TWI740453B - 毫米波天線用薄膜 - Google Patents

毫米波天線用薄膜 Download PDF

Info

Publication number
TWI740453B
TWI740453B TW109112465A TW109112465A TWI740453B TW I740453 B TWI740453 B TW I740453B TW 109112465 A TW109112465 A TW 109112465A TW 109112465 A TW109112465 A TW 109112465A TW I740453 B TWI740453 B TW I740453B
Authority
TW
Taiwan
Prior art keywords
film
porous
matrix material
polymer
material layer
Prior art date
Application number
TW109112465A
Other languages
English (en)
Chinese (zh)
Other versions
TW202029544A (zh
Inventor
中村將義
程野將行
伊藤孝彥
永岡樹
日紫喜智昭
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=61016640&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI740453(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202029544A publication Critical patent/TW202029544A/zh
Application granted granted Critical
Publication of TWI740453B publication Critical patent/TWI740453B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/34—Chemical features in the manufacture of articles consisting of a foamed macromolecular core and a macromolecular surface layer having a higher density than the core
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/26—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/02—Cellular or porous
    • B32B2305/026—Porous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2201/00—Foams characterised by the foaming process
    • C08J2201/04—Foams characterised by the foaming process characterised by the elimination of a liquid or solid component, e.g. precipitation, leaching out, evaporation
    • C08J2201/046—Elimination of a polymeric phase
    • C08J2201/0464—Elimination of a polymeric phase using water or inorganic fluids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/54—Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Details Of Aerials (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW109112465A 2016-07-25 2017-07-25 毫米波天線用薄膜 TWI740453B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-145541 2016-07-25
JP2016145541 2016-07-25
JP2017076009A JP6567591B2 (ja) 2016-07-25 2017-04-06 ミリ波アンテナ用フィルム
JP2017-076009 2017-04-06

Publications (2)

Publication Number Publication Date
TW202029544A TW202029544A (zh) 2020-08-01
TWI740453B true TWI740453B (zh) 2021-09-21

Family

ID=61016640

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106124864A TWI692890B (zh) 2016-07-25 2017-07-25 毫米波天線用薄膜
TW109112465A TWI740453B (zh) 2016-07-25 2017-07-25 毫米波天線用薄膜

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW106124864A TWI692890B (zh) 2016-07-25 2017-07-25 毫米波天線用薄膜

Country Status (7)

Country Link
US (1) US20190263995A1 (enExample)
EP (1) EP3489292B1 (enExample)
JP (3) JP6567591B2 (enExample)
KR (1) KR102302832B1 (enExample)
CN (1) CN109496223B (enExample)
TW (2) TWI692890B (enExample)
WO (1) WO2018020746A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6567722B2 (ja) * 2017-04-06 2019-08-28 日東電工株式会社 ミリ波アンテナ用フィルム
WO2019188837A1 (ja) * 2018-03-27 2019-10-03 三井金属鉱業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法
JP2020049905A (ja) * 2018-09-28 2020-04-02 日東電工株式会社 低誘電基板材
JP7082932B2 (ja) * 2018-09-28 2022-06-09 日東電工株式会社 低誘電基板材
JP7305328B2 (ja) * 2018-10-01 2023-07-10 日東電工株式会社 多孔質体の製造方法
JP7222727B2 (ja) * 2019-01-24 2023-02-15 日東電工株式会社 低誘電基板材およびその製造方法
CN114765917A (zh) * 2021-01-13 2022-07-19 华为技术有限公司 印刷电路板及其制作方法，以及一种电子通讯设备
JP7751974B2 (ja) 2021-02-15 2025-10-09 太陽ホールディングス株式会社 多孔質膜形成用ポリマー組成物、多孔質膜の製造方法、多孔質膜、フレキシブル金属張積層板及び電子基板
JP2022146684A (ja) * 2021-03-22 2022-10-05 株式会社カナック ポリイミド成形体の成形方法
JP7700483B2 (ja) * 2021-03-26 2025-07-01 富士フイルムビジネスイノベーション株式会社 ポリイミド前駆体含有水性組成物、ポリイミド膜の製造方法、及び多孔質ポリイミド膜の製造方法
JPWO2022211025A1 (enExample) * 2021-03-31 2022-10-06
JP2023110636A (ja) * 2022-01-28 2023-08-09 日東電工株式会社 低誘電基板材
WO2022224899A1 (ja) * 2021-04-19 2022-10-27 日東電工株式会社 低誘電基板材
JP2022165324A (ja) * 2021-04-19 2022-10-31 日東電工株式会社 金属層積層板用フィルム
JP2023091635A (ja) * 2021-12-20 2023-06-30 富士フイルムビジネスイノベーション株式会社 ポリイミド前駆体溶液、多孔質ポリイミドフィルム、及び絶縁電線
CN120187783A (zh) * 2022-11-22 2025-06-20 日东电工株式会社 多孔的低介电性聚合物膜

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006111708A (ja) * 2004-10-14 2006-04-27 Inoac Corp 低誘電率発泡材料とその製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0052936A1 (en) * 1980-11-07 1982-06-02 Exxon Research And Engineering Company Microcellular structures and process for their preparation
US5670102A (en) * 1993-02-11 1997-09-23 Minnesota Mining And Manufacturing Company Method of making thermoplastic foamed articles using supercritical fluid
JP3115215B2 (ja) 1995-10-05 2000-12-04 松下電器産業株式会社 低誘電率プラスチック絶縁フィルムおよびその製造方法
JP3687448B2 (ja) * 1999-11-29 2005-08-24 宇部興産株式会社 多孔質ポリイミドフィルムの製造法及びフィルム
JP4117986B2 (ja) * 1999-06-07 2008-07-16 日東電工株式会社 耐熱性ポリマ発泡体とその製造法、及び発泡体基板
JP4159199B2 (ja) 1999-09-16 2008-10-01 日東電工株式会社 多孔質体及び多孔質体の製造方法
JP4557409B2 (ja) 2000-11-13 2010-10-06 日東電工株式会社 多孔質ポリイミドの製造方法及び多孔質ポリイミド
US7658989B2 (en) * 2001-03-28 2010-02-09 North Carolina State University Nano-and micro-cellular foamed thin-walled material, and processes and apparatuses for making the same
JP4896309B2 (ja) * 2001-07-13 2012-03-14 日東電工株式会社 多孔質ポリイミド樹脂の製造方法
JP2003201362A (ja) * 2002-01-09 2003-07-18 Hitachi Ltd 多孔質ポリイミドフィルムおよび多孔質ポリイミド回路基板
JP2003201363A (ja) * 2002-01-09 2003-07-18 Hitachi Ltd 多孔質ポリイミドフィルムとその配線基板及びその製造法並びにその用途
JP4069725B2 (ja) * 2002-11-07 2008-04-02 東レ株式会社 多孔性芳香族ポリアミド系フィルムおよびその製造方法
EP1698460A4 (en) * 2003-12-24 2009-05-06 Teijin Ltd MULTILAYER BODY
JP5179640B2 (ja) * 2005-04-08 2013-04-10 日東電工株式会社 発泡部材
JP5117150B2 (ja) * 2007-09-21 2013-01-09 株式会社ダイセル 多孔質層を有する積層体及びその製造方法、並びに多孔質膜及びその製造方法
EP2354180B1 (en) * 2008-10-02 2016-05-25 Ube Industries, Ltd. Porous polyimide membrane and process for production of same
JP2012077294A (ja) * 2010-09-11 2012-04-19 Nitto Denko Corp 多孔質樹脂シート及びその製造方法
JP5734623B2 (ja) 2010-11-10 2015-06-17 ユニチカ株式会社 積層体の製造方法
JP2014231533A (ja) * 2011-02-03 2014-12-11 日東電工株式会社 多孔質樹脂成型体、多孔体基板およびその製造方法
JP5916498B2 (ja) * 2011-06-06 2016-05-11 日東電工株式会社 ポリイミド多孔質体及びその製造方法
JP6567590B2 (ja) * 2016-07-25 2019-08-28 日東電工株式会社 ミリ波アンテナ用フィルム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006111708A (ja) * 2004-10-14 2006-04-27 Inoac Corp 低誘電率発泡材料とその製造方法

Also Published As

Publication number Publication date
TW201810753A (zh) 2018-03-16
TW202029544A (zh) 2020-08-01
US20190263995A1 (en) 2019-08-29
TWI692890B (zh) 2020-05-01
EP3489292A1 (en) 2019-05-29
KR102302832B1 (ko) 2021-09-15
KR20190027887A (ko) 2019-03-15
JP6567591B2 (ja) 2019-08-28
CN109496223B (zh) 2022-05-24
WO2018020746A1 (ja) 2018-02-01
CN109496223A (zh) 2019-03-19
JP2021152165A (ja) 2021-09-30
EP3489292A4 (en) 2020-03-04
JP2019199615A (ja) 2019-11-21
JP2018021172A (ja) 2018-02-08
EP3489292B1 (en) 2021-12-08
JP7179912B2 (ja) 2022-11-29

Similar Documents

Publication Publication Date Title
TWI740453B (zh) 毫米波天線用薄膜
TWI666244B (zh) 毫米波天線用薄膜
JP6567722B2 (ja) ミリ波アンテナ用フィルム
CN103597016B (zh) 聚酰亚胺多孔体及其制造方法
US20040101626A1 (en) Process for producing porous polyimide resin and porous polymide resin