TWI685026B - 剝離方法 - Google Patents
剝離方法 Download PDFInfo
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- TWI685026B TWI685026B TW107130688A TW107130688A TWI685026B TW I685026 B TWI685026 B TW I685026B TW 107130688 A TW107130688 A TW 107130688A TW 107130688 A TW107130688 A TW 107130688A TW I685026 B TWI685026 B TW I685026B
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- H—ELECTRICITY
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- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H—ELECTRICITY
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| KR101953724B1 (ko) * | 2011-08-26 | 2019-03-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 모듈, 발광 장치, 발광 모듈의 제작 방법, 발광 장치의 제작 방법 |
| CN102496667B (zh) * | 2011-12-20 | 2014-05-07 | 中国科学院半导体研究所 | GaN基薄膜芯片的制造方法 |
| JP6277357B2 (ja) * | 2012-08-03 | 2018-02-14 | 株式会社Ｊｏｌｅｄ | 接合体の製造方法 |
| CN105474355B (zh) * | 2013-08-06 | 2018-11-13 | 株式会社半导体能源研究所 | 剥离方法 |
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| TW200300281A (en) * | 2001-10-30 | 2003-05-16 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
| CN101236919A (zh) * | 2007-01-31 | 2008-08-06 | 精工爱普生株式会社 | 半导体装置的制造方法 |
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| WO2015019971A1 (en) | 2015-02-12 |
| CN109273622B (zh) | 2021-03-12 |
| US20170358782A1 (en) | 2017-12-14 |
| TWI642094B (zh) | 2018-11-21 |
| US10164219B2 (en) | 2018-12-25 |
| TW201517140A (zh) | 2015-05-01 |
| CN105474355B (zh) | 2018-11-13 |
| KR102224416B1 (ko) | 2021-03-05 |
| JP2020141140A (ja) | 2020-09-03 |
| JP2019125803A (ja) | 2019-07-25 |
| US20150044792A1 (en) | 2015-02-12 |
| US9735398B2 (en) | 2017-08-15 |
| CN109273622A (zh) | 2019-01-25 |
| JP2015053479A (ja) | 2015-03-19 |
| CN105474355A (zh) | 2016-04-06 |
| KR20160040513A (ko) | 2016-04-14 |
| JP6870139B2 (ja) | 2021-05-12 |
| TW201901765A (zh) | 2019-01-01 |
| JP6692959B2 (ja) | 2020-05-13 |
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