TWI711129B - 引線框架、引線框架的製造方法和半導體裝置的製造方法 - Google Patents
引線框架、引線框架的製造方法和半導體裝置的製造方法 Download PDFInfo
- Publication number
- TWI711129B TWI711129B TW107118517A TW107118517A TWI711129B TW I711129 B TWI711129 B TW I711129B TW 107118517 A TW107118517 A TW 107118517A TW 107118517 A TW107118517 A TW 107118517A TW I711129 B TWI711129 B TW I711129B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- manufacturing
- surface roughness
- front surface
- back surface
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017110200A JP6850202B2 (ja) | 2017-06-02 | 2017-06-02 | リードフレーム、リードフレームの製造方法および半導体装置の製造方法 |
JP2017-110200 | 2017-06-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201911493A TW201911493A (zh) | 2019-03-16 |
TWI711129B true TWI711129B (zh) | 2020-11-21 |
Family
ID=64456131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107118517A TWI711129B (zh) | 2017-06-02 | 2018-05-30 | 引線框架、引線框架的製造方法和半導體裝置的製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6850202B2 (ko) |
KR (1) | KR102346708B1 (ko) |
CN (1) | CN110622304B (ko) |
TW (1) | TWI711129B (ko) |
WO (1) | WO2018221340A1 (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013105849A (ja) * | 2011-11-11 | 2013-05-30 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
US20170110389A1 (en) * | 2015-10-16 | 2017-04-20 | Shinko Electric Industries Co., Ltd. | Lead frame and semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03295262A (ja) * | 1990-04-13 | 1991-12-26 | Mitsubishi Electric Corp | リードフレームおよびその製造方法 |
JP2004158513A (ja) * | 2002-11-01 | 2004-06-03 | Mitsui High Tec Inc | リードフレーム及びその製造方法 |
JP2006093559A (ja) * | 2004-09-27 | 2006-04-06 | Sumitomo Metal Mining Package Materials Co Ltd | リードフレームおよびその製造方法 |
JP4698708B2 (ja) * | 2008-08-19 | 2011-06-08 | 新光電気工業株式会社 | パッケージ部品及び半導体パッケージ |
JP2013225595A (ja) * | 2012-04-20 | 2013-10-31 | Shinko Electric Ind Co Ltd | リードフレーム及び半導体パッケージ並びにそれらの製造方法 |
JP2014007363A (ja) * | 2012-06-27 | 2014-01-16 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
-
2017
- 2017-06-02 JP JP2017110200A patent/JP6850202B2/ja active Active
-
2018
- 2018-05-23 CN CN201880032553.1A patent/CN110622304B/zh active Active
- 2018-05-23 WO PCT/JP2018/019792 patent/WO2018221340A1/ja active Application Filing
- 2018-05-23 KR KR1020197035872A patent/KR102346708B1/ko active IP Right Grant
- 2018-05-30 TW TW107118517A patent/TWI711129B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013105849A (ja) * | 2011-11-11 | 2013-05-30 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
US20170110389A1 (en) * | 2015-10-16 | 2017-04-20 | Shinko Electric Industries Co., Ltd. | Lead frame and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN110622304B (zh) | 2023-07-14 |
TW201911493A (zh) | 2019-03-16 |
KR20200003884A (ko) | 2020-01-10 |
CN110622304A (zh) | 2019-12-27 |
KR102346708B1 (ko) | 2021-12-31 |
WO2018221340A1 (ja) | 2018-12-06 |
JP2018206920A (ja) | 2018-12-27 |
JP6850202B2 (ja) | 2021-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011077519A (ja) | リードフレーム及びその製造方法 | |
KR20110081813A (ko) | 리드 프레임 기판과 그 제조 방법 및 반도체 장치 | |
JP4984253B2 (ja) | 半導体装置の製造方法および半導体装置用基板の製造方法 | |
TW201715678A (zh) | 引線框及其製造方法 | |
TW201021186A (en) | Lead frame board, method of forming the same, and semiconductor device | |
JP2019169729A (ja) | 半導体装置用基板および半導体装置 | |
TWI651825B (zh) | 導線架、導線架封裝體、及其等之製造方法 | |
JP6492930B2 (ja) | 半導体装置用リードフレームおよびその製造方法 | |
JP2003309241A (ja) | リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法 | |
TWI711129B (zh) | 引線框架、引線框架的製造方法和半導體裝置的製造方法 | |
JP2014078658A (ja) | 半導体パッケージ用基板、及びその製造方法 | |
JP2012049323A (ja) | リードフレーム及びこれを用いた半導体装置並びにその製造方法 | |
US9698027B2 (en) | Method of fabricating integrated circuits having a recessed molding package and corresponding package | |
JP7119574B2 (ja) | リードフレーム及びその製造方法 | |
JP2007180247A (ja) | 回路部材の製造方法 | |
JP4249885B2 (ja) | プリント回路板の製造方法 | |
JP3565149B2 (ja) | リードフレーム | |
JP3916364B2 (ja) | 金属ベース配線板の製造方法 | |
JP2018081961A (ja) | 半導体装置用リードフレームとその製造方法および樹脂封止型半導体装置 | |
JP2012164936A (ja) | 半導体装置の製造方法 | |
JP2017130522A (ja) | 樹脂付リードフレーム基板 | |
JP2018056309A (ja) | 半導体装置 | |
JP5807815B2 (ja) | 半導体装置およびその製造方法、ならびに半導体装置用基板およびその製造方法 | |
JP2013084970A (ja) | 半導体装置およびその製造方法、ならびに半導体装置用基板およびその製造方法 | |
JP5403435B2 (ja) | 半導体装置およびその製造方法、ならびに半導体装置用基板およびその製造方法 |