DE102014103186B4 - Halbleitervorrichtung und Halbleiterpackage - Google Patents

Halbleitervorrichtung und Halbleiterpackage Download PDF

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Publication number
DE102014103186B4
DE102014103186B4 DE102014103186.5A DE102014103186A DE102014103186B4 DE 102014103186 B4 DE102014103186 B4 DE 102014103186B4 DE 102014103186 A DE102014103186 A DE 102014103186A DE 102014103186 B4 DE102014103186 B4 DE 102014103186B4
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Prior art keywords
memory
chip system
output
soc
wide input
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DE102014103186.5A
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German (de)
English (en)
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DE102014103186A1 (de
Inventor
Kyoung-Mook Lim
Tae-Sun Kim
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of DE102014103186A1 publication Critical patent/DE102014103186A1/de
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Memory System (AREA)
DE102014103186.5A 2013-03-15 2014-03-11 Halbleitervorrichtung und Halbleiterpackage Active DE102014103186B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0027658 2013-03-15
KR1020130027658A KR102029682B1 (ko) 2013-03-15 2013-03-15 반도체 장치 및 반도체 패키지

Publications (2)

Publication Number Publication Date
DE102014103186A1 DE102014103186A1 (de) 2014-09-18
DE102014103186B4 true DE102014103186B4 (de) 2021-05-27

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DE102014103186.5A Active DE102014103186B4 (de) 2013-03-15 2014-03-11 Halbleitervorrichtung und Halbleiterpackage

Country Status (8)

Country Link
US (1) US9275688B2 (cg-RX-API-DMAC7.html)
JP (1) JP2014182794A (cg-RX-API-DMAC7.html)
KR (1) KR102029682B1 (cg-RX-API-DMAC7.html)
CN (1) CN104051410B (cg-RX-API-DMAC7.html)
DE (1) DE102014103186B4 (cg-RX-API-DMAC7.html)
IN (1) IN2014DE00712A (cg-RX-API-DMAC7.html)
NL (1) NL2012389B1 (cg-RX-API-DMAC7.html)
TW (1) TWI606569B (cg-RX-API-DMAC7.html)

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US9324397B1 (en) * 2015-01-16 2016-04-26 Qualcomm Incorporated Common die for supporting different external memory types with minimal packaging complexity
TWI561960B (en) * 2015-11-05 2016-12-11 Sunplus Technology Co Ltd Clock providing system
KR102413441B1 (ko) 2015-11-12 2022-06-28 삼성전자주식회사 반도체 패키지
KR102468698B1 (ko) * 2015-12-23 2022-11-22 에스케이하이닉스 주식회사 메모리 장치
DE102016011750A1 (de) * 2016-09-29 2018-03-29 Ceramtec-Etec Gmbh Datenträger aus Keramik
US11514996B2 (en) * 2017-07-30 2022-11-29 Neuroblade Ltd. Memory-based processors
KR20190087893A (ko) * 2018-01-17 2019-07-25 삼성전자주식회사 클럭을 공유하는 반도체 패키지 및 전자 시스템
KR102836932B1 (ko) * 2018-09-06 2025-07-22 뉴로블레이드, 리미티드. 메모리 기반 프로세서
WO2020240239A1 (en) * 2019-05-31 2020-12-03 Micron Technology, Inc. Memory component for a system-on-chip device

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US20100140750A1 (en) * 2008-12-10 2010-06-10 Qualcomm Incorporated Parallel Plane Memory and Processor Coupling in a 3-D Micro-Architectural System
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Also Published As

Publication number Publication date
CN104051410B (zh) 2018-05-01
JP2014182794A (ja) 2014-09-29
TWI606569B (zh) 2017-11-21
KR20140112944A (ko) 2014-09-24
KR102029682B1 (ko) 2019-10-08
IN2014DE00712A (cg-RX-API-DMAC7.html) 2015-06-19
TW201436165A (zh) 2014-09-16
US20140268979A1 (en) 2014-09-18
DE102014103186A1 (de) 2014-09-18
NL2012389B1 (en) 2016-07-15
CN104051410A (zh) 2014-09-17
US9275688B2 (en) 2016-03-01
NL2012389A (en) 2014-09-16

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