SG11202110943XA - Conveying device - Google Patents
Conveying deviceInfo
- Publication number
- SG11202110943XA SG11202110943XA SG11202110943XA SG11202110943XA SG11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA SG 11202110943X A SG11202110943X A SG 11202110943XA
- Authority
- SG
- Singapore
- Prior art keywords
- conveying device
- conveying
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019076885 | 2019-04-15 | ||
| PCT/JP2020/016291 WO2020213566A1 (ja) | 2019-04-15 | 2020-04-13 | 搬送装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202110943XA true SG11202110943XA (en) | 2021-10-28 |
Family
ID=72837464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202110943XA SG11202110943XA (en) | 2019-04-15 | 2020-04-13 | Conveying device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12217996B2 (https=) |
| JP (1) | JP7161251B2 (https=) |
| KR (1) | KR20210144882A (https=) |
| CN (1) | CN114026677A (https=) |
| SG (1) | SG11202110943XA (https=) |
| TW (1) | TWI747225B (https=) |
| WO (1) | WO2020213566A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022157830A1 (ja) | 2021-01-19 | 2022-07-28 | 株式会社新川 | 半導体装置の製造装置 |
| WO2022190174A1 (ja) * | 2021-03-08 | 2022-09-15 | ヤマハロボティクスホールディングス株式会社 | 搬送装置 |
| JP7831931B2 (ja) * | 2022-03-11 | 2026-03-17 | 東京エレクトロン株式会社 | チップキャリアおよびチップ処理方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1214033B (it) * | 1987-02-03 | 1990-01-05 | Carlomagno Giovanni Maria | Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura |
| JP2524776B2 (ja) | 1987-11-13 | 1996-08-14 | 株式会社日立製作所 | 板状物受け渡し装置 |
| JPH06321351A (ja) * | 1993-05-14 | 1994-11-22 | Hiroshi Akashi | 無接触ピックアップ装置 |
| JP4766824B2 (ja) * | 2000-12-05 | 2011-09-07 | 日本空圧システム株式会社 | 保持具 |
| JP5027399B2 (ja) * | 2005-10-12 | 2012-09-19 | 日本特殊陶業株式会社 | 配線基板の搬送方法および搬送装置 |
| GB0522552D0 (en) * | 2005-11-04 | 2005-12-14 | Univ Salford The | Handling device |
| JP3122750U (ja) * | 2006-04-13 | 2006-06-29 | 博 明石 | 昇降ストッパーを付設した非接触搬送装置 |
| JP5403247B2 (ja) * | 2009-09-07 | 2014-01-29 | 村田機械株式会社 | 基板移載装置 |
| KR101261313B1 (ko) * | 2010-05-12 | 2013-05-07 | 주식회사 에이엠에이치시스템즈 | 평판 이송물 정렬픽업 이송장치 |
| JP5452413B2 (ja) * | 2010-08-13 | 2014-03-26 | 株式会社アイエスエンジニアリング | 非接触吸着装置 |
| JP5846734B2 (ja) * | 2010-11-05 | 2016-01-20 | 株式会社ディスコ | 搬送装置 |
| JP5660316B2 (ja) * | 2011-03-07 | 2015-01-28 | 村田機械株式会社 | 基板移載装置 |
| JP5417467B2 (ja) * | 2012-02-28 | 2014-02-12 | エルジー シーエヌエス カンパニー リミテッド | Ｌｅｄウェハーピッカー |
| JP5830440B2 (ja) | 2012-06-20 | 2015-12-09 | 東京エレクトロン株式会社 | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
| JP2014165470A (ja) | 2013-02-28 | 2014-09-08 | Nikon Corp | 搬送システム及び搬送方法、露光装置及び露光方法、並びにデバイス製造方法 |
| WO2016052631A1 (ja) * | 2014-09-30 | 2016-04-07 | 株式会社カネカ | 試料保持装置、太陽電池の製造方法及び太陽電池モジュールの製造方法 |
| JP6948860B2 (ja) * | 2017-07-14 | 2021-10-13 | 株式会社荏原製作所 | 基板保持装置 |
-
2020
- 2020-04-01 TW TW109111322A patent/TWI747225B/zh active
- 2020-04-13 KR KR1020217035723A patent/KR20210144882A/ko not_active Ceased
- 2020-04-13 WO PCT/JP2020/016291 patent/WO2020213566A1/ja not_active Ceased
- 2020-04-13 JP JP2021514936A patent/JP7161251B2/ja active Active
- 2020-04-13 US US17/603,934 patent/US12217996B2/en active Active
- 2020-04-13 CN CN202080027920.6A patent/CN114026677A/zh active Pending
- 2020-04-13 SG SG11202110943XA patent/SG11202110943XA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202040739A (zh) | 2020-11-01 |
| US12217996B2 (en) | 2025-02-04 |
| CN114026677A (zh) | 2022-02-08 |
| WO2020213566A1 (ja) | 2020-10-22 |
| US20220216089A1 (en) | 2022-07-07 |
| TWI747225B (zh) | 2021-11-21 |
| JP7161251B2 (ja) | 2022-10-26 |
| KR20210144882A (ko) | 2021-11-30 |
| JPWO2020213566A1 (https=) | 2020-10-22 |
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