TWI729200B - 切割裝置 - Google Patents

切割裝置 Download PDF

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Publication number
TWI729200B
TWI729200B TW106130120A TW106130120A TWI729200B TW I729200 B TWI729200 B TW I729200B TW 106130120 A TW106130120 A TW 106130120A TW 106130120 A TW106130120 A TW 106130120A TW I729200 B TWI729200 B TW I729200B
Authority
TW
Taiwan
Prior art keywords
trimming
board
unit
cutting
type
Prior art date
Application number
TW106130120A
Other languages
English (en)
Chinese (zh)
Other versions
TW201813776A (zh
Inventor
田中誠
粕谷健太
山村英司
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201813776A publication Critical patent/TW201813776A/zh
Application granted granted Critical
Publication of TWI729200B publication Critical patent/TWI729200B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/02—Means for holding or positioning work with clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
TW106130120A 2016-10-03 2017-09-04 切割裝置 TWI729200B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016195896A JP6732381B2 (ja) 2016-10-03 2016-10-03 切削装置
JP2016-195896 2016-10-03

Publications (2)

Publication Number Publication Date
TW201813776A TW201813776A (zh) 2018-04-16
TWI729200B true TWI729200B (zh) 2021-06-01

Family

ID=61803480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106130120A TWI729200B (zh) 2016-10-03 2017-09-04 切割裝置

Country Status (4)

Country Link
JP (1) JP6732381B2 (ko)
KR (1) KR102186215B1 (ko)
CN (1) CN107891369B (ko)
TW (1) TWI729200B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7033485B2 (ja) * 2018-04-17 2022-03-10 株式会社ディスコ 切削ブレードの整形方法
JP7187119B2 (ja) * 2019-04-02 2022-12-12 株式会社ディスコ 研削装置及びドレッシングボードの品種の判別方法
JP7446667B2 (ja) * 2019-07-26 2024-03-11 株式会社ディスコ 切削ブレード、切削ブレードの装着方法、及び被加工物の加工方法
JP7486265B2 (ja) * 2020-01-09 2024-05-17 株式会社ディスコ 被加工物の加工方法
JP7394712B2 (ja) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN113715103B (zh) * 2021-11-02 2022-02-15 江苏金彩高分子材料科技有限公司 Pet防雾板材的输送设备及生产工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW440496B (en) * 1999-05-28 2001-06-16 3M Innovative Properties Co Abrasive processing apparatus and method employing encoded abrasive product
WO2003008151A1 (en) * 2001-07-20 2003-01-30 3M Innovative Properties Company Fixed abrasive articles with wear indicators
TW200405842A (en) * 2002-04-03 2004-04-16 3M Innovative Properties Co Abrasive articles and methods for the manufacture and use of same
TW201006609A (en) * 2008-06-09 2010-02-16 Applied Materials Inc CMP pad identification and layer ratio modeling
TW201330974A (zh) * 2012-01-20 2013-08-01 Hotwu Technology Co Ltd 一種改良之資料管理以進行生產的方法
JP2014024151A (ja) * 2012-07-26 2014-02-06 Disco Abrasive Syst Ltd 加工装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000221138A (ja) * 1999-02-01 2000-08-11 Nikon Corp 基板検査装置および基板検査方法
JP2006218571A (ja) * 2005-02-10 2006-08-24 Disco Abrasive Syst Ltd ドレッシングボードおよびドレッシング方法
CN100361783C (zh) * 2005-04-07 2008-01-16 上海第三机床厂 数字化曲线磨床
JP2010108047A (ja) * 2008-10-28 2010-05-13 Hitachi Chem Co Ltd 生産管理システム
JP5571331B2 (ja) * 2009-07-07 2014-08-13 株式会社ディスコ 切削装置
JP2012066328A (ja) * 2010-09-22 2012-04-05 Disco Corp ドレッシングボードおよびドレッシングボード収容ケース
JP5919002B2 (ja) * 2012-01-20 2016-05-18 株式会社ディスコ 切削装置
JP5905111B2 (ja) * 2012-09-28 2016-04-20 富士機械製造株式会社 部品供給装置
JP2014217935A (ja) * 2013-05-10 2014-11-20 株式会社ディスコ ドレッシング工具
JP6250329B2 (ja) * 2013-08-19 2017-12-20 株式会社ディスコ 加工装置
JP6341695B2 (ja) * 2014-03-03 2018-06-13 株式会社ディスコ サブチャックテーブルの原点位置検出方法
JP6294748B2 (ja) * 2014-04-23 2018-03-14 株式会社ディスコ 切削装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW440496B (en) * 1999-05-28 2001-06-16 3M Innovative Properties Co Abrasive processing apparatus and method employing encoded abrasive product
WO2003008151A1 (en) * 2001-07-20 2003-01-30 3M Innovative Properties Company Fixed abrasive articles with wear indicators
TW200405842A (en) * 2002-04-03 2004-04-16 3M Innovative Properties Co Abrasive articles and methods for the manufacture and use of same
TW201006609A (en) * 2008-06-09 2010-02-16 Applied Materials Inc CMP pad identification and layer ratio modeling
TW201330974A (zh) * 2012-01-20 2013-08-01 Hotwu Technology Co Ltd 一種改良之資料管理以進行生產的方法
JP2014024151A (ja) * 2012-07-26 2014-02-06 Disco Abrasive Syst Ltd 加工装置

Also Published As

Publication number Publication date
JP6732381B2 (ja) 2020-07-29
CN107891369A (zh) 2018-04-10
KR102186215B1 (ko) 2020-12-03
CN107891369B (zh) 2021-05-25
JP2018060864A (ja) 2018-04-12
TW201813776A (zh) 2018-04-16
KR20180037116A (ko) 2018-04-11

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