JP5473990B2 - 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。 - Google Patents

導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。 Download PDF

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Publication number
JP5473990B2
JP5473990B2 JP2011135436A JP2011135436A JP5473990B2 JP 5473990 B2 JP5473990 B2 JP 5473990B2 JP 2011135436 A JP2011135436 A JP 2011135436A JP 2011135436 A JP2011135436 A JP 2011135436A JP 5473990 B2 JP5473990 B2 JP 5473990B2
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Japan
Prior art keywords
transparent conductive
thin film
conductive thin
laminate
transparent
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Application number
JP2011135436A
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English (en)
Japanese (ja)
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JP2013001009A5 (enExample
JP2013001009A (ja
Inventor
望 藤野
基希 拝師
義昌 坂田
光一郎 多田
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Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2011135436A priority Critical patent/JP5473990B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to KR1020197025318A priority patent/KR20190103489A/ko
Priority to KR1020187008395A priority patent/KR20180032695A/ko
Priority to KR1020207018480A priority patent/KR20200078719A/ko
Priority to KR1020137030243A priority patent/KR20140009493A/ko
Priority to CN201280029923.9A priority patent/CN103608872B/zh
Priority to US14/126,278 priority patent/US9674946B2/en
Priority to KR1020157036691A priority patent/KR102018414B1/ko
Priority to EP12800306.8A priority patent/EP2722853B1/en
Priority to PCT/JP2012/065253 priority patent/WO2012173192A1/ja
Priority to TW104113319A priority patent/TW201530238A/zh
Priority to TW101121633A priority patent/TWI551925B/zh
Publication of JP2013001009A publication Critical patent/JP2013001009A/ja
Publication of JP2013001009A5 publication Critical patent/JP2013001009A5/ja
Application granted granted Critical
Publication of JP5473990B2 publication Critical patent/JP5473990B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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    • B32—LAYERED PRODUCTS
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    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584—Scratch resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00—Optical elements
    • G—PHYSICS
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    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/00—Stock material or miscellaneous articles
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    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Physical Vapour Deposition (AREA)
  • Position Input By Displaying (AREA)
JP2011135436A 2011-06-17 2011-06-17 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。 Active JP5473990B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2011135436A JP5473990B2 (ja) 2011-06-17 2011-06-17 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
KR1020157036691A KR102018414B1 (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020207018480A KR20200078719A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
KR1020137030243A KR20140009493A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
CN201280029923.9A CN103608872B (zh) 2011-06-17 2012-06-14 导电性层叠体、带图案布线的透明导电性层叠体、以及光学器件
US14/126,278 US9674946B2 (en) 2011-06-17 2012-06-14 Conductive laminate, transparent conductive laminate with patterned wiring, and optical device
KR1020197025318A KR20190103489A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
EP12800306.8A EP2722853B1 (en) 2011-06-17 2012-06-14 Conductive laminate, transparent conductive laminate with patterned wiring, and optical device
PCT/JP2012/065253 WO2012173192A1 (ja) 2011-06-17 2012-06-14 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス
KR1020187008395A KR20180032695A (ko) 2011-06-17 2012-06-14 도전성 적층체, 패턴 배선이 형성된 투명 도전성 적층체, 및 광학 디바이스
TW104113319A TW201530238A (zh) 2011-06-17 2012-06-15 導電性積層體、附有圖案配線之透明導電性積層體及光學裝置
TW101121633A TWI551925B (zh) 2011-06-17 2012-06-15 A conductive laminate, a transparent conductive laminate having a pattern wiring, and an optical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011135436A JP5473990B2 (ja) 2011-06-17 2011-06-17 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014019196A Division JP5848786B2 (ja) 2014-02-04 2014-02-04 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。

Publications (3)

Publication Number Publication Date
JP2013001009A JP2013001009A (ja) 2013-01-07
JP2013001009A5 JP2013001009A5 (enExample) 2013-11-14
JP5473990B2 true JP5473990B2 (ja) 2014-04-16

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JP2011135436A Active JP5473990B2 (ja) 2011-06-17 2011-06-17 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。

Country Status (7)

Country Link
US (1) US9674946B2 (enExample)
EP (1) EP2722853B1 (enExample)
JP (1) JP5473990B2 (enExample)
KR (5) KR20190103489A (enExample)
CN (1) CN103608872B (enExample)
TW (2) TWI551925B (enExample)
WO (1) WO2012173192A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014130825A (ja) * 2014-02-04 2014-07-10 Nitto Denko Corp 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
US9674946B2 (en) 2011-06-17 2017-06-06 Nitto Denko Corporation Conductive laminate, transparent conductive laminate with patterned wiring, and optical device

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014164882A (ja) * 2013-02-22 2014-09-08 Dainippon Printing Co Ltd 信頼性・加工性に優れた積層体およびフィルムセンサ並びに積層体製造方法
JP3183365U (ja) * 2013-02-25 2013-05-16 ファナック株式会社 工作機械の回転テーブル
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