WO2009001627A1 - 部品移載装置 - Google Patents

部品移載装置 Download PDF

Info

Publication number
WO2009001627A1
WO2009001627A1 PCT/JP2008/058957 JP2008058957W WO2009001627A1 WO 2009001627 A1 WO2009001627 A1 WO 2009001627A1 JP 2008058957 W JP2008058957 W JP 2008058957W WO 2009001627 A1 WO2009001627 A1 WO 2009001627A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
placing head
placing
head
supplying section
Prior art date
Application number
PCT/JP2008/058957
Other languages
English (en)
French (fr)
Inventor
Shinya Yoro
Kazuhiro Kobayashi
Yasuhiro Suzuki
Yasunori Naitoh
Yasuyoshi Hongashi
Original Assignee
Yamaha Motor Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007170175A external-priority patent/JP4855347B2/ja
Priority claimed from JP2007170363A external-priority patent/JP4712766B2/ja
Priority claimed from JP2007170364A external-priority patent/JP4728293B2/ja
Application filed by Yamaha Motor Co., Ltd. filed Critical Yamaha Motor Co., Ltd.
Priority to US12/666,853 priority Critical patent/US8339445B2/en
Priority to CN2008800222029A priority patent/CN101689512B/zh
Publication of WO2009001627A1 publication Critical patent/WO2009001627A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

【課題】移載ヘッドと独立して移動可能な撮像手段により吸着位置の認識を効率よく行いながら、これら移載ヘッドおよび撮像手段の各座標系のずれを適正に調整して部品の吸着ミスの発生を効果的に防止することが可能な部品移載装置を提供する。 【解決手段】部品実装装置１は、部品供給部５から供給されたチップ部品６を吸着して搬送する移載ヘッド４と、この移載ヘッド４と独立して移動可能に設けられ、上記移載ヘッド４が上記部品供給部５からチップ部品６を吸着する前にそのチップ部品６を撮像する吸着位置認識カメラ３２とを備える。この部品実装装置１の動作を制御する制御ユニット４０は、所定のタイミングで、上記移載ヘッド４および吸着位置認識カメラ３２の各座標系の相関関係を調べ、この相関関係に基づいて、上記移載ヘッド４が上記部品供給部５内のチップ部品６にアクセスする際の移動量を補正する。
PCT/JP2008/058957 2007-06-28 2008-05-15 部品移載装置 WO2009001627A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/666,853 US8339445B2 (en) 2007-06-28 2008-05-15 Component placing apparatus
CN2008800222029A CN101689512B (zh) 2007-06-28 2008-05-15 元件移载装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007170175A JP4855347B2 (ja) 2007-06-28 2007-06-28 部品移載装置
JP2007-170175 2007-06-28
JP2007170363A JP4712766B2 (ja) 2007-06-28 2007-06-28 部品移載装置
JP2007170364A JP4728293B2 (ja) 2007-06-28 2007-06-28 部品移載装置
JP2007-170363 2007-06-28
JP2007-170364 2007-06-28

Publications (1)

Publication Number Publication Date
WO2009001627A1 true WO2009001627A1 (ja) 2008-12-31

Family

ID=40185450

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058957 WO2009001627A1 (ja) 2007-06-28 2008-05-15 部品移載装置

Country Status (3)

Country Link
US (1) US8339445B2 (ja)
CN (1) CN101689512B (ja)
WO (1) WO2009001627A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171043A (ja) * 2012-02-17 2013-09-02 Dr Johannes Heidenhain Gmbh 加工品に対して加工工具を位置決めするための構造および方法
WO2022244086A1 (ja) * 2021-05-18 2022-11-24 ヤマハ発動機株式会社 部品移載装置
CN115831797A (zh) * 2022-12-26 2023-03-21 徐州市沂芯微电子有限公司 一种具有自取料安装功能的芯片检测机
WO2023139735A1 (ja) * 2022-01-20 2023-07-27 ヤマハ発動機株式会社 部品実装装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5774968B2 (ja) * 2011-11-15 2015-09-09 ヤマハ発動機株式会社 部品移載装置および部品移載装置における吸着位置調整方法
JP5832345B2 (ja) * 2012-03-22 2015-12-16 株式会社ニューフレアテクノロジー 検査装置および検査方法
JP5918622B2 (ja) * 2012-05-11 2016-05-18 ヤマハ発動機株式会社 部品または基板の作業装置および部品実装装置
JP5852505B2 (ja) * 2012-05-14 2016-02-03 ヤマハ発動機株式会社 部品または基板の作業装置および部品実装装置
CN103808255B (zh) * 2012-11-06 2019-05-10 株式会社富士 裸片位置判定系统
EP2938176B1 (en) * 2012-12-20 2018-02-14 Fuji Machine Mfg. Co., Ltd. Die supply device
JP2015065642A (ja) * 2013-08-29 2015-04-09 パナソニックＩｐマネジメント株式会社 カメラ装置用の取付装置
JP6212134B2 (ja) * 2013-12-02 2017-10-11 富士機械製造株式会社 組立機
CN103929887B (zh) * 2014-04-04 2017-02-15 珠海元盛电子科技股份有限公司 全自动贴补强机
WO2016194136A1 (ja) * 2015-06-02 2016-12-08 富士機械製造株式会社 部品実装装置及び吸着位置設定方法
CN108370662B (zh) * 2016-01-08 2020-01-21 雅马哈发动机株式会社 安装头的移动误差检测装置及元件安装装置
DE112016006184T8 (de) 2016-01-08 2018-10-25 Yamaha Hatsudoki Kabushiki Kaisha Bewegungsfehlerdetektionseinrichtung eines Montagekopfs sowie Bauteilmontageeinrichtung
US10849261B2 (en) * 2016-02-10 2020-11-24 Yamaha Hatsudoki Kabushiki Kaisha Surface mounter and method of correcting recognition error
CN106289062B (zh) * 2016-09-30 2019-07-16 哈尔滨工业大学 一种基准相机偏移量的校正方法
JP6781677B2 (ja) * 2017-08-01 2020-11-04 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
US10845410B2 (en) * 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US11343948B2 (en) * 2018-03-13 2022-05-24 Fuji Corporation Mounting device and mounting method
CN108996204B (zh) * 2018-07-11 2020-04-21 武汉理工大学 一种微纳米石英晶体封装的移载装置
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
JP7086213B2 (ja) * 2018-10-31 2022-06-17 株式会社Fuji 対基板作業機および移動ヘッド
TWI744850B (zh) * 2019-04-15 2021-11-01 日商新川股份有限公司 封裝裝置
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
CN117457536B (zh) * 2023-11-01 2024-03-26 江苏新智达新能源设备有限公司 一种基于图像处理的芯片智能拾取方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263517A (ja) * 1994-03-24 1995-10-13 Hitachi Electron Eng Co Ltd Ｉｃソケットの位置決め装置
JP2003109979A (ja) * 2001-09-28 2003-04-11 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2005277273A (ja) * 2004-03-26 2005-10-06 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法
JP2007012914A (ja) * 2005-06-30 2007-01-18 Yamaha Motor Co Ltd 部品実装方法および表面実装機

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002094296A (ja) * 2000-09-13 2002-03-29 Fuji Mach Mfg Co Ltd 吸着ノズル，電気部品の保持位置検出方法，吸着管曲がり検出方法，吸着ノズルの回転位置特定方法，電気部品取扱装置
JP2002204096A (ja) * 2000-12-28 2002-07-19 Fuji Mach Mfg Co Ltd 電気部品装着システムおよび電気部品装着方法
JP4616514B2 (ja) * 2001-06-07 2011-01-19 富士機械製造株式会社 電気部品装着システムおよびそれにおける位置誤差検出方法
JP2003059955A (ja) 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263517A (ja) * 1994-03-24 1995-10-13 Hitachi Electron Eng Co Ltd Ｉｃソケットの位置決め装置
JP2003109979A (ja) * 2001-09-28 2003-04-11 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2005277273A (ja) * 2004-03-26 2005-10-06 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法
JP2007012914A (ja) * 2005-06-30 2007-01-18 Yamaha Motor Co Ltd 部品実装方法および表面実装機

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013171043A (ja) * 2012-02-17 2013-09-02 Dr Johannes Heidenhain Gmbh 加工品に対して加工工具を位置決めするための構造および方法
WO2022244086A1 (ja) * 2021-05-18 2022-11-24 ヤマハ発動機株式会社 部品移載装置
WO2023139735A1 (ja) * 2022-01-20 2023-07-27 ヤマハ発動機株式会社 部品実装装置
CN115831797A (zh) * 2022-12-26 2023-03-21 徐州市沂芯微电子有限公司 一种具有自取料安装功能的芯片检测机
CN115831797B (zh) * 2022-12-26 2023-10-13 徐州市沂芯微电子有限公司 一种具有自取料安装功能的芯片检测机

Also Published As

Publication number Publication date
US20100220183A1 (en) 2010-09-02
CN101689512A (zh) 2010-03-31
US8339445B2 (en) 2012-12-25
CN101689512B (zh) 2012-04-04

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