JP2014182794A - 半導体装置及び半導体パッケージ - Google Patents

半導体装置及び半導体パッケージ Download PDF

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Publication number
JP2014182794A
JP2014182794A JP2014027928A JP2014027928A JP2014182794A JP 2014182794 A JP2014182794 A JP 2014182794A JP 2014027928 A JP2014027928 A JP 2014027928A JP 2014027928 A JP2014027928 A JP 2014027928A JP 2014182794 A JP2014182794 A JP 2014182794A
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JP
Japan
Prior art keywords
soc
chip
memory
mode
wide input
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Pending
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JP2014027928A
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English (en)
Japanese (ja)
Inventor
Tae-Sun Kim
泰 善 金
Kyoungmook Lim
慶 默 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2014182794A publication Critical patent/JP2014182794A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Memory System (AREA)
JP2014027928A 2013-03-15 2014-02-17 半導体装置及び半導体パッケージ Pending JP2014182794A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0027658 2013-03-15
KR1020130027658A KR102029682B1 (ko) 2013-03-15 2013-03-15 반도체 장치 및 반도체 패키지

Publications (1)

Publication Number Publication Date
JP2014182794A true JP2014182794A (ja) 2014-09-29

Family

ID=50792497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014027928A Pending JP2014182794A (ja) 2013-03-15 2014-02-17 半導体装置及び半導体パッケージ

Country Status (8)

Country Link
US (1) US9275688B2 (cg-RX-API-DMAC7.html)
JP (1) JP2014182794A (cg-RX-API-DMAC7.html)
KR (1) KR102029682B1 (cg-RX-API-DMAC7.html)
CN (1) CN104051410B (cg-RX-API-DMAC7.html)
DE (1) DE102014103186B4 (cg-RX-API-DMAC7.html)
IN (1) IN2014DE00712A (cg-RX-API-DMAC7.html)
NL (1) NL2012389B1 (cg-RX-API-DMAC7.html)
TW (1) TWI606569B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018508871A (ja) * 2015-01-16 2018-03-29 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 最小限のパッケージングの複雑性で異なる外部メモリタイプをサポートするための共通のダイ

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KR102468698B1 (ko) * 2015-12-23 2022-11-22 에스케이하이닉스 주식회사 메모리 장치
DE102016011750A1 (de) * 2016-09-29 2018-03-29 Ceramtec-Etec Gmbh Datenträger aus Keramik
US11514996B2 (en) * 2017-07-30 2022-11-29 Neuroblade Ltd. Memory-based processors
KR20190087893A (ko) * 2018-01-17 2019-07-25 삼성전자주식회사 클럭을 공유하는 반도체 패키지 및 전자 시스템
KR102836932B1 (ko) * 2018-09-06 2025-07-22 뉴로블레이드, 리미티드. 메모리 기반 프로세서
WO2020240239A1 (en) * 2019-05-31 2020-12-03 Micron Technology, Inc. Memory component for a system-on-chip device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018508871A (ja) * 2015-01-16 2018-03-29 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 最小限のパッケージングの複雑性で異なる外部メモリタイプをサポートするための共通のダイ

Also Published As

Publication number Publication date
CN104051410B (zh) 2018-05-01
TWI606569B (zh) 2017-11-21
KR20140112944A (ko) 2014-09-24
KR102029682B1 (ko) 2019-10-08
IN2014DE00712A (cg-RX-API-DMAC7.html) 2015-06-19
TW201436165A (zh) 2014-09-16
US20140268979A1 (en) 2014-09-18
DE102014103186A1 (de) 2014-09-18
NL2012389B1 (en) 2016-07-15
CN104051410A (zh) 2014-09-17
DE102014103186B4 (de) 2021-05-27
US9275688B2 (en) 2016-03-01
NL2012389A (en) 2014-09-16

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