KR102224416B1 - 박리 방법 - Google Patents

박리 방법 Download PDF

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Publication number
KR102224416B1
KR102224416B1 KR1020167000709A KR20167000709A KR102224416B1 KR 102224416 B1 KR102224416 B1 KR 102224416B1 KR 1020167000709 A KR1020167000709 A KR 1020167000709A KR 20167000709 A KR20167000709 A KR 20167000709A KR 102224416 B1 KR102224416 B1 KR 102224416B1
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South Korea
Prior art keywords
layer
peeling
substrate
adhesive layer
partition wall
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Expired - Fee Related
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KR1020167000709A
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English (en)
Korean (ko)
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KR20160040513A (ko
Inventor
도모야 아오야마
아키히로 치다
류 고마츠
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H01L51/0024—
    • H01L51/003—
    • H01L51/524—
    • H01L51/5246—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H01L2924/35121—

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
KR1020167000709A 2013-08-06 2014-07-29 박리 방법 Expired - Fee Related KR102224416B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-163029 2013-08-06
JP2013163029 2013-08-06
PCT/JP2014/070418 WO2015019971A1 (en) 2013-08-06 2014-07-29 Peeling method

Publications (2)

Publication Number Publication Date
KR20160040513A KR20160040513A (ko) 2016-04-14
KR102224416B1 true KR102224416B1 (ko) 2021-03-05

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KR1020167000709A Expired - Fee Related KR102224416B1 (ko) 2013-08-06 2014-07-29 박리 방법

Country Status (6)

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US (2) US9735398B2 (enExample)
JP (3) JP2015053479A (enExample)
KR (1) KR102224416B1 (enExample)
CN (2) CN109273622B (enExample)
TW (2) TWI685026B (enExample)
WO (1) WO2015019971A1 (enExample)

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TWI794098B (zh) 2013-09-06 2023-02-21 日商半導體能源研究所股份有限公司 發光裝置以及發光裝置的製造方法
TWI524998B (zh) * 2013-09-25 2016-03-11 友達光電股份有限公司 基板之黏結及分離的方法
US9937698B2 (en) 2013-11-06 2018-04-10 Semiconductor Energy Laboratory Co., Ltd. Peeling method and light-emitting device
US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102334815B1 (ko) 2014-02-19 2021-12-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 박리 방법
JP6289286B2 (ja) * 2014-06-25 2018-03-07 株式会社ジャパンディスプレイ 表示装置および表示装置の製造方法
KR102368997B1 (ko) 2014-06-27 2022-02-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 모듈, 전자 기기, 발광 장치의 제작 방법
KR101586996B1 (ko) * 2014-07-11 2016-01-22 한국기계연구원 금속모재 위에 증착된 금속막 분리장치
JP6634283B2 (ja) * 2014-12-29 2020-01-22 株式会社半導体エネルギー研究所 機能パネル
WO2017017553A1 (en) 2015-07-30 2017-02-02 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
US10259207B2 (en) 2016-01-26 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming separation starting point and separation method
JP6863803B2 (ja) 2016-04-07 2021-04-21 株式会社半導体エネルギー研究所 表示装置
US10279576B2 (en) 2016-04-26 2019-05-07 Semiconductor Energy Laboratory Co., Ltd. Peeling method and manufacturing method of flexible device
KR102378976B1 (ko) * 2016-05-18 2022-03-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 표시 장치, 모듈, 및 전자 기기
CN106019552B (zh) * 2016-06-23 2019-01-11 中国科学院西安光学精密机械研究所 消除被测物体表面盲点的显微镜辅助装置
KR102425705B1 (ko) * 2016-08-31 2022-07-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
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US11177373B2 (en) 2016-11-03 2021-11-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
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CN110998386B (zh) * 2017-08-16 2022-10-28 Ａｇｃ株式会社 聚合物光波导
KR102179165B1 (ko) * 2017-11-28 2020-11-16 삼성전자주식회사 캐리어 기판 및 상기 캐리어 기판을 이용한 반도체 패키지의 제조방법
JP7242362B2 (ja) * 2019-03-18 2023-03-20 キオクシア株式会社 半導体装置の製造方法
TWI710820B (zh) 2019-03-28 2020-11-21 友達光電股份有限公司 顯示裝置
CN110783253B (zh) * 2019-10-31 2022-05-24 京东方科技集团股份有限公司 一种显示基板的制作方法、显示基板和显示装置
US10849235B1 (en) * 2020-05-20 2020-11-24 Tactotek Oy Method of manufacture of a structure and structure
CN111873605B (zh) * 2020-09-04 2022-04-26 广东华中科技大学工业技术研究院 一种机械爪辅助撕膜装置及撕膜机构
KR102491000B1 (ko) * 2020-09-24 2023-01-26 세메스 주식회사 접착제층 제거 유닛 및 이를 이용하는 접착제층 제거 방법
AU2021443414B2 (en) * 2021-04-28 2024-10-17 Da Ae Bong Steam peeling device for automobile tinting film
KR102878738B1 (ko) 2021-07-30 2025-10-30 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN114284460B (zh) * 2021-12-14 2024-04-16 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
CN115623621A (zh) * 2022-11-14 2023-01-17 安徽宇航派蒙健康科技股份有限公司 石墨烯基电热膜及其制备方法

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