TWI606569B - 半導體元件以及半導體封裝 - Google Patents

半導體元件以及半導體封裝 Download PDF

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Publication number
TWI606569B
TWI606569B TW103107328A TW103107328A TWI606569B TW I606569 B TWI606569 B TW I606569B TW 103107328 A TW103107328 A TW 103107328A TW 103107328 A TW103107328 A TW 103107328A TW I606569 B TWI606569 B TW I606569B
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TW
Taiwan
Prior art keywords
memory
soc
system single
output
bump
Prior art date
Application number
TW103107328A
Other languages
English (en)
Chinese (zh)
Other versions
TW201436165A (zh
Inventor
金泰善
林慶默
Original Assignee
三星電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星電子股份有限公司 filed Critical 三星電子股份有限公司
Publication of TW201436165A publication Critical patent/TW201436165A/zh
Application granted granted Critical
Publication of TWI606569B publication Critical patent/TWI606569B/zh

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Memory System (AREA)
TW103107328A 2013-03-15 2014-03-05 半導體元件以及半導體封裝 TWI606569B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130027658A KR102029682B1 (ko) 2013-03-15 2013-03-15 반도체 장치 및 반도체 패키지

Publications (2)

Publication Number Publication Date
TW201436165A TW201436165A (zh) 2014-09-16
TWI606569B true TWI606569B (zh) 2017-11-21

Family

ID=50792497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103107328A TWI606569B (zh) 2013-03-15 2014-03-05 半導體元件以及半導體封裝

Country Status (8)

Country Link
US (1) US9275688B2 (cg-RX-API-DMAC7.html)
JP (1) JP2014182794A (cg-RX-API-DMAC7.html)
KR (1) KR102029682B1 (cg-RX-API-DMAC7.html)
CN (1) CN104051410B (cg-RX-API-DMAC7.html)
DE (1) DE102014103186B4 (cg-RX-API-DMAC7.html)
IN (1) IN2014DE00712A (cg-RX-API-DMAC7.html)
NL (1) NL2012389B1 (cg-RX-API-DMAC7.html)
TW (1) TWI606569B (cg-RX-API-DMAC7.html)

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US9324397B1 (en) * 2015-01-16 2016-04-26 Qualcomm Incorporated Common die for supporting different external memory types with minimal packaging complexity
TWI561960B (en) * 2015-11-05 2016-12-11 Sunplus Technology Co Ltd Clock providing system
KR102413441B1 (ko) 2015-11-12 2022-06-28 삼성전자주식회사 반도체 패키지
KR102468698B1 (ko) * 2015-12-23 2022-11-22 에스케이하이닉스 주식회사 메모리 장치
DE102016011750A1 (de) * 2016-09-29 2018-03-29 Ceramtec-Etec Gmbh Datenträger aus Keramik
US11514996B2 (en) * 2017-07-30 2022-11-29 Neuroblade Ltd. Memory-based processors
KR20190087893A (ko) * 2018-01-17 2019-07-25 삼성전자주식회사 클럭을 공유하는 반도체 패키지 및 전자 시스템
KR102836932B1 (ko) * 2018-09-06 2025-07-22 뉴로블레이드, 리미티드. 메모리 기반 프로세서
WO2020240239A1 (en) * 2019-05-31 2020-12-03 Micron Technology, Inc. Memory component for a system-on-chip device

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JP4910512B2 (ja) * 2006-06-30 2012-04-04 富士通セミコンダクター株式会社 半導体装置および半導体装置の製造方法
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CN102891114B (zh) * 2012-10-24 2015-01-28 上海新储集成电路有限公司 一种上下堆叠的片上系统芯片的制作方法

Also Published As

Publication number Publication date
CN104051410B (zh) 2018-05-01
JP2014182794A (ja) 2014-09-29
KR20140112944A (ko) 2014-09-24
KR102029682B1 (ko) 2019-10-08
IN2014DE00712A (cg-RX-API-DMAC7.html) 2015-06-19
TW201436165A (zh) 2014-09-16
US20140268979A1 (en) 2014-09-18
DE102014103186A1 (de) 2014-09-18
NL2012389B1 (en) 2016-07-15
CN104051410A (zh) 2014-09-17
DE102014103186B4 (de) 2021-05-27
US9275688B2 (en) 2016-03-01
NL2012389A (en) 2014-09-16

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