TWI551925B - A conductive laminate, a transparent conductive laminate having a pattern wiring, and an optical device - Google Patents

A conductive laminate, a transparent conductive laminate having a pattern wiring, and an optical device Download PDF

Info

Publication number
TWI551925B
TWI551925B TW101121633A TW101121633A TWI551925B TW I551925 B TWI551925 B TW I551925B TW 101121633 A TW101121633 A TW 101121633A TW 101121633 A TW101121633 A TW 101121633A TW I551925 B TWI551925 B TW I551925B
Authority
TW
Taiwan
Prior art keywords
transparent conductive
film
transparent
thin film
laminate
Prior art date
Application number
TW101121633A
Other languages
English (en)
Chinese (zh)
Other versions
TW201305698A (zh
Inventor
Nozomi Fujino
Motoki Haishi
Koichiro Tada
Yoshimasa Sakata
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201305698A publication Critical patent/TW201305698A/zh
Application granted granted Critical
Publication of TWI551925B publication Critical patent/TWI551925B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584—Scratch resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00—Optical elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Physical Vapour Deposition (AREA)
  • Position Input By Displaying (AREA)
TW101121633A 2011-06-17 2012-06-15 A conductive laminate, a transparent conductive laminate having a pattern wiring, and an optical device TWI551925B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011135436A JP5473990B2 (ja) 2011-06-17 2011-06-17 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。

Publications (2)

Publication Number Publication Date
TW201305698A TW201305698A (zh) 2013-02-01
TWI551925B true TWI551925B (zh) 2016-10-01

Family

ID=47357173

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101121633A TWI551925B (zh) 2011-06-17 2012-06-15 A conductive laminate, a transparent conductive laminate having a pattern wiring, and an optical device
TW104113319A TW201530238A (zh) 2011-06-17 2012-06-15 導電性積層體、附有圖案配線之透明導電性積層體及光學裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104113319A TW201530238A (zh) 2011-06-17 2012-06-15 導電性積層體、附有圖案配線之透明導電性積層體及光學裝置

Country Status (7)

Country Link
US (1) US9674946B2 (enExample)
EP (1) EP2722853B1 (enExample)
JP (1) JP5473990B2 (enExample)
KR (5) KR102018414B1 (enExample)
CN (1) CN103608872B (enExample)
TW (2) TWI551925B (enExample)
WO (1) WO2012173192A1 (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5473990B2 (ja) 2011-06-17 2014-04-16 日東電工株式会社 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
JP2014164882A (ja) * 2013-02-22 2014-09-08 Dainippon Printing Co Ltd 信頼性・加工性に優れた積層体およびフィルムセンサ並びに積層体製造方法
JP3183365U (ja) * 2013-02-25 2013-05-16 ファナック株式会社 工作機械の回転テーブル
JP6207846B2 (ja) 2013-03-04 2017-10-04 富士フイルム株式会社 透明導電性フィルムおよびタッチパネル
JP2014194720A (ja) * 2013-03-29 2014-10-09 Dainippon Printing Co Ltd タッチパネルセンサ、タッチパネルモジュールおよびタッチパネルセンサの製造方法
KR20140122338A (ko) 2013-04-09 2014-10-20 쓰리엠 이노베이티브 프로퍼티즈 캄파니 터치패널, 그 제조방법 및 터치패널용 Ag-Pd-Nd 합금
JP6275961B2 (ja) 2013-06-26 2018-02-07 富士フイルム株式会社 光学フィルム及び表示装置
CN104253165A (zh) * 2013-06-27 2014-12-31 海洋王照明科技股份有限公司 太阳能电池器件及其制备方法
US10338706B2 (en) * 2013-11-27 2019-07-02 Lg Chem, Ltd. Conductive structure body precursor, conductive structure body and method for manufacturing the same
JP5917480B2 (ja) * 2013-12-09 2016-05-18 アルプス電気株式会社 静電センサ
JP5848786B2 (ja) * 2014-02-04 2016-01-27 日東電工株式会社 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
WO2015166963A1 (ja) * 2014-04-30 2015-11-05 日東電工株式会社 透明導電性フィルム及びその製造方法
CN106460153B (zh) * 2014-04-30 2019-05-10 日东电工株式会社 透明导电性膜及其制造方法
JP6211557B2 (ja) * 2014-04-30 2017-10-11 日東電工株式会社 透明導電性フィルム及びその製造方法
TWI595507B (zh) * 2014-06-18 2017-08-11 Geomatec Co Ltd Laminates, methods of making the same, and electronic machines
KR102422911B1 (ko) * 2014-06-30 2022-07-21 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 기판, 적층 도전성 기판, 도전성 기판 제조방법 및 적층 도전성 기판 제조방법
CN107112073B (zh) * 2014-12-26 2020-09-01 国立研究开发法人产业技术综合研究所 柔性导电膜及其制造方法
JP5976970B1 (ja) * 2015-02-24 2016-08-24 日東電工株式会社 光透過性フィルム
JP6607918B2 (ja) * 2015-02-25 2019-11-20 株式会社Ｖｔｓタッチセンサー タッチパネル用導電性積層体
US10353497B2 (en) * 2015-03-04 2019-07-16 Kaneka Corporation Substrate with conductive layers, substrate with touch-panel transparent electrodes, and method for fabricating same
KR101999706B1 (ko) * 2015-03-16 2019-07-12 주식회사 엘지화학 전도성 구조체 및 이를 포함하는 전자 소자
WO2016171097A1 (ja) * 2015-04-24 2016-10-27 株式会社アルバック 透明導電性基板及びその製造方法、並びに、透明導電性基板の製造装置
KR102367249B1 (ko) * 2015-07-28 2022-02-25 삼성디스플레이 주식회사 플렉서블 터치 패널 및 플렉서블 터치 패널의 제조 방법
CN107850965B (zh) * 2015-07-31 2021-01-29 住友金属矿山股份有限公司 导电性基板、导电性基板的制造方法
JP6600550B2 (ja) * 2015-12-16 2019-10-30 日東電工株式会社 金属層積層透明導電性フィルムおよびそれを用いたタッチセンサ
JP6617607B2 (ja) * 2016-02-29 2019-12-11 住友金属鉱山株式会社 成膜方法及びこれを用いた積層体基板の製造方法
KR102159491B1 (ko) * 2016-05-09 2020-09-24 주식회사 엘지화학 도전성 투광 필름
WO2018094639A1 (en) * 2016-11-24 2018-05-31 Boe Technology Group Co., Ltd. Flexible touch panel, flexible display panel and flexible display apparatus, and fabricating method thereof
CN109426397B (zh) * 2017-08-22 2020-08-04 京东方科技集团股份有限公司 触控结构的制备方法、触控结构
CN110096169B (zh) 2018-01-30 2021-01-22 京东方科技集团股份有限公司 触控基板及其制造方法、电子装置
JP7129830B2 (ja) * 2018-06-19 2022-09-02 日東電工株式会社 樹脂フィルム、導電性フィルム及び積層フィルムの製造方法
JP7114446B2 (ja) * 2018-11-28 2022-08-08 日東電工株式会社 導電性フィルム、および、そのパターニング方法
KR102503909B1 (ko) 2020-02-03 2023-02-24 닛토덴코 가부시키가이샤 투명 도전층, 투명 도전성 시트, 터치 센서, 조광 소자, 광전 변환 소자, 열선 제어 부재, 안테나, 전자파 실드 부재 및 화상 표시 장치
KR102655699B1 (ko) * 2020-02-20 2024-04-08 동우 화인켐 주식회사 안테나 적층체 및 이를 포함하는 디스플레이 장치
KR102750598B1 (ko) * 2020-02-10 2025-01-06 동우 화인켐 주식회사 안테나 적층체 및 이를 포함하는 디스플레이 장치
CN113258274B (zh) 2020-02-10 2025-06-06 东友精细化工有限公司 天线堆叠结构和包括天线堆叠结构的显示装置
JP2021137993A (ja) * 2020-03-03 2021-09-16 デクセリアルズ株式会社 導電性積層体及びこれを用いた光学装置、導電性積層体の製造方法
TWI824213B (zh) 2020-12-19 2023-12-01 逢甲大學 可撓式透明導電複合膜及其製造方法
WO2022205083A1 (zh) 2021-03-31 2022-10-06 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置
CN114400243A (zh) * 2022-01-04 2022-04-26 苏州清越光电科技股份有限公司 一种引线及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102928A (ja) * 1986-10-20 1988-05-07 グンゼ株式会社 金属膜積層体
CN1525912A (zh) * 2001-05-09 2004-09-01 Cp���ֹ�˾ 铟锡氧化物的透明导电层状镀层
JP2010061942A (ja) * 2008-09-03 2010-03-18 Toppan Printing Co Ltd 透明導電性フィルムおよびタッチパネル
TW201112272A (en) * 2009-07-31 2011-04-01 Nissha Printing Transparent conductive film having superior laminating suitability and touch panel using the same
TW201111175A (en) * 2007-01-18 2011-04-01 Nitto Denko Corp Transparent conductive film, method for production thereof and touch panel therewith

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63113585A (ja) 1986-10-06 1988-05-18 アンダス・コーポレイション 透明電極ならびにその製法および用途
JPH0843841A (ja) * 1994-07-27 1996-02-16 Toppan Printing Co Ltd 透明導電膜の形成方法
JPH11335815A (ja) * 1998-05-20 1999-12-07 Nippon Sheet Glass Co Ltd 透明導電膜付き基板および成膜装置
JP4438381B2 (ja) * 2003-11-05 2010-03-24 株式会社ブリヂストン 結晶性ｉｔｏ膜、ｉｔｏ膜の結晶化方法、透明導電性フィルム、タッチパネル及び色素増感型太陽電池
JP2005244083A (ja) * 2004-02-27 2005-09-08 Hayashi Junyaku Kogyo Kk 導電膜用エッチング液組成物
JP2005268616A (ja) 2004-03-19 2005-09-29 Tosoh Corp 透明導電膜およびその製造方法
JP4528651B2 (ja) * 2005-03-01 2010-08-18 日東電工株式会社 透明導電性フィルムおよびタッチパネル
JP4804867B2 (ja) * 2005-10-18 2011-11-02 出光興産株式会社 透明導電膜、透明電極、電極基板及びその製造方法
KR101141868B1 (ko) 2005-09-01 2012-05-11 이데미쓰 고산 가부시키가이샤 스퍼터링 타겟, 투명 도전막 및 투명 전극
JP5101038B2 (ja) * 2006-05-19 2012-12-19 株式会社フジクラ 電極基板の製造方法、電極基板の評価方法
JP4721359B2 (ja) 2006-09-12 2011-07-13 日東電工株式会社 透明導電性積層体及びそれを備えたタッチパネル
JP4821670B2 (ja) * 2007-03-26 2011-11-24 旭硝子株式会社 補助配線付き電極基体の製造方法
JP2009093911A (ja) 2007-10-09 2009-04-30 Panasonic Corp 透明電極及び透明電極を備えた表示装置
KR101000057B1 (ko) 2008-02-04 2010-12-10 엘지전자 주식회사 다층 투명전도층을 구비한 태양전지 이의 제조방법
JP4931858B2 (ja) * 2008-05-13 2012-05-16 パナソニック株式会社 有機エレクトロルミネッセント素子の製造方法
US8269744B2 (en) * 2008-09-05 2012-09-18 Mitsubishi Electric Corporation Touch screen, touch panel and display device
JP2010212085A (ja) 2009-03-10 2010-09-24 Toppan Printing Co Ltd 透明導電薄膜
JP5556436B2 (ja) * 2009-10-13 2014-07-23 東洋紡株式会社 透明導電性積層フィルム及び透明導電性積層シート並びにタッチパネル
JP2011154442A (ja) * 2010-01-26 2011-08-11 Sony Corp センサ素子及び表示装置
JP5473990B2 (ja) 2011-06-17 2014-04-16 日東電工株式会社 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102928A (ja) * 1986-10-20 1988-05-07 グンゼ株式会社 金属膜積層体
CN1525912A (zh) * 2001-05-09 2004-09-01 Cp���ֹ�˾ 铟锡氧化物的透明导电层状镀层
TW201111175A (en) * 2007-01-18 2011-04-01 Nitto Denko Corp Transparent conductive film, method for production thereof and touch panel therewith
JP2010061942A (ja) * 2008-09-03 2010-03-18 Toppan Printing Co Ltd 透明導電性フィルムおよびタッチパネル
TW201112272A (en) * 2009-07-31 2011-04-01 Nissha Printing Transparent conductive film having superior laminating suitability and touch panel using the same

Also Published As

Publication number Publication date
KR20190103489A (ko) 2019-09-04
TW201305698A (zh) 2013-02-01
KR20180032695A (ko) 2018-03-30
KR20140009493A (ko) 2014-01-22
TW201530238A (zh) 2015-08-01
KR102018414B1 (ko) 2019-09-04
WO2012173192A1 (ja) 2012-12-20
US20140102764A1 (en) 2014-04-17
CN103608872A (zh) 2014-02-26
JP5473990B2 (ja) 2014-04-16
US9674946B2 (en) 2017-06-06
KR20200078719A (ko) 2020-07-01
CN103608872B (zh) 2017-12-26
KR20160005139A (ko) 2016-01-13
EP2722853B1 (en) 2018-08-22
EP2722853A1 (en) 2014-04-23
EP2722853A4 (en) 2015-02-25
JP2013001009A (ja) 2013-01-07

Similar Documents

Publication Publication Date Title
TW201305698A (zh) 導電性積層體、附有圖案配線之透明導電性積層體及光學裝置
TWI480898B (zh) Production method of conductive laminated film
KR20180095549A (ko) 금속층 적층 투명 도전성 필름 및 그것을 사용한 터치 센서
TWI550463B (zh) 導電膜及其製造方法
TW201606594A (zh) 導電性結構體及其製造方法以及顯示裝置
TWI553523B (zh) 導電結構體前驅物、導電結構體及其製造方法、及觸控式螢幕面板
TW201512958A (zh) 觸感電極及觸控螢幕面板
JP5848786B2 (ja) 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
JP4971618B2 (ja) 表示用電極パターン製造方法
JP7114446B2 (ja) 導電性フィルム、および、そのパターニング方法
TW201446981A (zh) 觸控面板，其製備方法及用於觸控面板之銀－鈀－釹（ａｇ－ｐｄ－ｎｄ）合金
JP6096869B2 (ja) 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス
JP2012150944A (ja) 透明導電膜
KR20160069823A (ko) 전도성 구조체 및 이의 제조방법
JP2018170360A (ja) 導電膜，電極，電子機器，静電容量型入力装置及び電極の製造方法
JP2017134884A (ja) 透明導電体の製造方法
CN107407993A (zh) 传导性结构及其制造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees