TWI691018B - 切削裝置 - Google Patents

切削裝置 Download PDF

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Publication number
TWI691018B
TWI691018B TW105132911A TW105132911A TWI691018B TW I691018 B TWI691018 B TW I691018B TW 105132911 A TW105132911 A TW 105132911A TW 105132911 A TW105132911 A TW 105132911A TW I691018 B TWI691018 B TW I691018B
Authority
TW
Taiwan
Prior art keywords
cutting
unit
chuck
bed
workpiece
Prior art date
Application number
TW105132911A
Other languages
English (en)
Chinese (zh)
Other versions
TW201727820A (zh
Inventor
花島聡
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201727820A publication Critical patent/TW201727820A/zh
Application granted granted Critical
Publication of TWI691018B publication Critical patent/TWI691018B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
TW105132911A 2015-11-30 2016-10-12 切削裝置 TWI691018B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-233110 2015-11-30
JP2015233110A JP6560110B2 (ja) 2015-11-30 2015-11-30 切削装置

Publications (2)

Publication Number Publication Date
TW201727820A TW201727820A (zh) 2017-08-01
TWI691018B true TWI691018B (zh) 2020-04-11

Family

ID=59018191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105132911A TWI691018B (zh) 2015-11-30 2016-10-12 切削裝置

Country Status (4)

Country Link
JP (1) JP6560110B2 (ko)
KR (1) KR102463660B1 (ko)
CN (1) CN107030902B (ko)
TW (1) TWI691018B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7045841B2 (ja) * 2017-12-08 2022-04-01 株式会社ディスコ 切削装置
JP7032122B2 (ja) * 2017-12-22 2022-03-08 株式会社ディスコ 切削装置
CN108573905B (zh) * 2018-04-14 2020-12-01 芜湖拓达电子科技有限公司 一种半导体元件清洗设备及其使用方法
JP7165510B2 (ja) * 2018-05-25 2022-11-04 株式会社ディスコ 搬送用治具及び交換方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050136801A1 (en) * 2003-12-18 2005-06-23 Kazuma Sekiya Cutting machine for plate-shaped material
US20060112802A1 (en) * 2004-11-30 2006-06-01 Disco Corporation Cutting machine
JP2010114281A (ja) * 2008-11-07 2010-05-20 Apic Yamada Corp 切断装置
US20140298969A1 (en) * 2013-04-04 2014-10-09 Disco Corporation Cutting apparatus

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339452B2 (ja) * 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP4616969B2 (ja) * 2000-06-16 2011-01-19 株式会社ディスコ 切断機
JP2002359211A (ja) * 2001-05-30 2002-12-13 Disco Abrasive Syst Ltd 切削機
TWI272673B (en) * 2001-11-21 2007-02-01 Disco Corp Cutting machine
KR20060029927A (ko) * 2004-10-04 2006-04-07 삼성전자주식회사 복수의 소잉 블레이드를 갖는 반도체 소잉 장치
JP4813855B2 (ja) * 2005-09-12 2011-11-09 株式会社ディスコ 切削装置および加工方法
DE102007050471A1 (de) * 2007-10-23 2009-04-30 MAPAL Fabrik für Präzisionswerkzeuge Dr. Kress KG Werkzeug zur spanenden Bearbeitung von Werkstücken
US8116893B2 (en) * 2007-11-19 2012-02-14 Tokyo Seimitsu Co., Ltd. Dicing method
JP5026235B2 (ja) * 2007-11-29 2012-09-12 キヤノンマシナリー株式会社 基板切断装置
JP5386276B2 (ja) * 2009-09-02 2014-01-15 株式会社ディスコ 切削装置
JP5406676B2 (ja) * 2009-11-10 2014-02-05 株式会社ディスコ ウエーハの加工装置
JP5619559B2 (ja) * 2010-10-12 2014-11-05 株式会社ディスコ 加工装置
JP2013008823A (ja) * 2011-06-24 2013-01-10 Disco Abrasive Syst Ltd 切断装置
JP5947010B2 (ja) * 2011-09-15 2016-07-06 株式会社ディスコ 分割装置
JP5785069B2 (ja) * 2011-12-05 2015-09-24 株式会社ディスコ 切削装置
JP6441737B2 (ja) * 2015-04-28 2018-12-19 株式会社ディスコ 切削装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050136801A1 (en) * 2003-12-18 2005-06-23 Kazuma Sekiya Cutting machine for plate-shaped material
US20060112802A1 (en) * 2004-11-30 2006-06-01 Disco Corporation Cutting machine
JP2010114281A (ja) * 2008-11-07 2010-05-20 Apic Yamada Corp 切断装置
US20140298969A1 (en) * 2013-04-04 2014-10-09 Disco Corporation Cutting apparatus

Also Published As

Publication number Publication date
CN107030902A (zh) 2017-08-11
TW201727820A (zh) 2017-08-01
JP6560110B2 (ja) 2019-08-14
JP2017103274A (ja) 2017-06-08
KR20170063379A (ko) 2017-06-08
CN107030902B (zh) 2020-05-26
KR102463660B1 (ko) 2022-11-03

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