JP2009010176A5 - - Google Patents
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- Publication number
- JP2009010176A5 JP2009010176A5 JP2007170363A JP2007170363A JP2009010176A5 JP 2009010176 A5 JP2009010176 A5 JP 2009010176A5 JP 2007170363 A JP2007170363 A JP 2007170363A JP 2007170363 A JP2007170363 A JP 2007170363A JP 2009010176 A5 JP2009010176 A5 JP 2009010176A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- transfer head
- head
- transfer
- position recognition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000012546 transfer Methods 0.000 claims description 229
- 239000000758 substrate Substances 0.000 claims description 86
- 238000003384 imaging method Methods 0.000 claims description 83
- 238000007689 inspection Methods 0.000 claims description 28
- 235000012431 wafers Nutrition 0.000 description 37
- 238000001514 detection method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 238000006073 displacement reaction Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 238000001179 sorption measurement Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 9
- 230000002950 deficient Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007170363A JP4712766B2 (ja) | 2007-06-28 | 2007-06-28 | 部品移載装置 |
| PCT/JP2008/058957 WO2009001627A1 (ja) | 2007-06-28 | 2008-05-15 | 部品移載装置 |
| US12/666,853 US8339445B2 (en) | 2007-06-28 | 2008-05-15 | Component placing apparatus |
| CN2008800222029A CN101689512B (zh) | 2007-06-28 | 2008-05-15 | 元件移载装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007170363A JP4712766B2 (ja) | 2007-06-28 | 2007-06-28 | 部品移載装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009010176A JP2009010176A (ja) | 2009-01-15 |
| JP2009010176A5 true JP2009010176A5 (enExample) | 2011-04-07 |
| JP4712766B2 JP4712766B2 (ja) | 2011-06-29 |
Family
ID=40324972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007170363A Active JP4712766B2 (ja) | 2007-06-28 | 2007-06-28 | 部品移載装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4712766B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10561051B2 (en) | 2016-01-08 | 2020-02-11 | Yamaha Hatsudoki Kabushiki Kaisha | Movement error detection apparatus of mounting head, and component mounting apparatus |
| US11129321B2 (en) | 2016-01-08 | 2021-09-21 | Yamaha Hatsudoki Kabushiki Kaisha | Movement error detection apparatus of mounting head, and component mounting apparatus |
| TWI775198B (zh) * | 2019-12-17 | 2022-08-21 | 日商新川股份有限公司 | 半導體裝置的製造裝置以及半導體裝置的製造方法 |
| US20250308954A1 (en) * | 2024-03-27 | 2025-10-02 | Kla Corporation | Systems and methods for alignment and placement of electronic devices on carrier tape |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263517A (ja) * | 1994-03-24 | 1995-10-13 | Hitachi Electron Eng Co Ltd | Ｉｃソケットの位置決め装置 |
| JP4409136B2 (ja) * | 2001-12-18 | 2010-02-03 | パナソニック株式会社 | 電子部品搭載装置および電子部品搭載方法 |
| JP4222242B2 (ja) * | 2004-03-26 | 2009-02-12 | パナソニック株式会社 | 電子部品搭載装置および電子部品搭載方法 |
| JP4111160B2 (ja) * | 2004-03-26 | 2008-07-02 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
| JP4029855B2 (ja) * | 2004-03-26 | 2008-01-09 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
| JP4657834B2 (ja) * | 2005-06-30 | 2011-03-23 | ヤマハ発動機株式会社 | 部品実装方法および表面実装機 |
-
2007
- 2007-06-28 JP JP2007170363A patent/JP4712766B2/ja active Active
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