201112272 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種使用於觸控面板等之透明導電性薄膜 及使用其之觸控面板者。 【先前技術】 先前已知一種透明導電性薄膜，其係具備薄膜基材 '在 該薄膜基材之單面上所形成之由透明導電膜所構成的透明電 極圖案、及供圍繞佈線於經形成該透明電極圖案之薄膜基材 上之周緣部並與該透明電極圖案之端部相連接、且由比該透 明導電膜爲低電阻之材料所構成的厚膜電路圖案（參閱發明 專利文獻1 )。 而且，一種配置觸控面板之可攜式資訊裝置正被廣泛使 用，配置於此等觸控面板通常是使用電阻膜方式者。電阻膜 方式之觸控面板是以特定間隔對置經形成透明導電膜之兩片 透明導電基板所構成者，可僅在經以指頭、筆尖等所接觸之 部份使得兩片透明電極基板接觸而作爲開關來動作，以執行 例如選擇顯示器畫面上之選項單或輸入書寫文字等。在該觸 控面板中，則將如前所述構成之透明導電性薄膜用作爲透明 導電基板且藉由貼合周緣部來實現比較簡易的構成。貼合是 使用壓敏性黏著劑層，且如前所述厚膜電路圖案的形成區域 也以此壓敏性黏著劑層加以被覆。 此外，近年來配置於可攜式資訊裝置之觸控面板也普及 一種使用靜電電容方式者，且其趨勢有凌駕電阻膜方式的情 況。在靜電電容方式之觸控面板也是使用如前所述構成之透 -4- 201112272 明導電性薄膜，但是在此情況，則將透明導電性薄膜全面性 地貼合於透明基材上。 〔先前技術文獻〕 (發明專利文獻） 發明專利文獻1 :日本發明專利特開第2006-059720號 公報 【發明內容】 〔所欲解決之技術問題〕 然而，在厚膜電路圖案的形成區域，卻在厚膜電路圖案 與其鄰接部份之間造成厚膜電路圖案厚度份之階梯差。因此 ，當以壓敏性黏著劑層被覆厚膜電路圖案的形成區域來獲得 觸控面板時，則壓敏性黏著劑層會由於該階梯差而在與厚膜 電路圖案的側壁之間伴入空氣，且產生氣泡。氣泡是即使經 一面加壓一面貼合也只是沿著厚膜電路圖案的側壁移動而不 至於消滅，以致氣泡將仍然殘留於厚膜電路圖案的彎曲部份 等而造成如下所述問題。 首先，當該氣泡經時性地例如在觸控面板之保管、輸送 時等由於被按壓而聚集，則將導致例如在觸控面板之外表面 發生膨脹起泡等外觀不良的不良影響。 此外，由於氣泡所存在的部份是壓敏性黏著劑層並未黏 著，以致貼合力則隨著於其狀態而降低。 更進一步，在氣泡存在的部份之厚膜電路圖案容易發生 由於氧化而導致劣化。加上，在數條厚膜電路圖案是平行配 線的情況，若氣泡存在於厚膜電路圖案彼此之間時，則也有 201112272 可能會導致通過該氣泡而發生短路的顧慮。 並且，在觸控面板爲靜電電容方式的情況，由於透明導 電性薄膜不僅是厚膜電路圖案的形成區域也會被貼合於透明 電極圖案形成區域，當在厚膜電路圖案的形成區域所產生的 氣泡經時性地移動至透明電極圖案形成區域時，則也將會造 成不易通過觸控面板來視認背後之顯示器的問題。 本發明是爲解決如上所述技術問題所達成者，其目的爲 提供一種可在貼合時不至於產生氣泡，亦即，貼合合適性優 異之透明導電性薄膜及使用其之觸控面板。 〔解決問題之技術方法〕 本發明爲解決如上所述技術性問題而提供一種具有下列 構成之貼合合適性優異之透明導電性薄膜及使用其之觸控面 板。 本發明之第一模式是提供一種貼合合適性優異之透明導 電性薄膜，其係具備薄膜基材、在該薄膜基材之單面上所形 成之由透明導電膜所構成的透明電極圖案、及供圍繞佈線於 經形成該透明電極圖案之薄膜基材上之周緣部並與該透明電 極圖案之端部相連接、且爲由比該透明導電膜爲低電阻之材 料所構成的厚膜電路圖案，並且該厚膜電路圖案之膜厚爲 0.05至100/zm、且至少將一側的線緣（iine-edge)形成爲 鋸齒狀形狀。 此外，本發明之第二模式是提供一種如第一模式之貼合 合適性優異之透明導電性薄膜，其中該鋸齒狀形狀之凸部波 峰至鄰接的凸部波峰之距離爲1〇至600//m。 201112272 此外’本發明之第三模式是提供一種如第二模式之貼合 合適性優異之透明導電性薄膜，其中該鋸齒狀形狀之凸部波 « 峰與凹部波峰之差値爲2至50ym。 此外’本發明之第四模式是提供一種如第一模式之貼合 合適性優異之透明導電性薄膜，其中該鋸齒狀形狀是複雜的 結構。 此外’本發明之第五模式是提供一種如第四模式之貼合 合適性優異之透明導電性薄膜，其中該鋸齒狀形狀是更複雜 且呈碎形圖形狀。 此外，本發明之第六模式是提供一種如第一模式之貼合 合適性優異之透明導電性薄膜，其中該厚膜電路圖案是由導 電性糊所形成。 此外，本發明之第七模式是提供一種如第一模式之貼合 合適性優異之透明導電性薄膜，其中該厚膜電路圖案是具有 兩條以上平行配線之區域，且平行配線之該厚膜電路圖案的 間隔爲1 〇至6 0 # m。 此外，本發明之第八模式是提供一種如第一模式之貼合 合適性優異之透明導電性薄膜，其係更進一步在該薄膜基材 與該厚膜電路圖案之間配置由該透明電極圖案所延伸出之由 透明導電膜所構成的電路圖案。 此外，本發明之第九模式是提供一種如第一模式之貼合 合適性優異之透明導電性薄膜，其係更進一步以至少可覆蓋 該厚膜電路圖案的形成區域之狀態來配置壓敏性黏著劑層。 此外，本發明之第十模式是提供一種觸控面板，其特徵 201112272 爲使用第一至九模式之透明導電性薄膜。 〔發明之功效〕 若根據本發明，則由於厚膜電路圖案的線緣是形成爲鋸 齒狀形狀，即使在以壓敏性黏著劑層被覆厚膜電路圖案的形 成區域時，壓敏性黏著劑層不會由於該階梯差而在與厚膜電 路圖案的側壁之間伴入空氣且產生氣泡。其係由於故意使厚 膜電路圖案的側壁製成爲粗糙，使得空氣容易經由該粗面之 凹凸所構成的微細間隙通過而漏出所然。此外，由於未能漏 出之空氣也會微細地分散存在於如前所述微細的間隙’因此 不構成氣泡。 因此，由於氣泡並未存在，不導致在觸控面板之外表面 造成膨脹起泡等外觀不良的不良影響。 此外，由於氣泡並未存在，與其說是壓敏性黏著劑層將 可牢固地黏著使得貼合力不降低，不如說是厚膜電路圖案的 側壁之凹凸將可使得壓敏性黏著劑層發揮增黏功效（ anchoring effect)，即使由於觸控面板在使用時之彎曲、在 高溫高濕環境下的觸控面板之翹曲，但是透明導電性薄膜仍 可獲得不剝離之強固貼合力。 並且，由於氣泡並未存在，在厚膜電路圖案不易發生由 於氧化而導致劣化。加上，即使在平行配線數條厚膜電路圖 案的情況，在厚膜電路圖案彼此之間並無發生短路的顧慮。 並且，在觸控面板爲靜電電容方式的情況，由於未存在 移動至透明電極圖案形成區域之氣泡，也無造成不易通過觸 控面板來視認背後之顯示器的問題。 201112272 【實施方式】 〔本發明之最佳實施方式〕 其次，就發明之實施方式參閱圖式來加以說明。 第1圖之本發明之透明導電性薄膜1是在薄膜基材62 之單面形成由透明導電膜所構成的透明電極圖案61，在經形 成透明電極圖案61的薄膜基材62上之周緣部，則配線佈置 複數之厚膜電路圖案60且與透明電極圖案61之端部相連接 〇 「薄膜基材62」之材質是包括：聚對苯二甲酸乙二醇酯 、聚乙烯、聚丙烯、環狀聚烯烴、聚氯乙烯、聚偏二氯乙烯 、聚甲基丙烯酸甲酯、聚丙烯酸甲酯、聚苯乙烯、硝化纖維 素、三乙醯基纖維素、聚碳酸酯、聚對苯二甲酸二甲基環己 烷酯、ABS樹脂、聚醯胺、聚醯亞胺、聚醚颯 '聚楓、聚乙 烯基縮醛、聚醚酮、聚胺基甲酸酯、此等樹脂之共聚物樹脂 、及此等樹脂之混合樹脂等。 「透明電極圖案61」是以透明導電膜所構成，其材質是 除了銦氧化物、錫氧化物、銦錫氧化物、鋅氧化物' 鋁辞氧 化物等之透明氧化物等以外，也包括噻吩系等之透明導電高 分子等。 厚膜電路圖案60是使用比如前所述透明導電膜爲低電 阻之材料。例如，由黏結劑樹脂與導電性材料所構成的導電 糊層或由導電性材料單體所構成的薄膜層。黏結劑樹脂是包 括：丙烯酸系、聚酯、聚胺基甲酸酯、聚氯乙烯等樹脂。厚 膜電路圖案60是除了網版印刷、凹版印刷' 平版印刷以外 201112272 ，則藉由塗佈或噴墨式等方法形成預定的圖案，或也可藉由 此等方法形成全面性圖案（solid pattern )後以圖案成形。 「導電性材料」是除了銀、金、銅、鈀等金屬粉或金屬 粒子、金屬奈米粒子以外，也包括碳奈米纖維、金屬奈米線 等導電性奈米纖維等。 厚膜電路圖案60之厚度是可在0.05至100//m之範圍 適當地設定。若厚度爲薄於0.05# m時，則不易獲得作爲佈 線電路所應具備的導電性，若厚度爲厚於l〇〇/zm時，則不 易形成薄膜。 本發明之特徵爲將厚膜電路圖案60之至少一側的線緣 形成爲鋸齒狀形狀以獲得優異的貼合合適性（參閱第2圖、 第8圖）。亦即，由於厚膜電路圖案60的線緣是形成爲鋸 齒狀形狀，即使在以壓敏性黏著劑層64被覆厚膜電路圖案 60的形成區域時，則壓敏性黏著劑層64不至於發生由於該 階梯差而在與厚膜電路圖案60的側壁之間伴入空氣，因此 不會產生氣泡。其係由於故意使得厚膜電路圖案60的側壁 60 a製成爲粗糙，使得空氣容易經由該粗面之凹凸所構成的 微細間隙通過而漏出所然。此外，由於未能漏出之空氣也會 微細地分散存在於該微細的間隙中，因此不構成氣泡。 傳統上，厚膜電路圖案是將線緣（亦即，厚膜電路圖案 的側壁）形成爲平滑。其係由於更平滑者，則可更靠近而形 成複數厚膜電路圖案以圖謀高精細化的緣故。實際上，在此 方面則一直在進行如何始能達成線緣平滑化之技術競爭。與 此相對，在本發明中，則以相反的構想，故意使得線緣爲比 -10- 201112272 一般者爲粗’而意圖藉由形成爲鋸齒狀形狀來達成如前段落 所述之功效。 如前所述之鋸齒狀形狀較佳爲凸部波峰至鄰接的凸部波 峰之距離爲在10至600ym之範圍來形成（參閱第2圖）。 若爲小於l〇#m時’則不易形成凹凸；若爲超過6〇〇vm時 ’則無法獲得充分的貼合合適性。因此，更佳爲2 0至3 0 0 # m。進一步更佳爲4G至150/zm。 此外’鋸齒狀形狀較佳爲凸部波峰至鄰接的凸部波峰之 距離爲在10至600 # m之範圍，而且凸部波峰與凹部波峰之 差値爲在2至50/z m之範圍來形成（參閱第2圖）。若凸部 波峰與凹部波峰之差値爲小於2yin時，則無法獲得充分的 貼合合適性；若凸部波峰與凹部波峰之差値爲超過50;/m時 ’則不易縮小平行配線之厚膜電路圖案間之間隔（狹邊框化 )。因此’更佳爲凸部波峰與凹部波峰之差値爲3至25ym ’進一步更佳爲凸部波峰與凹部波峰之差値爲5至15//m。 此外’鋸齒狀形狀是以具有複雜的結構者對於壓敏性黏 著劑層64具有優異的增黏功效。亦即，由於使得凹凸之大 小或突出方向零亂不均勻，即使觸控面板在使用時之彎曲、 在高濕高濕環境下觸控面板之翹曲等情況，由於施力的情況 有各種變化，也可分別加以對應。相對於此，若鋸齒狀形狀 爲均勻時，則視施力之方式而定，對於增黏功效將會造成偏 差。 此外’形成爲鋸齒狀形狀之如前所述線緣的形狀，也可 爲更複雜而呈碎形圖形狀，亦即，可爲擴大鋸齒狀之表面時 -11 - 201112272 ，則將更進一步爲呈鋸齒狀之結構。因此，將可更進一步地 提高增黏功效。 如前所述厚膜電路圖案60是具有兩條以上平行配線之 區域（參閱第1至3圖），且平行配線之該厚膜電路圖案60 之間隔5爲10至60 m »若間隔5爲小於10 y m時，則壓 敏性黏著劑層64將不易進入於厚膜電路圖案60之間；若間 隔5爲超過6 0 " m時，則將不易狹邊框化。此外，在本說明 書中，所謂「間隔5」是意謂最爲突出的凸部彼此之間。 更進一步，如第4圖所示，在如前所述薄膜基材62與 如前所述厚膜電路圖案60之間，也可配置由如前所述透明 電極圖案61所延伸出之由透明導電膜所構成的電路圖案64 此外，透明導電性薄膜1也可預先以至少覆蓋如前所述 厚膜電路圖案60的形成區域之狀態而配置用於貼合之壓敏 性黏著劑（Pressure Sensitive Adhesives，PSA)層 64 (參閱 第5圖）。PSA層64之塗佈方法是可使用網版印刷、平版 印刷、凹版印刷、或膠版印刷（flex〇 printing )等慣用的印 刷法等。 使用如上所述透明導電性薄膜1即可獲得觸控面板1 ^ 所謂「觸控面板」是一種在不至於妨害LCD等畫面顯示下， 用於偵測究竟觸到何處之感測器。其可分成爲以電氣偵測所 觸到的位置者與不使用電氣者，而使用該透明導電性薄膜1 者是屬於電阻膜方式或靜電電容方式等以電氣偵測之方式。 例如，在電阻膜方式之觸控面板1 〇 〇的情況，則將兩片透明 -12- 201112272 導電性薄膜1僅以周緣部使其等黏著成透明電極彼此是隔著 空氣層而對置。當一觸到輸入面時，則薄膜由於壓力而彎曲 、使得透明電極彼此接觸而通電，因此藉由測定各透明電極 由於電阻之分壓比即可偵測出所觸到的位置（參閱第6圖） 。在另一方面，在靜電電容方式之觸控面板101的情況，則 係根據指尖與透明電極之間的靜電電容之變化來偵測位置者 ，因此採取使透明導電性薄膜1全面黏著於玻璃板之背面等 、或將兩片透明導電性薄膜1全面黏著成使得透明電極彼此 對置（參閱第7圖）。 《實施例》 〔實施例1〕 在作爲薄膜基材之厚度爲100/zm之經雙軸向延伸之聚 對苯二甲酸乙二醇酯薄膜之單面上，用濺鍍法形成由銦錫氧 化物所構成的透明導電膜，並移除不需要部份，以形成透明 電極圖案。 其次，在透明電極圖案上，以網版印刷使用銀糊（相對 於10重量份丙烯酸系樹脂爲3重量份之平均粒徑爲20μ m 之銀粉）且厚度爲7#m之框狀的全面性圖案來形成，移除 不需要部份，並形成使得兩側線緣爲不均勻的鋸齒狀形狀之 厚膜電路圖案連接於透明電極圖案，以獲得透明導電性薄膜 。'所形成厚膜電路圖案的線緣部份是鋸齒狀形狀之凸部波峰 至鄰接凸部波峰之距離平均爲lOO^m、凸部波峰與凹部波 峰之差値平均爲14/zm、平行配線之厚膜電路圖案彼此之間 隙爲約50ym(參閱第9圖、第1〇圖）。 201112272 最後，將兩片如上所述透明導電性薄膜以壓敏性黏著劑 層全面黏著成使得透明電極彼此對置，以獲得靜電電容方式 之觸控面板。 藉由如上所述所獲得觸控面板是在壓敏性黏著劑層與厚 膜電路圖案的側壁之間不會伴入空氣且產生氣泡者。而且即 使受到觸控面板在使用時之彎曲、在高溫高濕環境下的觸控 面板之翹曲，透明導電性薄膜也具有不剝離之強固的貼合力 〔實施例2〕 除了取代如前所述銀糊之銀粉而使用平均粒徑爲1 V m 之銀奈米膠質材料以外，其餘則以與實施例1相同的方式形 成厚膜電路圖案。在此情況下，與實施例1相比較，即使厚 膜電路圖案的線緣部份之鋸齒狀形狀之凸部波峰至鄰接的凸 部波峰之距離平均爲100/zm、凸部波峰與凹部波峰之差値 則已減少至平均爲5/zmC參閱第11圖、第12圖），但是 關於貼合仍能獲得充分的功效。 〔實施例3〕 除了取代如前所述銀糊而使用厚度爲1〇μιη之銅箔以外 ，其餘則以與實施例1相同的方式形成厚膜電路圖案。在此 情況下’與實施例1相比較，即使厚膜電路圖案的線緣部份 之鋸齒狀形狀之凸部波峰至鄰接的凸部波峰之距離已減少至 平均爲40/ztn、凸部波峰與凹部波峰之差値則已減少至平均 爲6ym(參閱第13圖、第Η圖）’但是關於貼合仍能獲 得充分的功效。 -14- 201112272 再者，藉由適當地組合如前所述各實施方式中之任意實 施方式，則可分別獲得各自所具有的功效。本發明雖然參閱 附加圖式而已詳細地揭述較佳的實施方式，但是對於熟習此 項技藝者明顯地尙可作各種變形或修正。但是，任何變形或 修正，只要其並未脫離本發明之申請專利範圍，則仍應該包 含在本發明之申請專利範圍內。 〔產業上之利用可能性〕 本發明是可使用於可攜式個人數位助理（PDA )、手提 式終端機等可攜式資訊終端機，影印機、傳真機等辦公室自 動化（OA)設備，智慧型電話機、可攜式電話、攜帶式遊戲 機、電子辭典、汽車駕駛導向系統、小型PC (個人電腦） 、各種家電用品等之用途，因此在產業上是有用者。 【圖式簡單說明】 第1圖是展示本發明之透明導電性薄膜的一實例平面圖 〇 第2圖是佈線於第1圖之透明導電性薄膜之厚膜電路圖 案的部份放大相片。 第3圖是展示本發明之透明導電性薄膜的一實例重要部 份放大截面圖。 第4圖是展示本發明之透明導電性薄膜的其他實例重要 部份放大截面圖。 第5圖是展示本發明之透明導電性薄膜的其他實例重要 部份放大截面圖。 第6圖是本發明之電阻膜方式之觸控面板的一實例分解 -15- 201112272 斜視圖。 第7圖是本發明之靜電電容方式之觸控面板的一實例分 解斜視圖。 第8圖是用於說明厚膜電路圖案之線緣的狀態模式圖。 第9圖是實施例1之厚膜電路圖案的部份放大相片。 第1〇圖是實施例1之厚膜電路圖案的部份放大相片。 第11圖是實施例2之厚膜電路圖案的部份放大相片。 $ 圖是實施例2之厚膜電路圖案的部份放大相片。 胃圖是實施例3之厚膜電路圖案的部份放大相片。 第14圖是實施例3之厚膜電路圖案的部份放大相片。 【主要元件符號說明】 1 透 明 導 電 性 薄 膜 5 厚 膜 電 路 圖 案 彼 此 間 之 間隙 60 厚 膜 電 路 圖 案 61 透 明 電 極 圖 案 62 薄 膜 基 材 63 由 透 明 導 電 膜 所 構 成 的 電路圖案 64 壓 敏 性 黏 著 劑 層 1 0〇 電 阻 膜 方 式 之 觸 控 面 板 101 靜 電 容 量 方 式 之 觸 控 面 板 -16 -[Technical Field] The present invention relates to a transparent conductive film used for a touch panel or the like and a touch panel using the same. [Prior Art] A transparent conductive film having a transparent electrode pattern formed of a transparent conductive film formed on one surface of the film substrate and a peripheral wiring formed thereon is known. A thick film circuit pattern in which a peripheral portion of the transparent electrode pattern is connected to an end portion of the transparent electrode pattern and has a low electrical resistance to the transparent conductive film (see Patent Document 1). Moreover, a portable information device equipped with a touch panel is widely used, and the touch panel is usually a resistive film. The resistive film type touch panel is formed by opposing two transparent conductive substrates forming a transparent conductive film at a specific interval, and the two transparent electrode substrates can be brought into contact only by a portion that is contacted by a finger, a pen tip or the like. Acting as a switch to perform, for example, selecting a menu on the display screen or inputting a written text or the like. In the touch panel, the transparent conductive film having the above-described configuration is used as a transparent conductive substrate, and a relatively simple structure is realized by bonding the peripheral portion. The bonding is performed by using a pressure-sensitive adhesive layer, and the formation region of the thick film circuit pattern is also covered with the pressure-sensitive adhesive layer as described above. In addition, in recent years, touch panels disposed in portable information devices have also become popular in a way of using electrostatic capacitance, and the trend is that they are superior to the resistive film method. In the capacitive touch panel, the conductive film is formed as described above, but in this case, the transparent conductive film is integrally bonded to the transparent substrate. [Prior Art Document] (Patent Literature) Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-059720 (Summary of the Invention) [Technical Problem to be Solved] However, in the formation region of a thick film circuit pattern, A step difference in thickness of the thick film circuit pattern is formed between the thick film circuit pattern and its adjacent portion. Therefore, when the touch panel is obtained by coating the formation region of the thick film circuit pattern with the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is accompanied by the sidewall of the thick film circuit pattern due to the step. Air and bubbles. The bubble is adhered to the side wall of the thick film circuit pattern even if it is pressed while being pressed, so that the bubble remains in the curved portion of the thick film circuit pattern and the like, causing the following problems. First, when the bubbles are accumulated by pressing, for example, during storage and transportation of the touch panel, for example, an adverse effect such as an appearance failure such as swelling and foaming on the outer surface of the touch panel may occur. Further, since the bubble is present, the pressure-sensitive adhesive layer is not adhered, so that the bonding force is lowered as it is in its state. Further, the thick film circuit pattern in the portion where the bubble exists is liable to cause deterioration due to oxidation. In addition, in the case where a plurality of thick film circuit patterns are parallel wiring, if bubbles exist between the thick film circuit patterns, there may be a concern that 201112272 may cause a short circuit by the air bubbles. Further, in the case where the touch panel is of the electrostatic capacitance type, the transparent conductive film is not only bonded to the transparent electrode pattern forming region but also formed in the formation region of the thick film circuit pattern. When the bubble moves to the transparent electrode pattern forming region with time, it also causes a problem that it is difficult to visually recognize the display behind the touch panel. The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a transparent conductive film which can be used for bonding without being formed into a bubble, that is, a touch-sensitive panel using the same. [Technical method for solving the problem] In order to solve the above-described technical problems, the present invention provides a transparent conductive film having excellent bonding suitability and a touch panel using the same. A first mode of the present invention provides a transparent conductive film having excellent adhesion and suitability, comprising a film substrate, a transparent electrode pattern formed of a transparent conductive film formed on one surface of the film substrate, And a thick film circuit pattern formed by a material surrounding the peripheral portion of the thin film substrate on which the transparent electrode pattern is formed and connected to the end portion of the transparent electrode pattern and having a low electrical resistance than the transparent conductive film And the film thickness of the thick film circuit pattern is 0.05 to 100/zm, and at least one side edge is formed into a zigzag shape. Further, a second mode of the present invention provides a transparent conductive film excellent in conformability as in the first mode, wherein a distance from a peak of the zigzag shape to a peak of the adjacent convex portion is from 1 600 to 600 / /m. Further, the third mode of the present invention provides a transparent conductive film excellent in conformability as in the second mode, wherein the difference between the peak of the zigzag shape and the peak of the concave portion is 2 to 50 μm. Further, the fourth mode of the present invention provides a transparent conductive film excellent in conformability as in the first mode, wherein the zigzag shape is a complicated structure. Further, the fifth mode of the present invention provides a transparent conductive film excellent in conformability as in the fourth mode, wherein the zigzag shape is more complicated and has a fractal shape. Further, a sixth mode of the present invention provides a transparent conductive film which is excellent in fit and suitability as in the first mode, wherein the thick film circuit pattern is formed of a conductive paste. Further, a seventh mode of the present invention provides a transparent conductive film excellent in bonding suitability as in the first mode, wherein the thick film circuit pattern is a region having two or more parallel wirings, and the thick film of the parallel wiring The circuit pattern spacing is from 1 6 to 60 0 m. Further, an eighth mode of the present invention provides a transparent conductive film which is excellent in fit and suitability in the first mode, and is further disposed between the film substrate and the thick film circuit pattern by the transparent electrode pattern. A circuit pattern composed of a transparent conductive film extended. Further, a ninth mode of the present invention provides a transparent conductive film which is excellent in adhesion suitability in the first mode, and which further configures pressure sensitivity in a state in which at least a formation region of the thick film circuit pattern can be covered. Adhesive layer. Further, a tenth mode of the present invention provides a touch panel characterized in that the 201112272 is a transparent conductive film using the first to ninth modes. [Effect of the Invention] According to the present invention, since the line edge of the thick film circuit pattern is formed in a zigzag shape, the pressure sensitive adhesive is applied even when a thick film circuit pattern is formed in a pressure sensitive adhesive layer. The layer does not entrap air and generate bubbles between the sidewalls of the thick film circuit pattern due to the step. This is because the side wall of the thick film circuit pattern is intentionally made rough, so that air easily leaks through the fine gap formed by the unevenness of the rough surface. Further, since the air which has not leaked is also finely dispersed in the fine gap as described above, it does not constitute a bubble. Therefore, since the air bubbles are not present, there is no adverse effect of appearance defects such as swelling and foaming on the outer surface of the touch panel. In addition, since the air bubbles are not present, the pressure-sensitive adhesive layer will be firmly adhered so that the bonding force is not lowered, and the unevenness of the side wall of the thick film circuit pattern will increase the pressure-sensitive adhesive layer. The anchoring effect, even if the touch panel is bent during use, and the touch panel is warped in a high-temperature and high-humidity environment, the transparent conductive film can obtain a strong adhesive force without peeling off. Further, since the air bubbles are not present, the thick film circuit pattern is less likely to cause deterioration due to oxidation. In addition, even in the case where a plurality of thick film circuit patterns are wired in parallel, there is no fear that a short circuit occurs between the thick film circuit patterns. Further, in the case where the touch panel is of the electrostatic capacitance type, since there is no bubble moving to the transparent electrode pattern forming region, there is no problem that it is difficult to visually recognize the display behind the touch panel. [Embodiment] [Best Embodiment of the Invention] Next, an embodiment of the invention will be described with reference to the drawings. In the transparent conductive film 1 of the present invention, the transparent electrode film 61 made of a transparent conductive film is formed on one surface of the film substrate 62, and the peripheral portion of the film substrate 62 on which the transparent electrode pattern 61 is formed is formed. Then, a plurality of thick film circuit patterns 60 are arranged and connected to the ends of the transparent electrode patterns 61. The material of the "film substrate 62" includes: polyethylene terephthalate, polyethylene, polypropylene, Cyclic polyolefin, polyvinyl chloride, polyvinylidene chloride, polymethyl methacrylate, polymethyl acrylate, polystyrene, nitrocellulose, triacetyl cellulose, polycarbonate, polyparaphenyl Dimethylcyclohexanecarboxylate, ABS resin, polyamine, polyimine, polyether 聚'poly maple, polyvinyl acetal, polyether ketone, polyurethane, copolymerization of these resins Resin, a mixed resin of these resins, and the like. The "transparent electrode pattern 61" is made of a transparent conductive film and is made of a thiophene in addition to a transparent oxide such as indium oxide, tin oxide, indium tin oxide, or zinc oxide 'aluminum oxide. A transparent conductive polymer or the like. The thick film circuit pattern 60 is a material which uses a lower resistance than the transparent conductive film as described above. For example, a conductive paste layer composed of a binder resin and a conductive material or a thin film layer composed of a single conductive material. The binder resin includes resins such as acrylic, polyester, polyurethane, and polyvinyl chloride. The thick film circuit pattern 60 is a predetermined pattern formed by a method such as coating or ink jet printing, except for screen printing or gravure printing lithography 201112272, or a comprehensive pattern can be formed by such a method. ) is formed in a pattern. The "conductive material" is a conductive nanofiber such as a carbon nanofiber or a metal nanowire, in addition to metal powder such as silver, gold, copper or palladium, metal particles or metal nanoparticles. The thickness of the thick film circuit pattern 60 can be appropriately set in the range of 0.05 to 100 / / m. When the thickness is thinner than 0.05# m, it is difficult to obtain conductivity as a wiring circuit, and if the thickness is thicker than l〇〇/zm, the film is not easily formed. The present invention is characterized in that the edge of at least one side of the thick film circuit pattern 60 is formed into a zigzag shape to obtain excellent fitting suitability (see Figs. 2 and 8). That is, since the line edge of the thick film circuit pattern 60 is formed in a zigzag shape, even when the formation region of the thick film circuit pattern 60 is covered with the pressure sensitive adhesive layer 64, the pressure sensitive adhesive layer 64 does not become Air is trapped between the side wall of the thick film circuit pattern 60 due to the step, and therefore no air bubbles are generated. This is because the side wall 60a of the thick film circuit pattern 60 is intentionally made rough, so that air easily leaks through the fine gap formed by the unevenness of the rough surface. Further, since the air that has not leaked is also finely dispersed in the fine gap, it does not constitute bubbles. Conventionally, a thick film circuit pattern has formed a line edge (i.e., a sidewall of a thick film circuit pattern) to be smooth. Since it is smoother, it is possible to form a plurality of thick film circuit patterns closer to each other in order to achieve high definition. In fact, in this respect, there has been a technical competition on how to achieve smoothing of the line edge. On the other hand, in the present invention, in the opposite sense, the line edge is intentionally made thicker than -10-201112272 and is intended to be formed into a zigzag shape to achieve the effect as described in the preceding paragraph. The zigzag shape as described above is preferably formed so that the distance from the peak of the convex portion to the peak of the adjacent convex portion is in the range of 10 to 600 μm (see Fig. 2). If it is less than l〇#m, it is difficult to form irregularities; if it is more than 6〇〇vm, it is not possible to obtain sufficient bonding suitability. Therefore, it is more preferably 2 0 to 3 0 0 # m. Further more preferably 4G to 150/zm. Further, the 'sawtooth shape is preferably such that the peak of the convex portion to the peak of the adjacent convex portion is in the range of 10 to 600 # m, and the difference between the peak of the convex portion and the peak of the concave portion is formed in the range of 2 to 50 / zm. (See Figure 2). If the difference between the peak of the convex portion and the peak of the concave portion is less than 2 yin, sufficient adhesion suitability cannot be obtained; if the difference between the peak of the convex portion and the peak of the concave portion is more than 50; / m is not easy to reduce the thickness of the parallel wiring The interval between the film circuit patterns (narrow frame). Therefore, it is more preferable that the difference between the peak of the convex portion and the peak of the concave portion is 3 to 25 μm. Further, it is more preferable that the difference between the peak of the convex portion and the peak of the concave portion is 5 to 15 / / m. Further, the 'serrated shape" has an excellent viscosity-increasing effect on the pressure-sensitive adhesive layer 64 in a complicated structure. That is, since the size or the protruding direction of the unevenness is uneven, even if the touch panel is bent during use, the warpage of the touch panel in a high-humidity and high-humidity environment, etc., there are various changes due to the force applied. They can also be mapped separately. On the other hand, when the zigzag shape is uniform, depending on the manner of the force application, the viscosity-increasing effect will be deviated. In addition, the shape of the wire edge formed as a zigzag shape may also be a more complicated and fractal shape, that is, when the surface of the jagged surface is enlarged -11 - 201112272, it will be further It has a zigzag structure. Therefore, the viscosity-increasing effect can be further improved. As described above, the thick film circuit pattern 60 is a region having two or more parallel wirings (see FIGS. 1 to 3), and the interval 5 of the thick film circuit pattern 60 of the parallel wiring is 10 to 60 m » if the interval 5 is When it is less than 10 ym, the pressure-sensitive adhesive layer 64 will not easily enter between the thick film circuit patterns 60; if the interval 5 is more than 60, the frame will not be easily narrowed. Further, in the present specification, the term "interval 5" means the convex portions which are most prominent. Further, as shown in FIG. 4, between the film substrate 62 and the thick film circuit pattern 60 as described above, the transparent electrode pattern 61 as described above may be disposed to be transparent. In addition, the transparent conductive film 1 may be provided with a pressure sensitive adhesive (Pressure Sensitive) for bonding in a state in which at least the formation region of the thick film circuit pattern 60 is covered as described above. Adhesives, PSA) layer 64 (see Figure 5). The coating method of the PSA layer 64 is a conventional printing method such as screen printing, lithography, gravure printing, or flex printing. The touch panel 1 can be obtained by using the transparent conductive film 1 as described above. The so-called "touch panel" is a sensor for detecting where it is touched without hindering the display of the LCD or the like. The transparent conductive film 1 can be divided into a resistive film method or a capacitive method to electrically detect the position touched by the electrical detection. For example, in the case of the resistive film type touch panel 1 两 , the two transparent -12-201112272 conductive films 1 are adhered to each other only by the peripheral portion so that the transparent electrodes face each other with the air layer interposed therebetween. When the input surface is touched, the film is bent by the pressure, and the transparent electrodes are brought into contact with each other to be energized. Therefore, the position of the transparent electrode can be detected by the voltage division ratio of the resistance (refer to FIG. 6). ). On the other hand, in the case of the capacitive touch panel 101, the position is detected based on the change in electrostatic capacitance between the fingertip and the transparent electrode, so that the transparent conductive film 1 is entirely adhered to the glass. The back surface of the board or the like or the two transparent conductive films 1 are entirely adhered such that the transparent electrodes face each other (see Fig. 7). EXAMPLES [Example 1] On one side of a biaxially stretched polyethylene terephthalate film having a thickness of 100/zm as a film substrate, by indium tin was formed by sputtering A transparent conductive film composed of an oxide and removing unnecessary portions to form a transparent electrode pattern. Next, on the transparent electrode pattern, a silver paste (3 parts by weight of silver powder having an average particle diameter of 20 μm with respect to 10 parts by weight of the acrylic resin) and a frame-like overall thickness of 7 #m were used for screen printing. A pattern is formed to remove unnecessary portions, and a thick film circuit pattern in which a zigzag shape in which both side edges are uneven is formed is connected to the transparent electrode pattern to obtain a transparent conductive film. 'The line edge portion of the thick film circuit pattern formed is that the distance from the peak of the convex portion to the peak of the adjacent convex portion is 100 μm on average, and the difference between the peak of the convex portion and the peak of the concave portion is 14/zm on average, and the parallel wiring The gap between the thick film circuit patterns is about 50 μm (see Fig. 9, Fig. 1). Finally, two transparent conductive films as described above are adhered to the pressure-sensitive adhesive layer so that the transparent electrodes face each other to obtain a capacitive touch panel. The touch panel obtained as described above is such that no air is trapped between the pressure-sensitive adhesive layer and the side wall of the thick film circuit pattern and bubbles are generated. Moreover, even if the touch panel is bent during use and warpage of the touch panel in a high-temperature and high-humidity environment, the transparent conductive film has a strong bonding force without peeling off [Example 2] except as described above. A thick film circuit pattern was formed in the same manner as in Example 1 except that a silver nanoparticle having an average particle diameter of 1 V m was used as the silver paste silver paste. In this case, compared with the first embodiment, even if the distance from the peak of the zigzag shape of the edge portion of the thick film circuit pattern to the peak of the adjacent convex portion is 100/zm on average, the peak of the convex portion and the peak of the concave portion are compared. The difference has been reduced to an average of 5/zmC (see Figure 11 and Figure 12), but the fit can still be fully effective. [Example 3] A thick film circuit pattern was formed in the same manner as in Example 1 except that a copper foil having a thickness of 1 μm was used instead of the silver paste as described above. In this case, the distance from the peak of the zigzag shape of the zigzag portion of the thick film circuit pattern to the peak of the adjacent convex portion has been reduced to an average of 40/ztn and the peak of the convex portion as compared with the first embodiment. The difference from the peak of the concave portion has been reduced to an average of 6 μm (see Figure 13, figure). However, sufficient effect can still be obtained with respect to the fit. Further, by appropriately combining any of the embodiments described above, the respective effects can be obtained. The present invention has been described in detail with reference to the preferred embodiments thereof. However, any modifications or variations are intended to be included within the scope of the present invention as long as they do not depart from the scope of the invention. [Industrial Utilization] The present invention is an office automation (OA) device that can be used for portable personal digital assistants (PDAs), portable terminal devices, and the like, photocopying machines, fax machines, and the like. It is useful in the industry for telephones, portable telephones, portable game consoles, electronic dictionaries, car driving guidance systems, small PCs (personal computers), and various household appliances. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an example of a transparent conductive film of the present invention. Fig. 2 is a partially enlarged photograph of a thick film circuit pattern of the transparent conductive film of Fig. 1. Fig. 3 is an enlarged cross-sectional view showing an important portion of an example of the transparent conductive film of the present invention. Fig. 4 is an enlarged cross-sectional view showing an important part of another example of the transparent conductive film of the present invention. Fig. 5 is an enlarged cross-sectional view showing an important part of another example of the transparent conductive film of the present invention. Fig. 6 is a perspective view showing an example of a resistive film type touch panel of the present invention -15-201112272. Fig. 7 is a perspective view showing an example of the electrostatic capacitance type touch panel of the present invention. Fig. 8 is a schematic view showing a state of a line edge of a thick film circuit pattern. Fig. 9 is a partially enlarged photograph of the thick film circuit pattern of the first embodiment. The first drawing is a partial enlarged photograph of the thick film circuit pattern of the first embodiment. Figure 11 is a partial enlarged photograph of the thick film circuit pattern of Example 2. $ is a partial enlarged photograph of the thick film circuit pattern of Example 2. The stomach map is a partial enlarged photograph of the thick film circuit pattern of Example 3. Figure 14 is a partially enlarged photograph of the thick film circuit pattern of Example 3. [Description of main component symbols] 1 Transparent conductive film 5 Thick film circuit pattern gap 60 Thick film circuit pattern 61 Transparent electrode pattern 62 Film substrate 63 Circuit pattern 64 made of transparent conductive film Pressure-sensitive adhesive layer 1 0 〇 Resistive film type touch panel 101 Electrostatic capacity type touch panel-16 -