KR101923274B1 - 다이 본더 및 본딩 방법 - Google Patents

다이 본더 및 본딩 방법 Download PDF

Info

Publication number
KR101923274B1
KR101923274B1 KR1020160153596A KR20160153596A KR101923274B1 KR 101923274 B1 KR101923274 B1 KR 101923274B1 KR 1020160153596 A KR1020160153596 A KR 1020160153596A KR 20160153596 A KR20160153596 A KR 20160153596A KR 101923274 B1 KR101923274 B1 KR 101923274B1
Authority
KR
South Korea
Prior art keywords
waveform
die
bonding
recognition
reproducibility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020160153596A
Other languages
English (en)
Korean (ko)
Other versions
KR20170108786A (ko
Inventor
히로시 마끼
류이찌 다까노
히데하루 고바시
Original Assignee
파스포드 테크놀로지 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파스포드 테크놀로지 주식회사 filed Critical 파스포드 테크놀로지 주식회사
Publication of KR20170108786A publication Critical patent/KR20170108786A/ko
Application granted granted Critical
Publication of KR101923274B1 publication Critical patent/KR101923274B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160153596A 2016-03-17 2016-11-17 다이 본더 및 본딩 방법 Active KR101923274B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016053169A JP6667326B2 (ja) 2016-03-17 2016-03-17 ダイボンダおよびボンディング方法
JPJP-P-2016-053169 2016-03-17

Publications (2)

Publication Number Publication Date
KR20170108786A KR20170108786A (ko) 2017-09-27
KR101923274B1 true KR101923274B1 (ko) 2018-11-28

Family

ID=59904684

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160153596A Active KR101923274B1 (ko) 2016-03-17 2016-11-17 다이 본더 및 본딩 방법

Country Status (4)

Country Link
JP (1) JP6667326B2 (enExample)
KR (1) KR101923274B1 (enExample)
CN (1) CN107204302B (enExample)
TW (1) TWI598968B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11069555B2 (en) * 2018-09-03 2021-07-20 Assembleon B.V. Die attach systems, and methods of attaching a die to a substrate
JP7291586B2 (ja) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102377825B1 (ko) * 2020-03-06 2022-03-23 세메스 주식회사 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치
KR102377826B1 (ko) * 2020-03-06 2022-03-23 세메스 주식회사 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치
KR102654727B1 (ko) * 2021-07-21 2024-04-03 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치
JP7759144B2 (ja) * 2022-07-21 2025-10-23 ボンドテック株式会社 接合方法および接合装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120075079A1 (en) 2010-09-24 2012-03-29 Hitachi High-Tech Instruments Co., Ltd. Tool Management Method of Die Bonder and Die Bonder
JP2012234952A (ja) * 2011-04-28 2012-11-29 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
US20130068823A1 (en) 2011-09-15 2013-03-21 Hitachi High-Tech Instruments Co., Ltd. Die Bonder and Bonding Method
JP2014011287A (ja) * 2012-06-29 2014-01-20 Ohashi Seisakusho:Kk 半導体チップの送り装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
JP2006156550A (ja) * 2004-11-26 2006-06-15 Tsukuba Seiko Co Ltd ダイボンディング装置
JP5150155B2 (ja) * 2007-02-23 2013-02-20 株式会社東芝 リニアアクチュエータおよびリニアアクチュエータを利用した装置
WO2009119193A1 (ja) * 2008-03-28 2009-10-01 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5666246B2 (ja) * 2010-10-29 2015-02-12 株式会社日立ハイテクインスツルメンツ ダイボンダ装置およびダイボンダ方法
KR101850738B1 (ko) * 2011-05-19 2018-04-24 주식회사 탑 엔지니어링 실시간 동작 데이터의 ｕｉ화면을 구성하는 다이본더
JP5771466B2 (ja) * 2011-07-12 2015-09-02 ファスフォードテクノロジ株式会社 ダイボンダ及びダイボンダの接合材供給方法
JP2015056596A (ja) * 2013-09-13 2015-03-23 株式会社日立ハイテクインスツルメンツ ダイボンダ及びダイボンダの構成方法
JP6324778B2 (ja) * 2014-03-18 2018-05-16 ファスフォードテクノロジ株式会社 ダイボンダの実装位置補正方法並びにダイボンダ及びボンディング方法
JP2015195261A (ja) * 2014-03-31 2015-11-05 ファスフォードテクノロジ株式会社 ダイボンダ及び半導体製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120075079A1 (en) 2010-09-24 2012-03-29 Hitachi High-Tech Instruments Co., Ltd. Tool Management Method of Die Bonder and Die Bonder
JP2012234952A (ja) * 2011-04-28 2012-11-29 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
US20130068823A1 (en) 2011-09-15 2013-03-21 Hitachi High-Tech Instruments Co., Ltd. Die Bonder and Bonding Method
JP2014011287A (ja) * 2012-06-29 2014-01-20 Ohashi Seisakusho:Kk 半導体チップの送り装置

Also Published As

Publication number Publication date
TW201810457A (zh) 2018-03-16
TWI598968B (zh) 2017-09-11
CN107204302A (zh) 2017-09-26
KR20170108786A (ko) 2017-09-27
JP2017168693A (ja) 2017-09-21
CN107204302B (zh) 2020-06-30
JP6667326B2 (ja) 2020-03-18

Similar Documents

Publication Publication Date Title
KR101923274B1 (ko) 다이 본더 및 본딩 방법
KR101426583B1 (ko) 다이 본더 및 반도체 제조 방법
CN109494173B (zh) 芯片贴装装置和半导体器件的制造方法
KR101449247B1 (ko) 다이 본더 및 다이의 위치 인식 방법
KR102362976B1 (ko) 제1 물체를 제2 물체에 대하여 위치 결정하는 장치 및 방법
CN108666238B (zh) 芯片贴装装置及半导体器件的制造方法
JP6374189B2 (ja) ダイボンダ及びボンディング方法
KR101802080B1 (ko) 웨이퍼로부터 다이들을 픽업하는 방법
WO2019171481A1 (ja) 部品実装システム
EP2059112B1 (en) Electronic component taking out apparatus, surface mounting apparatus and method for taking out electronic component
JP2004521514A (ja) 基板に構成部品を実装するための装置
US7087457B2 (en) Die bonding method and apparatus
KR102430824B1 (ko) 다이 본딩 장치 및 반도체 장치의 제조 방법
US20180323088A1 (en) Die placement head with turret
JP4232511B2 (ja) 半導体製造装置
KR102329100B1 (ko) 실장 장치, 및 반도체 장치의 제조 방법
JP2011023424A (ja) 電子部品の実装装置及び実装方法
KR20230103832A (ko) 다이 본딩 설비 및 다이 본딩 설비의 구동 편차 보정 방법
CN114823414A (zh) 芯片贴装装置及半导体器件的制造方法
JP2012059933A (ja) ダイボンダおよびダイボンディング方法
JP2013197278A (ja) 半導体製造装置
JPS6386528A (ja) ダイボンデイング装置
CN118342491A (zh) 接合装置、接合方法及计算机可读存储介质
JP2025135723A (ja) 半導体製造装置、モータ制御装置および半導体装置の製造方法
KR20170132441A (ko) 다이 본딩 공정의 레시피 생성 방법

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 8