TWI594431B - 化合物半導體裝置及其製造方法 - Google Patents
化合物半導體裝置及其製造方法 Download PDFInfo
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- TWI594431B TWI594431B TW102130787A TW102130787A TWI594431B TW I594431 B TWI594431 B TW I594431B TW 102130787 A TW102130787 A TW 102130787A TW 102130787 A TW102130787 A TW 102130787A TW I594431 B TWI594431 B TW I594431B
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- insulating film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28264—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being a III-V compound
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/22—Conversion of DC power input into DC power output with intermediate conversion into AC
- H02M3/24—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
- H02M3/28—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/031—Manufacture or treatment of data-storage electrodes
- H10D64/035—Manufacture or treatment of data-storage electrodes comprising conductor-insulator-conductor-insulator-semiconductor structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/118—Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0067—Converter structures employing plural converter units, other than for parallel operation of the units on a single load
- H02M1/007—Plural converter units in cascade
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/22—Conversion of DC power input into DC power output with intermediate conversion into AC
- H02M3/24—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
- H02M3/28—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC
- H02M3/325—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/33569—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
- H02M3/33576—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
- H02M7/04—Conversion of AC power input into DC power output without possibility of reversal by static converters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Dc-Dc Converters (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012217087A JP6085442B2 (ja) | 2012-09-28 | 2012-09-28 | 化合物半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201417286A TW201417286A (zh) | 2014-05-01 |
| TWI594431B true TWI594431B (zh) | 2017-08-01 |
Family
ID=50385023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102130787A TWI594431B (zh) | 2012-09-28 | 2013-08-28 | 化合物半導體裝置及其製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9425268B2 (enExample) |
| JP (1) | JP6085442B2 (enExample) |
| CN (1) | CN103715252B (enExample) |
| TW (1) | TWI594431B (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6085442B2 (ja) | 2012-09-28 | 2017-02-22 | トランスフォーム・ジャパン株式会社 | 化合物半導体装置及びその製造方法 |
| CN105280695A (zh) * | 2014-06-06 | 2016-01-27 | 台达电子工业股份有限公司 | 半导体装置与其的制造方法 |
| JP2017199700A (ja) * | 2014-09-04 | 2017-11-02 | シャープ株式会社 | 電界効果トランジスタ |
| US9571093B2 (en) | 2014-09-16 | 2017-02-14 | Navitas Semiconductor, Inc. | Half bridge driver circuits |
| US9960620B2 (en) | 2014-09-16 | 2018-05-01 | Navitas Semiconductor, Inc. | Bootstrap capacitor charging circuit for GaN devices |
| US9960154B2 (en) * | 2014-09-19 | 2018-05-01 | Navitas Semiconductor, Inc. | GaN structures |
| JP6496149B2 (ja) * | 2015-01-22 | 2019-04-03 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| CN107431021B (zh) * | 2015-03-31 | 2020-09-22 | 夏普株式会社 | 氮化物半导体场效应晶体管 |
| US10110232B2 (en) | 2015-06-30 | 2018-10-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiplexer and latch system |
| JP6311668B2 (ja) * | 2015-07-10 | 2018-04-18 | 株式会社デンソー | 半導体装置 |
| US9941384B2 (en) | 2015-08-29 | 2018-04-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and method for fabricating the same |
| CN106601809A (zh) * | 2015-10-15 | 2017-04-26 | 北京大学 | 一种氮化镓场效应晶体管及其制作方法 |
| JP6707837B2 (ja) * | 2015-10-29 | 2020-06-10 | 富士通株式会社 | 半導体結晶基板、半導体装置、半導体結晶基板の製造方法及び半導体装置の製造方法 |
| JP6623684B2 (ja) * | 2015-10-29 | 2019-12-25 | 富士通株式会社 | 半導体装置及びその製造方法、電源装置、高周波増幅器 |
| ITUB20155862A1 (it) | 2015-11-24 | 2017-05-24 | St Microelectronics Srl | Transistore di tipo normalmente spento con ridotta resistenza in stato acceso e relativo metodo di fabbricazione |
| US9831867B1 (en) | 2016-02-22 | 2017-11-28 | Navitas Semiconductor, Inc. | Half bridge driver circuits |
| CN107949915B (zh) * | 2016-03-14 | 2021-04-27 | 富士电机株式会社 | 半导体装置及制造方法 |
| US20170294848A1 (en) * | 2016-04-07 | 2017-10-12 | Visic Technologies Ltd. | Method and device for ac fed switch mode power supply based on normally on transistors |
| CN108321198B (zh) * | 2017-01-17 | 2021-06-08 | 株式会社东芝 | 半导体装置、电源电路、计算机和半导体装置的制造方法 |
| EP3613082A4 (en) * | 2017-04-10 | 2021-05-12 | The Government of the United States of America as represented by the Secretary of the Navy | DIAMOND AIR BRIDGE FOR THERMAL MANAGEMENT OF HIGH PERFORMANCE DEVICES |
| US10630285B1 (en) | 2017-11-21 | 2020-04-21 | Transphorm Technology, Inc. | Switching circuits having drain connected ferrite beads |
| JP2019121785A (ja) * | 2017-12-27 | 2019-07-22 | ローム株式会社 | 半導体装置およびその製造方法 |
| CN110112211A (zh) * | 2018-02-01 | 2019-08-09 | 世界先进积体电路股份有限公司 | 半导体装置及其制造方法 |
| US11043563B2 (en) * | 2018-03-12 | 2021-06-22 | Vanguard International Semiconductor Corporation | Semiconductor devices and methods for fabricating the same |
| JP6811737B2 (ja) * | 2018-03-13 | 2021-01-13 | 株式会社東芝 | 半導体装置 |
| US20190305122A1 (en) * | 2018-03-28 | 2019-10-03 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure |
| US11158575B2 (en) | 2018-06-05 | 2021-10-26 | Macom Technology Solutions Holdings, Inc. | Parasitic capacitance reduction in GaN-on-silicon devices |
| US10756207B2 (en) | 2018-10-12 | 2020-08-25 | Transphorm Technology, Inc. | Lateral III-nitride devices including a vertical gate module |
| JP7544734B2 (ja) | 2019-03-21 | 2024-09-03 | トランスフォーム テクノロジー,インコーポレーテッド | Iii族窒化物デバイスのための集積設計 |
| CN109841677A (zh) * | 2019-03-28 | 2019-06-04 | 英诺赛科(珠海)科技有限公司 | 高电子迁移率晶体管及其制造方法 |
| CN112242441A (zh) * | 2019-07-16 | 2021-01-19 | 联华电子股份有限公司 | 高电子迁移率晶体管 |
| CN113035943A (zh) * | 2019-12-25 | 2021-06-25 | 华润微电子(重庆)有限公司 | 具有场板结构的hemt器件及其制备方法 |
| US11749656B2 (en) | 2020-06-16 | 2023-09-05 | Transphorm Technology, Inc. | Module configurations for integrated III-Nitride devices |
| JP7719856B2 (ja) | 2020-08-05 | 2025-08-06 | トランスフォーム テクノロジー,インコーポレーテッド | 空乏層を有するiii族窒化物デバイス |
| JP7543773B2 (ja) * | 2020-08-25 | 2024-09-03 | 富士通株式会社 | 半導体装置及びその製造方法 |
| US12148747B2 (en) | 2020-09-25 | 2024-11-19 | Intel Corporation | Gallium nitride (GAN) three-dimensional integrated circuit technology |
| US20220102344A1 (en) * | 2020-09-25 | 2022-03-31 | Intel Corporation | Gallium nitride (gan) three-dimensional integrated circuit technology |
| CN115347042B (zh) | 2021-05-14 | 2025-10-21 | 联华电子股份有限公司 | 半导体结构及其制作方法 |
| US12446252B2 (en) * | 2021-05-20 | 2025-10-14 | Macom Technology Solutions Holdings, Inc. | Transistors including semiconductor surface modification and related fabrication methods |
| US12451468B1 (en) | 2021-08-25 | 2025-10-21 | Transphorm Technology, Inc. | III-N devices with improved reliability |
| TWI810817B (zh) * | 2022-02-16 | 2023-08-01 | 元太科技工業股份有限公司 | 觸控顯示裝置 |
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| US20100044752A1 (en) * | 2008-08-22 | 2010-02-25 | Oki Electric Industry Co., Ltd. | Semiconductor device and manufacturing method |
| CN102237405A (zh) * | 2010-05-07 | 2011-11-09 | 富士通半导体股份有限公司 | 复合半导体器件及其制造方法 |
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| JPH0513408A (ja) * | 1991-07-08 | 1993-01-22 | Nec Corp | 半導体装置の製造方法 |
| JP2001237250A (ja) * | 2000-02-22 | 2001-08-31 | Nec Corp | 半導体装置 |
| US7501669B2 (en) * | 2003-09-09 | 2009-03-10 | Cree, Inc. | Wide bandgap transistor devices with field plates |
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| JP2007150106A (ja) * | 2005-11-29 | 2007-06-14 | Nec Corp | Iii族窒化物半導体基板 |
| US7419892B2 (en) * | 2005-12-13 | 2008-09-02 | Cree, Inc. | Semiconductor devices including implanted regions and protective layers and methods of forming the same |
| JP2008098200A (ja) * | 2006-10-05 | 2008-04-24 | Kiyoyoshi Mizuno | 成膜体およびその製造方法 |
| US7961482B2 (en) * | 2007-05-09 | 2011-06-14 | International Rectifier Corporation | Bi-directional HEMT/GaN half-bridge circuit |
| JP2009032796A (ja) * | 2007-07-25 | 2009-02-12 | Rohm Co Ltd | 窒化物半導体素子および窒化物半導体素子の製造方法 |
| JP5134378B2 (ja) * | 2008-01-07 | 2013-01-30 | シャープ株式会社 | 電界効果トランジスタ |
| JP2009231395A (ja) * | 2008-03-19 | 2009-10-08 | Sumitomo Chemical Co Ltd | 半導体装置および半導体装置の製造方法 |
| US9711633B2 (en) * | 2008-05-09 | 2017-07-18 | Cree, Inc. | Methods of forming group III-nitride semiconductor devices including implanting ions directly into source and drain regions and annealing to activate the implanted ions |
| US7985986B2 (en) * | 2008-07-31 | 2011-07-26 | Cree, Inc. | Normally-off semiconductor devices |
| JP5510325B2 (ja) * | 2008-08-06 | 2014-06-04 | 日本電気株式会社 | 電界効果トランジスタ |
| US7898004B2 (en) * | 2008-12-10 | 2011-03-01 | Transphorm Inc. | Semiconductor heterostructure diodes |
| JP5306438B2 (ja) * | 2011-11-14 | 2013-10-02 | シャープ株式会社 | 電界効果トランジスタおよびその製造方法 |
| JP5662367B2 (ja) * | 2012-03-26 | 2015-01-28 | 株式会社東芝 | 窒化物半導体装置およびその製造方法 |
| JP6085442B2 (ja) | 2012-09-28 | 2017-02-22 | トランスフォーム・ジャパン株式会社 | 化合物半導体装置及びその製造方法 |
| JP2014072391A (ja) * | 2012-09-28 | 2014-04-21 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
| JP2014072388A (ja) * | 2012-09-28 | 2014-04-21 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
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2012
- 2012-09-28 JP JP2012217087A patent/JP6085442B2/ja not_active Expired - Fee Related
-
2013
- 2013-08-27 US US14/010,824 patent/US9425268B2/en active Active
- 2013-08-28 TW TW102130787A patent/TWI594431B/zh active
- 2013-09-26 CN CN201310445627.3A patent/CN103715252B/zh active Active
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2016
- 2016-08-19 US US15/242,226 patent/US9685338B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100044752A1 (en) * | 2008-08-22 | 2010-02-25 | Oki Electric Industry Co., Ltd. | Semiconductor device and manufacturing method |
| CN102237405A (zh) * | 2010-05-07 | 2011-11-09 | 富士通半导体股份有限公司 | 复合半导体器件及其制造方法 |
| TW201236082A (en) * | 2011-02-25 | 2012-09-01 | Fujitsu Ltd | Compound semiconductor device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US9425268B2 (en) | 2016-08-23 |
| US9685338B2 (en) | 2017-06-20 |
| CN103715252A (zh) | 2014-04-09 |
| US20140092637A1 (en) | 2014-04-03 |
| CN103715252B (zh) | 2016-09-14 |
| JP6085442B2 (ja) | 2017-02-22 |
| JP2014072360A (ja) | 2014-04-21 |
| TW201417286A (zh) | 2014-05-01 |
| US20160359033A1 (en) | 2016-12-08 |
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