TWI711129B - 引線框架、引線框架的製造方法和半導體裝置的製造方法 - Google Patents

引線框架、引線框架的製造方法和半導體裝置的製造方法 Download PDF

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Publication number
TWI711129B
TWI711129B TW107118517A TW107118517A TWI711129B TW I711129 B TWI711129 B TW I711129B TW 107118517 A TW107118517 A TW 107118517A TW 107118517 A TW107118517 A TW 107118517A TW I711129 B TWI711129 B TW I711129B
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TW
Taiwan
Prior art keywords
lead frame
manufacturing
surface roughness
front surface
back surface
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TW107118517A
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English (en)
Chinese (zh)
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TW201911493A (zh
Inventor
石橋貴弘
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日商三井高科技股份有限公司
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Publication of TW201911493A publication Critical patent/TW201911493A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW107118517A 2017-06-02 2018-05-30 引線框架、引線框架的製造方法和半導體裝置的製造方法 TWI711129B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017110200A JP6850202B2 (ja) 2017-06-02 2017-06-02 リードフレーム、リードフレームの製造方法および半導体装置の製造方法
JP2017-110200 2017-06-02

Publications (2)

Publication Number Publication Date
TW201911493A TW201911493A (zh) 2019-03-16
TWI711129B true TWI711129B (zh) 2020-11-21

Family

ID=64456131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107118517A TWI711129B (zh) 2017-06-02 2018-05-30 引線框架、引線框架的製造方法和半導體裝置的製造方法

Country Status (5)

Country Link
JP (1) JP6850202B2 (ko)
KR (1) KR102346708B1 (ko)
CN (1) CN110622304B (ko)
TW (1) TWI711129B (ko)
WO (1) WO2018221340A1 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013105849A (ja) * 2011-11-11 2013-05-30 Shindengen Electric Mfg Co Ltd 半導体装置
US20170110389A1 (en) * 2015-10-16 2017-04-20 Shinko Electric Industries Co., Ltd. Lead frame and semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03295262A (ja) * 1990-04-13 1991-12-26 Mitsubishi Electric Corp リードフレームおよびその製造方法
JP2004158513A (ja) * 2002-11-01 2004-06-03 Mitsui High Tec Inc リードフレーム及びその製造方法
JP2006093559A (ja) * 2004-09-27 2006-04-06 Sumitomo Metal Mining Package Materials Co Ltd リードフレームおよびその製造方法
JP4698708B2 (ja) * 2008-08-19 2011-06-08 新光電気工業株式会社 パッケージ部品及び半導体パッケージ
JP2013225595A (ja) * 2012-04-20 2013-10-31 Shinko Electric Ind Co Ltd リードフレーム及び半導体パッケージ並びにそれらの製造方法
JP2014007363A (ja) * 2012-06-27 2014-01-16 Renesas Electronics Corp 半導体装置の製造方法および半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013105849A (ja) * 2011-11-11 2013-05-30 Shindengen Electric Mfg Co Ltd 半導体装置
US20170110389A1 (en) * 2015-10-16 2017-04-20 Shinko Electric Industries Co., Ltd. Lead frame and semiconductor device

Also Published As

Publication number Publication date
CN110622304B (zh) 2023-07-14
TW201911493A (zh) 2019-03-16
KR20200003884A (ko) 2020-01-10
CN110622304A (zh) 2019-12-27
KR102346708B1 (ko) 2021-12-31
WO2018221340A1 (ja) 2018-12-06
JP2018206920A (ja) 2018-12-27
JP6850202B2 (ja) 2021-03-31

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