CN105474355B - 剥离方法 - Google Patents

剥离方法 Download PDF

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Publication number
CN105474355B
CN105474355B CN201480044272.XA CN201480044272A CN105474355B CN 105474355 B CN105474355 B CN 105474355B CN 201480044272 A CN201480044272 A CN 201480044272A CN 105474355 B CN105474355 B CN 105474355B
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CN
China
Prior art keywords
layer
peeling
substrate
adhesive layer
partition wall
Prior art date
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Expired - Fee Related
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CN201480044272.XA
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English (en)
Chinese (zh)
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CN105474355A (zh
Inventor
青山智哉
千田章裕
小松立
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to CN201811105357.0A priority Critical patent/CN109273622B/zh
Publication of CN105474355A publication Critical patent/CN105474355A/zh
Application granted granted Critical
Publication of CN105474355B publication Critical patent/CN105474355B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
CN201480044272.XA 2013-08-06 2014-07-29 剥离方法 Expired - Fee Related CN105474355B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811105357.0A CN109273622B (zh) 2013-08-06 2014-07-29 剥离方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013163029 2013-08-06
JP2013-163029 2013-08-06
PCT/JP2014/070418 WO2015019971A1 (en) 2013-08-06 2014-07-29 Peeling method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811105357.0A Division CN109273622B (zh) 2013-08-06 2014-07-29 剥离方法

Publications (2)

Publication Number Publication Date
CN105474355A CN105474355A (zh) 2016-04-06
CN105474355B true CN105474355B (zh) 2018-11-13

Family

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Family Applications (2)

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CN201480044272.XA Expired - Fee Related CN105474355B (zh) 2013-08-06 2014-07-29 剥离方法
CN201811105357.0A Expired - Fee Related CN109273622B (zh) 2013-08-06 2014-07-29 剥离方法

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Country Status (6)

Country Link
US (2) US9735398B2 (enExample)
JP (3) JP2015053479A (enExample)
KR (1) KR102224416B1 (enExample)
CN (2) CN105474355B (enExample)
TW (2) TWI685026B (enExample)
WO (1) WO2015019971A1 (enExample)

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JP6634283B2 (ja) * 2014-12-29 2020-01-22 株式会社半導体エネルギー研究所 機能パネル
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CN106019552B (zh) * 2016-06-23 2019-01-11 中国科学院西安光学精密机械研究所 消除被测物体表面盲点的显微镜辅助装置
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JP7242362B2 (ja) 2019-03-18 2023-03-20 キオクシア株式会社 半導体装置の製造方法
TWI710820B (zh) 2019-03-28 2020-11-21 友達光電股份有限公司 顯示裝置
CN110783253B (zh) * 2019-10-31 2022-05-24 京东方科技集团股份有限公司 一种显示基板的制作方法、显示基板和显示装置
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CN111873605B (zh) * 2020-09-04 2022-04-26 广东华中科技大学工业技术研究院 一种机械爪辅助撕膜装置及撕膜机构
KR102491000B1 (ko) * 2020-09-24 2023-01-26 세메스 주식회사 접착제층 제거 유닛 및 이를 이용하는 접착제층 제거 방법
BR112023022328A2 (pt) * 2021-04-28 2023-12-26 Ae BONG Da Dispositivo de remoção a vapor de película de tonalização de automóveis
KR102878738B1 (ko) 2021-07-30 2025-10-30 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
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