JP6732381B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP6732381B2
JP6732381B2 JP2016195896A JP2016195896A JP6732381B2 JP 6732381 B2 JP6732381 B2 JP 6732381B2 JP 2016195896 A JP2016195896 A JP 2016195896A JP 2016195896 A JP2016195896 A JP 2016195896A JP 6732381 B2 JP6732381 B2 JP 6732381B2
Authority
JP
Japan
Prior art keywords
dressing board
unit
dressing
chuck table
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016195896A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018060864A (ja
Inventor
田中　誠
田中　　誠
健太 粕谷
健太 粕谷
英司 山村
英司 山村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2016195896A priority Critical patent/JP6732381B2/ja
Priority to TW106130120A priority patent/TWI729200B/zh
Priority to CN201710882110.9A priority patent/CN107891369B/zh
Priority to KR1020170125035A priority patent/KR102186215B1/ko
Publication of JP2018060864A publication Critical patent/JP2018060864A/ja
Application granted granted Critical
Publication of JP6732381B2 publication Critical patent/JP6732381B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/02—Means for holding or positioning work with clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP2016195896A 2016-10-03 2016-10-03 切削装置 Active JP6732381B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016195896A JP6732381B2 (ja) 2016-10-03 2016-10-03 切削装置
TW106130120A TWI729200B (zh) 2016-10-03 2017-09-04 切割裝置
CN201710882110.9A CN107891369B (zh) 2016-10-03 2017-09-26 切削装置
KR1020170125035A KR102186215B1 (ko) 2016-10-03 2017-09-27 절삭 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016195896A JP6732381B2 (ja) 2016-10-03 2016-10-03 切削装置

Publications (2)

Publication Number Publication Date
JP2018060864A JP2018060864A (ja) 2018-04-12
JP6732381B2 true JP6732381B2 (ja) 2020-07-29

Family

ID=61803480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016195896A Active JP6732381B2 (ja) 2016-10-03 2016-10-03 切削装置

Country Status (4)

Country Link
JP (1) JP6732381B2 (ko)
KR (1) KR102186215B1 (ko)
CN (1) CN107891369B (ko)
TW (1) TWI729200B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7033485B2 (ja) * 2018-04-17 2022-03-10 株式会社ディスコ 切削ブレードの整形方法
JP7187119B2 (ja) * 2019-04-02 2022-12-12 株式会社ディスコ 研削装置及びドレッシングボードの品種の判別方法
JP7446667B2 (ja) * 2019-07-26 2024-03-11 株式会社ディスコ 切削ブレード、切削ブレードの装着方法、及び被加工物の加工方法
JP7486265B2 (ja) * 2020-01-09 2024-05-17 株式会社ディスコ 被加工物の加工方法
JP7394712B2 (ja) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN113715103B (zh) * 2021-11-02 2022-02-15 江苏金彩高分子材料科技有限公司 Pet防雾板材的输送设备及生产工艺

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000221138A (ja) * 1999-02-01 2000-08-11 Nikon Corp 基板検査装置および基板検査方法
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
US6264533B1 (en) * 1999-05-28 2001-07-24 3M Innovative Properties Company Abrasive processing apparatus and method employing encoded abrasive product
US7160173B2 (en) * 2002-04-03 2007-01-09 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
JP2006218571A (ja) * 2005-02-10 2006-08-24 Disco Abrasive Syst Ltd ドレッシングボードおよびドレッシング方法
CN100361783C (zh) * 2005-04-07 2008-01-16 上海第三机床厂 数字化曲线磨床
TW201006609A (en) * 2008-06-09 2010-02-16 Applied Materials Inc CMP pad identification and layer ratio modeling
JP2010108047A (ja) * 2008-10-28 2010-05-13 Hitachi Chem Co Ltd 生産管理システム
JP5571331B2 (ja) * 2009-07-07 2014-08-13 株式会社ディスコ 切削装置
JP2012066328A (ja) * 2010-09-22 2012-04-05 Disco Corp ドレッシングボードおよびドレッシングボード収容ケース
JP5919002B2 (ja) * 2012-01-20 2016-05-18 株式会社ディスコ 切削装置
TW201330974A (zh) * 2012-01-20 2013-08-01 Hotwu Technology Co Ltd 一種改良之資料管理以進行生產的方法
JP5991874B2 (ja) * 2012-07-26 2016-09-14 株式会社ディスコ 加工装置
JP5905111B2 (ja) * 2012-09-28 2016-04-20 富士機械製造株式会社 部品供給装置
JP2014217935A (ja) * 2013-05-10 2014-11-20 株式会社ディスコ ドレッシング工具
JP6250329B2 (ja) * 2013-08-19 2017-12-20 株式会社ディスコ 加工装置
JP6341695B2 (ja) * 2014-03-03 2018-06-13 株式会社ディスコ サブチャックテーブルの原点位置検出方法
JP6294748B2 (ja) * 2014-04-23 2018-03-14 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
CN107891369A (zh) 2018-04-10
TWI729200B (zh) 2021-06-01
KR102186215B1 (ko) 2020-12-03
CN107891369B (zh) 2021-05-25
JP2018060864A (ja) 2018-04-12
TW201813776A (zh) 2018-04-16
KR20180037116A (ko) 2018-04-11

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