー |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1214033B (it) * | 1987-02-03 | 1990-01-05 | Carlomagno Giovanni Maria | Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura |
| JP5027399B2 (ja) * | 2005-10-12 | 2012-09-19 | 日本特殊陶業株式会社 | 配線基板の搬送方法および搬送装置 |
| GB0522552D0 (en) * | 2005-11-04 | 2005-12-14 | Univ Salford The | Handling device |
| JP5452413B2 (ja) * | 2010-08-13 | 2014-03-26 | 株式会社アイエスエンジニアリング | 非接触吸着装置 |
| JP5660316B2 (ja) | 2011-03-07 | 2015-01-28 | 村田機械株式会社 | 基板移載装置 |
| JP5830440B2 (ja) | 2012-06-20 | 2015-12-09 | 東京エレクトロン株式会社 | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
| JP2014165470A (ja) | 2013-02-28 | 2014-09-08 | Nikon Corp | 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法 |
| WO2016052631A1 (ja) * | 2014-09-30 | 2016-04-07 | 株式会社カネカ | 試料保持装置、太陽電池の製造方法及び太陽電池モジュールの製造方法 |
| JP6948860B2 (ja) * | 2017-07-14 | 2021-10-13 | 株式会社荏原製作所 | 基板保持装置 |
-
2020
- 2020-04-01 TW TW109111322A patent/TWI747225B/zh active
- 2020-04-13 JP JP2021514936A patent/JP7161251B2/ja active Active
- 2020-04-13 SG SG11202110943XA patent/SG11202110943XA/en unknown
- 2020-04-13 US US17/603,934 patent/US12217996B2/en active Active
- 2020-04-13 WO PCT/JP2020/016291 patent/WO2020213566A1/ja not_active Ceased
- 2020-04-13 CN CN202080027920.6A patent/CN114026677A/zh active Pending
- 2020-04-13 KR KR1020217035723A patent/KR20210144882A/ko not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01127538A (ja) * | 1987-11-13 | 1989-05-19 | Hitachi Ltd | 板状物受け渡し装置 |
| JPH06321351A (ja) * | 1993-05-14 | 1994-11-22 | Hiroshi Akashi | 無接触ピックアップ装置 |
| JP4766824B2 (ja) * | 2000-12-05 | 2011-09-07 | 日本空圧システム株式会社 | 保持具 |
| JP3122750U (ja) * | 2006-04-13 | 2006-06-29 | 博 明石 | 昇降ストッパーを付設した非接触搬送装置 |
| JP2011060849A (ja) * | 2009-09-07 | 2011-03-24 | Murata Machinery Ltd | 基板移載装置 |
| KR20110125062A (ko) * | 2010-05-12 | 2011-11-18 | 주식회사 에이엠에이치시스템즈 | 평판 이송물 정렬픽업 이송장치 |
| JP2012099755A (ja) * | 2010-11-05 | 2012-05-24 | Disco Abrasive Syst Ltd | 搬送装置 |
| JP2013179139A (ja) * | 2012-02-28 | 2013-09-09 | Egcns Co Ltd | Ｌｅｄウェハーピッカー |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI747225B (zh) | 2021-11-21 |
| SG11202110943XA (en) | 2021-10-28 |
| WO2020213566A1 (ja) | 2020-10-22 |
| TW202040739A (zh) | 2020-11-01 |
| CN114026677A (zh) | 2022-02-08 |
| KR20210144882A (ko) | 2021-11-30 |
| US12217996B2 (en) | 2025-02-04 |
| JP7161251B2 (ja) | 2022-10-26 |
| US20220216089A1 (en) | 2022-07-07 |
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