JP7161251B2 - 搬送装置 - Google Patents

搬送装置 Download PDF

Info

Publication number
JP7161251B2
JP7161251B2 JP2021514936A JP2021514936A JP7161251B2 JP 7161251 B2 JP7161251 B2 JP 7161251B2 JP 2021514936 A JP2021514936 A JP 2021514936A JP 2021514936 A JP2021514936 A JP 2021514936A JP 7161251 B2 JP7161251 B2 JP 7161251B2
Authority
JP
Japan
Prior art keywords
guide
probe
semiconductor chip
chuck
holding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021514936A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020213566A5 (https=
JPWO2020213566A1 (https=
Inventor
瑾 李
広 菊地
聡 榎戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of JPWO2020213566A1 publication Critical patent/JPWO2020213566A1/ja
Publication of JPWO2020213566A5 publication Critical patent/JPWO2020213566A5/ja
Application granted granted Critical
Publication of JP7161251B2 publication Critical patent/JP7161251B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2021514936A 2019-04-15 2020-04-13 搬送装置 Active JP7161251B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019076885 2019-04-15
JP2019076885 2019-04-15
PCT/JP2020/016291 WO2020213566A1 (ja) 2019-04-15 2020-04-13 搬送装置

Publications (3)

Publication Number Publication Date
JPWO2020213566A1 JPWO2020213566A1 (https=) 2020-10-22
JPWO2020213566A5 JPWO2020213566A5 (https=) 2022-06-09
JP7161251B2 true JP7161251B2 (ja) 2022-10-26

Family

ID=72837464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021514936A Active JP7161251B2 (ja) 2019-04-15 2020-04-13 搬送装置

Country Status (7)

Country Link
US (1) US12217996B2 (https=)
JP (1) JP7161251B2 (https=)
KR (1) KR20210144882A (https=)
CN (1) CN114026677A (https=)
SG (1) SG11202110943XA (https=)
TW (1) TWI747225B (https=)
WO (1) WO2020213566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022157830A1 (ja) * 2021-01-19 2022-07-28 株式会社新川 半導体装置の製造装置
US12519003B2 (en) * 2021-03-08 2026-01-06 Yamaha Robotics Co., Ltd. Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuck
JP7831931B2 (ja) * 2022-03-11 2026-03-17 東京エレクトロン株式会社 チップキャリアおよびチップ処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122750U (ja) 2006-04-13 2006-06-29 博 明石 昇降ストッパーを付設した非接触搬送装置
JP4766824B2 (ja) 2000-12-05 2011-09-07 日本空圧システム株式会社 保持具
JP2013179139A (ja) 2012-02-28 2013-09-09 Egcns Co Ltd Ｌｅｄウェハーピッカー

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1214033B (it) * 1987-02-03 1990-01-05 Carlomagno Giovanni Maria Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura
JP2524776B2 (ja) 1987-11-13 1996-08-14 株式会社日立製作所 板状物受け渡し装置
JPH06321351A (ja) 1993-05-14 1994-11-22 Hiroshi Akashi 無接触ピックアップ装置
JP5027399B2 (ja) * 2005-10-12 2012-09-19 日本特殊陶業株式会社 配線基板の搬送方法および搬送装置
GB0522552D0 (en) * 2005-11-04 2005-12-14 Univ Salford The Handling device
JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置
KR101261313B1 (ko) 2010-05-12 2013-05-07 주식회사 에이엠에이치시스템즈 평판 이송물 정렬픽업 이송장치
JP5452413B2 (ja) * 2010-08-13 2014-03-26 株式会社アイエスエンジニアリング 非接触吸着装置
JP5846734B2 (ja) * 2010-11-05 2016-01-20 株式会社ディスコ 搬送装置
JP5660316B2 (ja) 2011-03-07 2015-01-28 村田機械株式会社 基板移載装置
JP5830440B2 (ja) 2012-06-20 2015-12-09 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2014165470A (ja) 2013-02-28 2014-09-08 Nikon Corp 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法
WO2016052631A1 (ja) * 2014-09-30 2016-04-07 株式会社カネカ 試料保持装置、太陽電池の製造方法及び太陽電池モジュールの製造方法
JP6948860B2 (ja) * 2017-07-14 2021-10-13 株式会社荏原製作所 基板保持装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4766824B2 (ja) 2000-12-05 2011-09-07 日本空圧システム株式会社 保持具
JP3122750U (ja) 2006-04-13 2006-06-29 博 明石 昇降ストッパーを付設した非接触搬送装置
JP2013179139A (ja) 2012-02-28 2013-09-09 Egcns Co Ltd Ｌｅｄウェハーピッカー

Also Published As

Publication number Publication date
TWI747225B (zh) 2021-11-21
SG11202110943XA (en) 2021-10-28
WO2020213566A1 (ja) 2020-10-22
TW202040739A (zh) 2020-11-01
JPWO2020213566A1 (https=) 2020-10-22
CN114026677A (zh) 2022-02-08
KR20210144882A (ko) 2021-11-30
US12217996B2 (en) 2025-02-04
US20220216089A1 (en) 2022-07-07

Similar Documents

Publication Publication Date Title
JP7161251B2 (ja) 搬送装置
KR101741333B1 (ko) 칩 적층 장치
EP1653500B1 (en) Driving mechanism for chip detachment apparatus
US20090104014A1 (en) Carrier frame for electronic components and production method for electronic components
KR102330577B1 (ko) 전자 부품의 픽업 장치 및 실장 장치
KR102257254B1 (ko) 정전 척 플레이트의 급전 장치
US6354480B2 (en) Apparatus for positioning a thin plate
JP2014011416A (ja) 半導体チップのピックアップ装置およびピックアップ方法
US12211727B2 (en) Simultaneous bonding approach for high quality wafer stacking
KR20240082285A (ko) 실장 툴 및 실장 장치
US20180226281A1 (en) Pickup apparatus
KR20120064305A (ko) 다이싱된 반도체칩을 이송하기 위한 픽업 장치
JP2010062472A (ja) 半導体チップのピックアップ装置およびこれを用いた半導体チップのピックアップ方法
JP6563322B2 (ja) 搬送装置
JP2007208088A (ja) 半導体製造装置及び搬送キャリア
JP6500357B2 (ja) 吸着ヘッド、実装装置および吸着方法
JP5075769B2 (ja) 半導体チップのピックアップ装置およびこれを用いた半導体チップのピックアップ方法
KR20160006790A (ko) 반도체 칩의 픽업 장치
JP4316122B2 (ja) Ｉｃチップ規正装置
JPH08203962A (ja) チップ位置決め装置、チップステージおよびインナリードボンディング装置ならびに方法
JP3208580B2 (ja) ダイボンディング方法及び半導体装置の製造方法
JP2005150214A (ja) 半導体装置の製造方法およびそれに用いられる半導体製造装置
KR101165034B1 (ko) 픽업 헤드 및 이를 구비한 플립칩 본더
KR20180035363A (ko) 기판을 파지하기 위한 그리퍼 및 이를 포함하는 장치
JP7489929B2 (ja) チップ剥離方法、半導体装置の製造方法、チップ剥離装置

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A5211

Effective date: 20210913

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221004

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221006

R150 Certificate of patent or registration of utility model

Ref document number: 7161251

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250