TWI598968B - Die bonder and bonding methods - Google Patents

Die bonder and bonding methods Download PDF

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Publication number
TWI598968B
TWI598968B TW105135965A TW105135965A TWI598968B TW I598968 B TWI598968 B TW I598968B TW 105135965 A TW105135965 A TW 105135965A TW 105135965 A TW105135965 A TW 105135965A TW I598968 B TWI598968 B TW I598968B
Authority
TW
Taiwan
Prior art keywords
die
waveform
unit
bonding
head
Prior art date
Application number
TW105135965A
Other languages
English (en)
Chinese (zh)
Other versions
TW201810457A (zh
Inventor
牧浩
高野□一
小橋英晴
Original Assignee
捷進科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 捷進科技有限公司 filed Critical 捷進科技有限公司
Application granted granted Critical
Publication of TWI598968B publication Critical patent/TWI598968B/zh
Publication of TW201810457A publication Critical patent/TW201810457A/zh

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Classifications

    • H10P72/0446—
    • H10W72/071—
    • H10P72/0616—
    • H10P72/3206—
    • H10P72/50—
    • H10P74/203—
    • H10W72/019—
    • H10W72/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW105135965A 2016-03-17 2016-11-04 Die bonder and bonding methods TWI598968B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016053169A JP6667326B2 (ja) 2016-03-17 2016-03-17 ダイボンダおよびボンディング方法
JP2016-053169 2016-03-17

Publications (2)

Publication Number Publication Date
TWI598968B true TWI598968B (zh) 2017-09-11
TW201810457A TW201810457A (zh) 2018-03-16

Family

ID=59904684

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105135965A TWI598968B (zh) 2016-03-17 2016-11-04 Die bonder and bonding methods

Country Status (4)

Country Link
JP (1) JP6667326B2 (enExample)
KR (1) KR101923274B1 (enExample)
CN (1) CN107204302B (enExample)
TW (1) TWI598968B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11069555B2 (en) 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
JP7291586B2 (ja) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102377826B1 (ko) * 2020-03-06 2022-03-23 세메스 주식회사 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치
KR102377825B1 (ko) * 2020-03-06 2022-03-23 세메스 주식회사 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치
KR102654727B1 (ko) * 2021-07-21 2024-04-03 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치
WO2024018937A1 (ja) * 2022-07-21 2024-01-25 ボンドテック株式会社 接合方法および接合装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200620494A (en) * 2004-11-26 2006-06-16 Tsukuba Seiko Ltd Die bonding device
TW200836456A (en) * 2007-02-23 2008-09-01 Toshiba Kk Linear actuator and parts holding apparatus/die bonder apparatus utilizing same
TW200947572A (en) * 2008-03-28 2009-11-16 Shibaura Mechatronics Corp Apparatus and method for mounting electronic component
TW201232679A (en) * 2010-10-29 2012-08-01 Hitachi High Tech Instr Co Ltd Die bonding device, die bonding method and die bonding quality evaluation equipment
TW201304040A (zh) * 2011-07-12 2013-01-16 日立先端科技儀器股份有限公司 黏晶機及黏晶機之接合材料供給方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
JP2012069733A (ja) 2010-09-24 2012-04-05 Hitachi High-Tech Instruments Co Ltd ダイボンダの治工具管理方法、および、ダイボンダ
JP5713787B2 (ja) * 2011-04-28 2015-05-07 芝浦メカトロニクス株式会社 電子部品の実装装置
KR101850738B1 (ko) * 2011-05-19 2018-04-24 주식회사 탑 엔지니어링 실시간 동작 데이터의 ｕｉ화면을 구성하는 다이본더
JP5989313B2 (ja) 2011-09-15 2016-09-07 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP2014011287A (ja) * 2012-06-29 2014-01-20 Ohashi Seisakusho:Kk 半導体チップの送り装置
JP2015056596A (ja) * 2013-09-13 2015-03-23 株式会社日立ハイテクインスツルメンツ ダイボンダ及びダイボンダの構成方法
JP6324778B2 (ja) * 2014-03-18 2018-05-16 ファスフォードテクノロジ株式会社 ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法
JP2015195261A (ja) * 2014-03-31 2015-11-05 ファスフォードテクノロジ株式会社 ダイボンダ及び半導体製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200620494A (en) * 2004-11-26 2006-06-16 Tsukuba Seiko Ltd Die bonding device
TW200836456A (en) * 2007-02-23 2008-09-01 Toshiba Kk Linear actuator and parts holding apparatus/die bonder apparatus utilizing same
TW200947572A (en) * 2008-03-28 2009-11-16 Shibaura Mechatronics Corp Apparatus and method for mounting electronic component
TW201232679A (en) * 2010-10-29 2012-08-01 Hitachi High Tech Instr Co Ltd Die bonding device, die bonding method and die bonding quality evaluation equipment
TW201304040A (zh) * 2011-07-12 2013-01-16 日立先端科技儀器股份有限公司 黏晶機及黏晶機之接合材料供給方法

Also Published As

Publication number Publication date
CN107204302B (zh) 2020-06-30
CN107204302A (zh) 2017-09-26
TW201810457A (zh) 2018-03-16
KR101923274B1 (ko) 2018-11-28
JP6667326B2 (ja) 2020-03-18
KR20170108786A (ko) 2017-09-27
JP2017168693A (ja) 2017-09-21

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