TWI706495B - 基板處理裝置 - Google Patents
基板處理裝置 Download PDFInfo
- Publication number
- TWI706495B TWI706495B TW108116486A TW108116486A TWI706495B TW I706495 B TWI706495 B TW I706495B TW 108116486 A TW108116486 A TW 108116486A TW 108116486 A TW108116486 A TW 108116486A TW I706495 B TWI706495 B TW I706495B
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- Prior art keywords
- gas
- wafer
- substrate
- ejection port
- temperature
- Prior art date
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0422—Apparatus for fluid treatment for etching for wet etching
- H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/66—Wet etching of conductive or resistive materials
- H10P50/663—Wet etching of conductive or resistive materials by chemical means only
- H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
- H10P70/54—Cleaning of wafer edges
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-289320 | 2011-12-28 | ||
| JP2011289320 | 2011-12-28 | ||
| JP2012243723A JP5996381B2 (ja) | 2011-12-28 | 2012-11-05 | 基板処理装置および基板処理方法 |
| JP2012-243723 | 2012-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201931501A TW201931501A (zh) | 2019-08-01 |
| TWI706495B true TWI706495B (zh) | 2020-10-01 |
Family
ID=48695145
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108116486A TWI706495B (zh) | 2011-12-28 | 2012-11-20 | 基板處理裝置 |
| TW106105398A TWI689026B (zh) | 2011-12-28 | 2012-11-20 | 基板處理裝置 |
| TW101143316A TWI578424B (zh) | 2011-12-28 | 2012-11-20 | 基板處理裝置與基板處理方法 |
| TW106105399A TWI643284B (zh) | 2011-12-28 | 2012-11-20 | 基板處理裝置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106105398A TWI689026B (zh) | 2011-12-28 | 2012-11-20 | 基板處理裝置 |
| TW101143316A TWI578424B (zh) | 2011-12-28 | 2012-11-20 | 基板處理裝置與基板處理方法 |
| TW106105399A TWI643284B (zh) | 2011-12-28 | 2012-11-20 | 基板處理裝置 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US8828183B2 (https=) |
| JP (1) | JP5996381B2 (https=) |
| KR (3) | KR101789111B1 (https=) |
| TW (4) | TWI706495B (https=) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5996381B2 (ja) * | 2011-12-28 | 2016-09-21 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP5996329B2 (ja) * | 2012-08-20 | 2016-09-21 | 株式会社Screenホールディングス | 基板処理装置、および基板処理方法 |
| TWI576938B (zh) | 2012-08-17 | 2017-04-01 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
| JP6100487B2 (ja) * | 2012-08-20 | 2017-03-22 | 株式会社Screenホールディングス | 基板処理装置 |
| JP6148475B2 (ja) | 2013-01-25 | 2017-06-14 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
| US9048089B2 (en) * | 2013-02-08 | 2015-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus to improve internal wafer temperature profile |
| KR102091291B1 (ko) * | 2013-02-14 | 2020-03-19 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
| TW201443272A (zh) * | 2013-02-20 | 2014-11-16 | 應用材料股份有限公司 | 基板的壓差吸附之裝置與方法 |
| US20140273498A1 (en) * | 2013-03-15 | 2014-09-18 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
| US10062586B2 (en) * | 2013-07-26 | 2018-08-28 | Tokyo Electron Limited | Chemical fluid processing apparatus and chemical fluid processing method |
| JP6137986B2 (ja) * | 2013-08-07 | 2017-05-31 | 株式会社荏原製作所 | 基板洗浄及び乾燥装置 |
| TWI569349B (zh) * | 2013-09-27 | 2017-02-01 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
| JP6240450B2 (ja) * | 2013-09-27 | 2017-11-29 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| KR101673061B1 (ko) | 2013-12-03 | 2016-11-04 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
| JP6190278B2 (ja) * | 2014-01-08 | 2017-08-30 | 東京エレクトロン株式会社 | 熱交換システム及び同熱交換システムを有する基板処理装置 |
| JP6330998B2 (ja) * | 2014-02-17 | 2018-05-30 | 株式会社Screenホールディングス | 基板処理装置 |
| WO2015165639A1 (en) * | 2014-04-30 | 2015-11-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP6195803B2 (ja) * | 2014-05-02 | 2017-09-13 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| JP6329428B2 (ja) * | 2014-05-09 | 2018-05-23 | 東京エレクトロン株式会社 | 基板処理装置、基板処理装置の付着物除去方法、及び記憶媒体 |
| JP6318869B2 (ja) * | 2014-05-30 | 2018-05-09 | 東京エレクトロン株式会社 | 成膜装置 |
| US9659794B2 (en) * | 2014-08-08 | 2017-05-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Particle improvement for single wafer apparatus |
| EP3183091B8 (en) * | 2014-08-19 | 2018-09-05 | Lumileds Holding B.V. | Sapphire collector for reducing mechanical damage during die level laser lift-off |
| US9280998B1 (en) | 2015-03-30 | 2016-03-08 | WD Media, LLC | Acidic post-sputter wash for magnetic recording media |
| KR102572643B1 (ko) * | 2015-05-13 | 2023-08-31 | 루미리즈 홀딩 비.브이. | 다이 레벨의 레이저 리프트-오프 중에 기계적 손상을 줄이기 위한 사파이어 수집기 |
| TWI622091B (zh) * | 2015-06-18 | 2018-04-21 | 思可林集團股份有限公司 | 基板處理裝置 |
| JP6453168B2 (ja) * | 2015-06-18 | 2019-01-16 | 株式会社Screenホールディングス | 基板処理装置 |
| JP6489524B2 (ja) * | 2015-08-18 | 2019-03-27 | 株式会社Screenホールディングス | 基板処理装置 |
| JP6845696B2 (ja) * | 2016-02-25 | 2021-03-24 | 芝浦メカトロニクス株式会社 | 基板処理装置、基板処理方法及び基板の製造方法 |
| JP6653608B2 (ja) | 2016-03-29 | 2020-02-26 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| CN106158709B (zh) * | 2016-07-22 | 2018-09-11 | 江苏鲁汶仪器有限公司 | 一种晶圆切割装置和方法 |
| JP6982433B2 (ja) * | 2017-08-24 | 2021-12-17 | 株式会社Screenホールディングス | 基板処理装置 |
| JP6842391B2 (ja) * | 2017-09-07 | 2021-03-17 | キオクシア株式会社 | 半導体製造装置および半導体装置の製造方法 |
| JP6986397B2 (ja) | 2017-09-14 | 2021-12-22 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| TWI650828B (zh) * | 2018-01-10 | 2019-02-11 | 弘塑科技股份有限公司 | 基板處理裝置 |
| JP2018093238A (ja) * | 2018-03-08 | 2018-06-14 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の制御方法 |
| JP6538233B2 (ja) * | 2018-04-09 | 2019-07-03 | 東京エレクトロン株式会社 | 基板液処理装置 |
| US11776822B2 (en) * | 2018-05-29 | 2023-10-03 | Applied Materials, Inc. | Wet cleaning of electrostatic chuck |
| JP7166089B2 (ja) * | 2018-06-29 | 2022-11-07 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システムおよび基板処理方法 |
| JP7112902B2 (ja) * | 2018-07-10 | 2022-08-04 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記憶媒体 |
| JP7213648B2 (ja) * | 2018-09-27 | 2023-01-27 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7138539B2 (ja) * | 2018-10-18 | 2022-09-16 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP7187268B2 (ja) * | 2018-11-02 | 2022-12-12 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
| JP7242392B2 (ja) * | 2019-04-16 | 2023-03-20 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7353079B2 (ja) * | 2019-07-04 | 2023-09-29 | 株式会社Screenホールディングス | 基板処理装置 |
| JP7341825B2 (ja) * | 2019-09-27 | 2023-09-11 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| US12068159B2 (en) * | 2021-03-31 | 2024-08-20 | Applied Materials, Inc. | Methods and apparatus for mask patterning debris removal |
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| JP7778016B2 (ja) * | 2022-03-23 | 2025-12-01 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP7542158B2 (ja) * | 2022-04-26 | 2024-08-29 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP7839713B2 (ja) * | 2022-09-21 | 2026-04-02 | 株式会社Screenホールディングス | 基板処理装置 |
| US12482665B2 (en) | 2023-02-03 | 2025-11-25 | Nanya Technology Corporation | Method of manufacturing semiconductor structure |
| US12482664B2 (en) * | 2023-02-03 | 2025-11-25 | Nanya Technology Corporation | Method of manufacturing semiconductor structure |
| JP2024157629A (ja) * | 2023-04-26 | 2024-11-08 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040020520A1 (en) * | 2002-07-30 | 2004-02-05 | Dong-Hyun Kim | Apparatus for cleaning a wafer |
| US20060021636A1 (en) * | 2004-07-30 | 2006-02-02 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for and method of processing a substrate with processing liquid |
| US20080142054A1 (en) * | 2006-12-18 | 2008-06-19 | Atsuro Eitoku | Substrate processing method and substrate processing apparatus |
| US20110030737A1 (en) * | 2009-08-07 | 2011-02-10 | Tokyo Electron Limited | Liquid processing apparatus for substrate and liquid processing method |
| US20110048468A1 (en) * | 2008-06-05 | 2011-03-03 | Tokyo Electron Limited | Liquid processing apparatus and liquid processing method |
| US20110308554A1 (en) * | 2010-06-18 | 2011-12-22 | Hiromitsu Namba | Liquid Processing Apparatus, Liquid Processing Method, and Storage Medium Having Computer Program Recorded Therein |
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| JPH06124887A (ja) * | 1991-09-27 | 1994-05-06 | Sony Corp | 半導体装置の製造方法及びこれに使用できる基板洗浄装置 |
| JP4018958B2 (ja) * | 2001-10-30 | 2007-12-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP3958594B2 (ja) * | 2002-01-30 | 2007-08-15 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
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| JP2004247746A (ja) * | 2004-03-22 | 2004-09-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP4601452B2 (ja) * | 2005-02-22 | 2010-12-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5143498B2 (ja) * | 2006-10-06 | 2013-02-13 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、プログラムならびに記録媒体 |
| JP5153296B2 (ja) * | 2007-10-31 | 2013-02-27 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP5136103B2 (ja) * | 2008-02-12 | 2013-02-06 | 東京エレクトロン株式会社 | 洗浄装置及びその方法、塗布、現像装置及びその方法、並びに記憶媒体 |
| JP5544985B2 (ja) * | 2009-06-23 | 2014-07-09 | 東京エレクトロン株式会社 | 液処理装置 |
| KR20110001273A (ko) * | 2009-06-30 | 2011-01-06 | 세메스 주식회사 | 기판 처리 방법 및 장치 |
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| JP5996381B2 (ja) * | 2011-12-28 | 2016-09-21 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP6195803B2 (ja) * | 2014-05-02 | 2017-09-13 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
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2012
- 2012-11-05 JP JP2012243723A patent/JP5996381B2/ja active Active
- 2012-11-20 TW TW108116486A patent/TWI706495B/zh active
- 2012-11-20 TW TW106105398A patent/TWI689026B/zh active
- 2012-11-20 TW TW101143316A patent/TWI578424B/zh active
- 2012-11-20 TW TW106105399A patent/TWI643284B/zh active
- 2012-12-26 KR KR1020120152923A patent/KR101789111B1/ko active Active
- 2012-12-27 US US13/727,671 patent/US8828183B2/en active Active
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2014
- 2014-07-30 US US14/447,029 patent/US9859136B2/en active Active
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2017
- 2017-10-16 KR KR1020170134117A patent/KR102009083B1/ko active Active
- 2017-11-28 US US15/823,691 patent/US10707102B2/en active Active
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2019
- 2019-08-01 KR KR1020190093925A patent/KR102142220B1/ko active Active
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2020
- 2020-06-02 US US16/890,332 patent/US11437252B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040020520A1 (en) * | 2002-07-30 | 2004-02-05 | Dong-Hyun Kim | Apparatus for cleaning a wafer |
| US20060021636A1 (en) * | 2004-07-30 | 2006-02-02 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for and method of processing a substrate with processing liquid |
| US20080142054A1 (en) * | 2006-12-18 | 2008-06-19 | Atsuro Eitoku | Substrate processing method and substrate processing apparatus |
| US20110048468A1 (en) * | 2008-06-05 | 2011-03-03 | Tokyo Electron Limited | Liquid processing apparatus and liquid processing method |
| US20110030737A1 (en) * | 2009-08-07 | 2011-02-10 | Tokyo Electron Limited | Liquid processing apparatus for substrate and liquid processing method |
| US20110308554A1 (en) * | 2010-06-18 | 2011-12-22 | Hiromitsu Namba | Liquid Processing Apparatus, Liquid Processing Method, and Storage Medium Having Computer Program Recorded Therein |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130076735A (ko) | 2013-07-08 |
| KR102009083B1 (ko) | 2019-08-08 |
| JP2013153135A (ja) | 2013-08-08 |
| US9859136B2 (en) | 2018-01-02 |
| US10707102B2 (en) | 2020-07-07 |
| TWI643284B (zh) | 2018-12-01 |
| TW201717303A (zh) | 2017-05-16 |
| TWI578424B (zh) | 2017-04-11 |
| KR102142220B1 (ko) | 2020-08-06 |
| US8828183B2 (en) | 2014-09-09 |
| KR101789111B1 (ko) | 2017-10-23 |
| US11437252B2 (en) | 2022-09-06 |
| TW201931501A (zh) | 2019-08-01 |
| KR20170120057A (ko) | 2017-10-30 |
| TW201338075A (zh) | 2013-09-16 |
| US20130171831A1 (en) | 2013-07-04 |
| TWI689026B (zh) | 2020-03-21 |
| JP5996381B2 (ja) | 2016-09-21 |
| US20140374022A1 (en) | 2014-12-25 |
| US20200328095A1 (en) | 2020-10-15 |
| TW201717304A (zh) | 2017-05-16 |
| KR20190094324A (ko) | 2019-08-13 |
| US20180108544A1 (en) | 2018-04-19 |
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