WO2011013696A1 - Transparent conductive film with superior suitability for laminating, and touch panel using the same - Google Patents

Transparent conductive film with superior suitability for laminating, and touch panel using the same Download PDF

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Publication number
WO2011013696A1
WO2011013696A1 PCT/JP2010/062686 JP2010062686W WO2011013696A1 WO 2011013696 A1 WO2011013696 A1 WO 2011013696A1 JP 2010062686 W JP2010062686 W JP 2010062686W WO 2011013696 A1 WO2011013696 A1 WO 2011013696A1
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transparent conductive
conductive film
circuit pattern
thick film
film
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PCT/JP2010/062686
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French (fr)
Japanese (ja)
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肆矢健二
橋本孝夫
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日本写真印刷株式会社
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Publication of WO2011013696A1 publication Critical patent/WO2011013696A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Definitions

  • the present invention relates to a transparent conductive film used for a touch panel or the like and a touch panel using the same.
  • the film substrate, a transparent electrode pattern made of a transparent conductive film formed on one side of the film substrate, and the peripheral portion on the film substrate on which the transparent electrode pattern is formed are routed to the
  • a transparent conductive film including a thick film circuit pattern made of a material having a resistance lower than that of the transparent conductive film, which is connected to an end of the transparent electrode pattern see Patent Document 1.
  • a resistive film type touch panel consists of two transparent conductive substrates on which transparent conductive films are formed facing each other at a predetermined interval. Both transparent electrode substrates are in contact only with a part touched with a finger, pen, etc. It operates as a switch and can select menus on the display screen or input handwritten characters, for example.
  • a relatively simple configuration is realized by using the transparent conductive film having the above-described configuration as a transparent conductive substrate and laminating at the peripheral portion.
  • a pressure-sensitive adhesive layer is used for pasting, and the thick film circuit pattern forming region is also covered with the pressure-sensitive adhesive layer.
  • the capacitive type touch panel mounted on a portable information device has become widespread, and its momentum surpasses that of a resistive film type.
  • the transparent conductive film having the above-described configuration is used. In this case, the transparent conductive film is entirely bonded to the transparent substrate.
  • a step corresponding to the thickness of the thick film circuit pattern is generated between the thick film circuit pattern and its adjacent portion. Therefore, when a touch panel is obtained by covering the region where the thick film circuit pattern is formed with the pressure sensitive adhesive layer, the pressure sensitive adhesive layer has an air gap between the thick film circuit pattern and the side wall due to this step. , And bubbles are generated. Even if the bubbles are stuck together under pressure, they move only along the sidewalls of the thick film circuit pattern and do not disappear, leaving the bubbles remaining in the bent part of the thick film circuit pattern, resulting in the following problems. .
  • the pressure-sensitive adhesive layer is not adhered to the part where bubbles are present, and the bonding force decreases accordingly.
  • the thick film circuit pattern where bubbles are present is likely to be deteriorated by oxidation.
  • a plurality of thick film circuit patterns are running side by side, if bubbles exist between the thick film circuit patterns, a short circuit may occur via the bubbles.
  • the transparent conductive film is bonded not only to the thick film circuit pattern forming area but also to the transparent electrode pattern forming area.
  • the transparent electrode pattern formation region there also arises a problem that it is difficult to visually recognize the back display through the touch panel.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a transparent conductive film that does not generate bubbles at the time of bonding, that is, excellent in bonding suitability, and a touch panel using the same.
  • the present invention provides a transparent conductive film having the following constitution and excellent bonding suitability and a touch panel using the transparent conductive film.
  • a film substrate a transparent electrode pattern made of a transparent conductive film formed on one side of the film substrate, and a peripheral portion on the film substrate on which the transparent electrode pattern is formed
  • a thick film circuit pattern made of a material having a resistance lower than that of the transparent conductive film, which is routed and connected to an end portion of the transparent electrode pattern, wherein the thick film circuit pattern is
  • a transparent conductive film excellent in bonding suitability characterized in that it has a film thickness of 0.05 to 100 ⁇ m and at least one line edge is formed in a zigzag shape.
  • the second aspect of the present invention provides a transparent conductive film excellent in laminating suitability of the first aspect, wherein the distance from the convex peak having the jagged shape to the adjacent convex peak is 10 to 600 ⁇ m.
  • the third aspect of the present invention provides a transparent conductive film excellent in laminating suitability according to the second aspect, wherein the difference between the peak of the convex part and the peak of the concave part is 2 to 50 ⁇ m.
  • the fourth aspect of the present invention provides a transparent conductive film having excellent laminating suitability according to the first aspect, wherein the zigzag shape is a complicated structure.
  • the fifth aspect of the present invention provides a transparent conductive film having excellent laminating suitability according to the fourth aspect in which the zigzag shape is more complicated and has a fractal shape.
  • the sixth aspect of the present invention provides a transparent conductive film excellent in bonding suitability of the first aspect in which the thick film circuit pattern is formed of a conductive paste.
  • the seventh aspect of the present invention is the application according to the first aspect, wherein the thick film circuit pattern has a region where two or more thick film circuit patterns run in parallel, and the interval between the thick film circuit patterns running in parallel is 10 to 60 ⁇ m.
  • a transparent conductive film excellent in suitability for alignment is provided.
  • the 8th aspect of this invention is a sticking of a 1st aspect further provided with the circuit pattern which consists of a transparent conductive film extended from the said transparent electrode pattern between the said film base material and the said thick film circuit pattern.
  • the circuit pattern which consists of a transparent conductive film extended from the said transparent electrode pattern between the said film base material and the said thick film circuit pattern.
  • the ninth aspect of the present invention further provides a transparent conductive film excellent in laminating suitability of the first aspect provided with a pressure-sensitive adhesive layer so as to cover at least the formation region of the thick film circuit pattern.
  • the tenth aspect of the present invention provides a touch panel characterized by using the transparent conductive film according to the first to ninth aspects.
  • the line edge of the thick film circuit pattern is formed in a zigzag shape, even when the formation area of the thick film circuit pattern is covered with the pressure-sensitive adhesive layer, it is caused by this step.
  • the pressure adhesive layer does not bite air between the thick film circuit pattern side walls, and bubbles are not generated. This is because the side walls of the thick film circuit pattern are roughened so that air can easily escape through the fine gaps formed by the irregularities on the rough surface. Also, air that could not be removed does not form bubbles because it is finely dispersed in the fine gaps.
  • the pressure-sensitive adhesive layer adheres firmly and the laminating force does not decrease. Rather, the unevenness on the side wall of the thick film circuit pattern exerts an anchor effect on the pressure-sensitive adhesive layer, and the transparent conductive film does not peel off due to bending during use of the touch panel or warping of the touch panel in a high temperature and high humidity environment. A strong laminating force can be obtained.
  • the thick film circuit pattern is not easily deteriorated by oxidation.
  • the thick film circuit pattern is not easily deteriorated by oxidation.
  • the touch panel is a capacitive type, there is no bubble moving to the transparent electrode pattern formation region, so that there is no problem that it is difficult to see the back display through the touch panel.
  • FIG. 1 is an exploded perspective view showing an example of a resistive film type touch panel according to the present invention.
  • FIG. It is a disassembled perspective view which shows an example of the capacitive touch panel which concerns on this invention.
  • FIG. 2 is a partially enlarged photograph of a thick film circuit pattern of Example 1.
  • FIG. 2 is a partially enlarged photograph of a thick film circuit pattern of Example 1.
  • FIG. 4 is a partially enlarged photograph of a thick film circuit pattern of Example 2.
  • FIG. 4 is a partially enlarged photograph of a thick film circuit pattern of Example 2.
  • FIG. 4 is a partially enlarged photograph of a thick film circuit pattern of Example 3.
  • FIG. 4 is a partially enlarged photograph of a thick film circuit pattern of Example 3.
  • a transparent electrode pattern 61 made of a transparent conductive film is formed on one side of a film substrate 62, and at the peripheral portion on the film substrate 62 on which the transparent electrode pattern 61 is formed.
  • a plurality of thick film circuit patterns 60 are routed and connected to the ends of the transparent electrode pattern 61.
  • the material of the film substrate 62 is polyethylene terephthalate, polyethylene, polypropylene, cyclic polyolefin, polyvinyl chloride, polyvinylidene chloride, polymethyl methacrylate, polymethyl acrylate, polystyrene, nitrocellulose, triacetyl cellulose, polycarbonate, polydimethylcyclohexane terephthalate, Examples thereof include ABS resin, polyamide, polyimide, polyethersulfone, polysulfone, polyvinyl acetal, polyetherketone, polyurethane, copolymer resins of these resins, and mixed resins of these resins.
  • the transparent electrode pattern 61 is made of a transparent conductive film, and the material thereof is made of transparent oxides such as indium oxide, tin oxide, indium tin oxide, zinc oxide, and aluminum zinc oxide, as well as thiophene-based materials. Examples thereof include transparent conductive polymers.
  • the thick film circuit pattern 60 is made of a material having a resistance lower than that of the transparent conductive film.
  • a conductive paste layer made of a binder resin and a conductive material or a thin film layer made of a single conductive material can be used.
  • the binder resin include resins such as acrylic, polyester, polyurethane, and polyvinyl chloride.
  • the thick film circuit pattern 60 is formed into a predetermined pattern by a method such as painting or ink jet, in addition to screen printing, gravure printing, and offset printing. Alternatively, the solid pattern may be formed by these methods and then patterned.
  • Examples of conductive materials include metal powders such as silver, gold, copper, and palladium, metal particles, and metal nanoparticles, as well as conductive nanofibers such as carbon nanofibers and metal nanowires.
  • the thickness of the thick film circuit pattern 60 can be appropriately set in the range of 0.05 to 100 ⁇ m. If the thickness is less than 0.05 ⁇ m, it is difficult to obtain the conductivity as a routing circuit, and if the thickness is more than 100 ⁇ m, it is difficult to form a thin film.
  • the feature of the present invention lies in that at least one line edge of the thick film circuit pattern 60 is formed in a zigzag shape to obtain excellent bonding ability (see FIGS. 2 and 8). That is, since the line edge of the thick film circuit pattern 60 is formed in a zigzag shape, even when the formation area of the thick film circuit pattern 60 is covered with the pressure sensitive adhesive layer 64, the pressure sensitivity is caused by this step.
  • the adhesive layer 64 does not bite air between the side walls of the thick film circuit pattern 60, and bubbles are not generated. This is because the side wall 60a of the thick film circuit pattern 60 is roughened so that air can easily escape through the fine gaps formed by the irregularities of the rough surface. Also, air that could not be removed does not form bubbles because it is finely dispersed in the fine gaps.
  • the thick film circuit pattern is formed so that the line edge, that is, the side wall of the thick film circuit pattern is smooth. This is because the smoother one can form a plurality of thick film circuit patterns closer to each other and achieve higher definition. In fact, in this field, there is a technical competition on how to smooth line edges. On the other hand, in the present invention, the effect of the preceding paragraph is obtained by intentionally forming the line edge into a rough and jagged shape rather than usual, based on the idea of reversal.
  • the jagged shape is preferably formed so that the distance from the convex peak to the adjacent convex peak is in the range of 10 to 600 ⁇ m (see FIG. 2).
  • it is less than 10 ⁇ m, it becomes difficult to form unevenness, and when it exceeds 600 ⁇ m, it is impossible to obtain sufficient bonding suitability. More preferably, it is 20 to 300 ⁇ m. More preferably, it is 40 to 150 ⁇ m.
  • the jagged shape is preferably formed so that the distance from the convex peak to the adjacent convex peak is in the range of 10 to 600 ⁇ m, and the difference between the convex peak and the concave peak is in the range of 2 to 50 ⁇ m ( (See FIG. 2).
  • the difference between the peak of the convex part and the peak of the concave part is less than 2 ⁇ m, the bonding ability cannot be obtained sufficiently, and when the difference between the peak of the convex part and the peak of the concave part exceeds 50 ⁇ m, the thick film runs in parallel It is difficult to reduce the interval between circuit patterns (narrow frame).
  • the difference between the peak of the convex portion and the peak of the concave portion is 3 to 25 ⁇ m. More preferably, the difference between the peak of the convex portion and the peak of the concave portion is 5 to 15 ⁇ m.
  • the zigzag shape has a more complex anchor structure and better anchor effect with respect to the pressure-sensitive adhesive layer 64.
  • the unevenness and the protruding direction are different, so it can respond to various changes in how the force is applied, such as how to bend when using the touch panel and how to warp the touch panel in a high-temperature and high-humidity environment. it can.
  • the jagged shape is uniform, the anchor effect varies depending on how the force is applied.
  • the shape of the aforementioned line edge formed in a jagged shape may be a more complicated and fractal diagram shape, that is, a structure that is more jagged when the surface of the jagged surface is enlarged. This further increases the anchor effect.
  • the thick film circuit pattern 60 has a region in which two or more of the thick film circuit patterns 60 run in parallel (see FIGS. 1 to 3), and an interval 5 between the thick film circuit patterns 60 that run in parallel is 10 to 60 ⁇ m.
  • interval 5 means between the convex parts which protrude most.
  • a circuit pattern 64 made of a transparent conductive film extended from the transparent electrode pattern 61 is provided between the film substrate 62 and the thick film circuit pattern 60. Good.
  • the transparent conductive film 1 may include a pressure-sensitive adhesive (PSA) layer 64 for bonding in advance so as to cover at least the formation region of the thick film circuit pattern 60 (See FIG. 5).
  • PSA pressure-sensitive adhesive
  • a normal printing method such as screen printing, offset printing, gravure printing, or flexographic printing may be used.
  • the touch panel 1 can be obtained using the transparent conductive film 1 as described above.
  • the touch panel is a sensor that detects where the user touches without disturbing the screen display of an LCD or the like. Although the touched position is detected electrically and the one not using electricity, the transparent conductive film 1 described above is used for an electric detection method such as a resistance film method or a capacitance method. is there.
  • the two transparent conductive films 1 are bonded only at the peripheral edge so that the transparent electrodes face each other through the air layer. When the input surface is touched, the film bends due to the pressure, and the transparent electrodes come into contact with each other so that electricity flows.
  • the pressed position can be detected by measuring the voltage division ratio due to the resistance of each transparent electrode (Fig. 6).
  • the position is detected by detecting the change in the capacitance between the fingertip and the transparent electrode.
  • the transparent conductive film 1 is placed on the entire back surface of the glass plate. The two transparent conductive films 1 are bonded together so that the transparent electrodes face each other (see FIG. 7).
  • a transparent conductive film made of indium tin oxide was formed by sputtering on one side of a biaxially stretched polyethylene terephthalate film having a thickness of 100 ⁇ m as a film substrate, and unnecessary portions were removed to form a transparent electrode pattern.
  • a silver paste (3 parts by weight of silver powder having an average particle diameter of 20 ⁇ m with respect to 10 parts by weight of acrylic resin) is used by screen printing to form a frame-shaped solid pattern having a thickness of 7 ⁇ m, which is unnecessary
  • the portion was removed, and a jagged thick film circuit pattern with uneven line edges on both sides was formed so as to be connected to the transparent electrode pattern to obtain a transparent conductive film.
  • the line edge portion of the formed thick film circuit pattern has an average distance of 100 ⁇ m from the jagged convex peak to the adjacent convex peak, and an average difference of 14 ⁇ m between the convex peak and the concave peak.
  • the gap between the running thick film circuit patterns was about 50 ⁇ m (see FIGS. 9 and 10).
  • the two transparent conductive films were bonded together with a pressure-sensitive adhesive layer so that the transparent electrodes were opposed to each other to obtain a capacitive touch panel.
  • the touch panel obtained in this way had no pressure between the pressure-sensitive adhesive layer and the side wall of the thick film circuit pattern, and no bubbles were generated.
  • the bonding force was strong enough to prevent the transparent conductive film from peeling due to bending when using the touch panel and warping of the touch panel in a high temperature and high humidity environment.
  • a thick film circuit pattern was formed in the same manner as in Example 1 except that a silver nanocolloid material having an average particle diameter of 1 ⁇ m was used instead of the silver powder of the silver paste.
  • the distance from the jagged-shaped convex peak at the line edge portion of the thick film circuit pattern to the adjacent convex peak is 100 ⁇ m on average, and the difference between the convex peak and the concave peak is 5 ⁇ m on average (See FIGS. 11 and 12).
  • a sufficient effect was obtained for pasting.
  • a thick film circuit pattern was formed in the same manner as in Example 1 except that a copper foil having a thickness of 10 ⁇ m was used instead of the silver paste.
  • the distance from the jagged convex peak at the line edge portion of the thick film circuit pattern to the adjacent convex peak is 40 ⁇ m on average, and the difference between the convex peak and the concave peak is 6 ⁇ m on average (See FIGS. 13 and 14).
  • a sufficient effect was obtained for pasting.
  • the present invention can be used for applications such as PDAs, handheld terminals and other portable information terminals, copiers, facsimile and other OA equipment, smartphones, mobile phones, portable game machines, electronic dictionaries, car navigation systems, small PCs, various home appliances It is useful industrially.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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Abstract

Provided is a transparent conductive film touch panel for which gas bubbles are not created when laminating, that is to say, that has superior suitability for laminating, and a touch panel using the same. A transparent conductive film is provided with a film substrate; a transparent electrode pattern comprising a transparent conducting layer formed on one side of the film substrate; a thick film circuit pattern comprising material of lower resistance than the transparent conducting layer, said thick film circuit pattern being routed over a periphery on the film substrate on which the transparent electrode pattern has been formed and connected to an end portion of the transparent electrode pattern. The thick film circuit pattern has a thickness of 0.05 to 100 μm, and furthermore, at least one of the line edges is formed into a serrated shape.

Description

貼合わせ適性に優れた透明導電性フィルム及びこれを用いたタッチパネルTransparent conductive film excellent in bonding suitability and touch panel using the same
　この発明は、タッチパネルなどに用いる透明導電性フィルム及びこれを用いたタッチパネルに関するものである。 The present invention relates to a transparent conductive film used for a touch panel or the like and a touch panel using the same.
　従来より、フィルム基材と、前記フィルム基材の片面に形成された透明導電膜からなる透明電極パターンと、前記透明電極パターンが形成された前記フィルム基材上の周縁部に引き回されて前記透明電極パターンの端部と接続される、前記透明導電膜より低抵抗の材料からなる厚膜回路パターンと、を備えた透明導電性フィルムが知られている（特許文献１参照）。 Conventionally, the film substrate, a transparent electrode pattern made of a transparent conductive film formed on one side of the film substrate, and the peripheral portion on the film substrate on which the transparent electrode pattern is formed are routed to the There is known a transparent conductive film including a thick film circuit pattern made of a material having a resistance lower than that of the transparent conductive film, which is connected to an end of the transparent electrode pattern (see Patent Document 1).
　そして、タッチパネルを搭載した携帯型の情報機器が広く使用されているが、これらに搭載されるタッチパネルとしては抵抗膜方式のものがあった。抵抗膜方式のタッチパネルは、透明導電膜が形成された二枚の透明導電基板を所定間隔で相対させて構成するもので、指、ペン等でタッチした部分でのみ両透明電極基板が接触してスイッチとして動作し、例えばディスプレイ画面上のメニューの選択あるいは手書き文字の入力等を行うことが出来る。このタッチパネルにおいては、前記した構成の透明導電性フィルムを透明導電基板として用い、周縁部で貼合わせることにより、比較的簡易な構成を実現している。貼合わせには感圧接着剤層が用いられ、前記厚膜回路パターンの形成領域もこの感圧接着剤層で被覆される。 And, portable information devices equipped with touch panels are widely used, but there are resistive film type touch panels installed on these. A resistive film type touch panel consists of two transparent conductive substrates on which transparent conductive films are formed facing each other at a predetermined interval. Both transparent electrode substrates are in contact only with a part touched with a finger, pen, etc. It operates as a switch and can select menus on the display screen or input handwritten characters, for example. In this touch panel, a relatively simple configuration is realized by using the transparent conductive film having the above-described configuration as a transparent conductive substrate and laminating at the peripheral portion. A pressure-sensitive adhesive layer is used for pasting, and the thick film circuit pattern forming region is also covered with the pressure-sensitive adhesive layer.
　また、近年では、携帯型の情報機器に搭載されるタッチパネルとして静電容量方式のものも普及しており、その勢いは抵抗膜方式を凌駕するほどである。静電容量方式のタッチパネルにおいても前記した構成の透明導電性フィルムを用いるが、この場合、透明導電性フィルムを全面的に透明基材に貼り合わせている。 In recent years, a capacitive type touch panel mounted on a portable information device has become widespread, and its momentum surpasses that of a resistive film type. In the capacitive touch panel, the transparent conductive film having the above-described configuration is used. In this case, the transparent conductive film is entirely bonded to the transparent substrate.
特開２００６－０５９７２０号公報JP 2006-059720 A
　しかしながら、厚膜回路パターンの形成領域においては、厚膜回路パターンとその隣接部分との間に厚膜回路パターン厚み分の段差が生じている。そのため、厚膜回路パターンの形成領域を感圧接着剤層で被覆してタッチパネルを得た際に、この段差に起因して、感圧接着剤層が厚膜回路パターンの側壁との間に空気を噛み、気泡が発生する。気泡は、加圧しながら貼合わせても厚膜回路パターンの側壁に沿って移動するだけで消滅せず、厚膜回路パターンの屈曲部分などに気泡が残存したままとなり、以下のような問題を生ずる。 However, in the thick film circuit pattern formation region, a step corresponding to the thickness of the thick film circuit pattern is generated between the thick film circuit pattern and its adjacent portion. Therefore, when a touch panel is obtained by covering the region where the thick film circuit pattern is formed with the pressure sensitive adhesive layer, the pressure sensitive adhesive layer has an air gap between the thick film circuit pattern and the side wall due to this step. , And bubbles are generated. Even if the bubbles are stuck together under pressure, they move only along the sidewalls of the thick film circuit pattern and do not disappear, leaving the bubbles remaining in the bent part of the thick film circuit pattern, resulting in the following problems. .
　まず、この気泡が経時的に、例えばタッチパネルの保管・輸送時などに押圧されることにより集合すると、タッチパネルの外表面に膨れなどの外観不良を起こすという悪さをする。 First, if these bubbles are gathered over time, for example, when the touch panel is stored or transported, it causes a bad appearance such as swelling on the outer surface of the touch panel.
　また、気泡が存在する部分は感圧接着剤層は接着していないで、その分だけ貼合わせ力は低下する。 Also, the pressure-sensitive adhesive layer is not adhered to the part where bubbles are present, and the bonding force decreases accordingly.
　さらに、気泡が存在する部分の厚膜回路パターンには酸化による劣化が生じ易い。加えて複数本の厚膜回路パターンが並走している場合には、厚膜回路パターンどうしの間に気泡が存在すると当該気泡を介して短絡が生じるおそれもある。 Furthermore, the thick film circuit pattern where bubbles are present is likely to be deteriorated by oxidation. In addition, in the case where a plurality of thick film circuit patterns are running side by side, if bubbles exist between the thick film circuit patterns, a short circuit may occur via the bubbles.
　そして、タッチパネルが静電容量方式の場合には、透明導電性フィルムは厚膜回路パターンの形成領域のみならず透明電極パターン形成領域も貼合わせられるため、厚膜回路パターンの形成領域で発生した気泡が経時的に透明電極パターン形成領域まで移動してくると、タッチパネルを透して背後のディスプレイを視認しずらくなるという問題も生ずる。 When the touch panel is of the capacitive type, the transparent conductive film is bonded not only to the thick film circuit pattern forming area but also to the transparent electrode pattern forming area. However, when it moves to the transparent electrode pattern formation region over time, there also arises a problem that it is difficult to visually recognize the back display through the touch panel.
　本発明は、上記のような課題を解決するためになされたもので、貼合わせ時に気泡を生じない、すなわち貼合わせ適性に優れた透明導電性フィルム及びこれを用いたタッチパネルを提供することを目的とする。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a transparent conductive film that does not generate bubbles at the time of bonding, that is, excellent in bonding suitability, and a touch panel using the same. And
　本発明は、上記技術的課題を解決するために、以下の構成の貼合わせ適性に優れた透明導電性フィルム及びこれを用いたタッチパネルを提供する。 In order to solve the above technical problem, the present invention provides a transparent conductive film having the following constitution and excellent bonding suitability and a touch panel using the transparent conductive film.
　本発明の第１態様は、フィルム基材と、前記フィルム基材の片面に形成された透明導電膜からなる透明電極パターンと、前記透明電極パターンが形成された前記フィルム基材上の周縁部に引き回されて前記透明電極パターンの端部と接続される、前記透明導電膜より低抵抗の材料からなる厚膜回路パターンと、を備えた透明導電性フィルムであって、前記厚膜回路パターンが、０．０５～１００μｍの膜厚で、なおかつ少なくとも一方のラインエッジをギザキザ形状に形成されていることを特徴とする貼合わせ適性に優れた透明導電性フィルムを提供する。 In the first aspect of the present invention, a film substrate, a transparent electrode pattern made of a transparent conductive film formed on one side of the film substrate, and a peripheral portion on the film substrate on which the transparent electrode pattern is formed A thick film circuit pattern made of a material having a resistance lower than that of the transparent conductive film, which is routed and connected to an end portion of the transparent electrode pattern, wherein the thick film circuit pattern is A transparent conductive film excellent in bonding suitability, characterized in that it has a film thickness of 0.05 to 100 μm and at least one line edge is formed in a zigzag shape.
　また、本発明の第２態様は、前記ギザキザ形状の凸部ピークから隣の凸部ピークまでの距離が１０～６００μｍである第１態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 Also, the second aspect of the present invention provides a transparent conductive film excellent in laminating suitability of the first aspect, wherein the distance from the convex peak having the jagged shape to the adjacent convex peak is 10 to 600 μm.
　また、本発明の第３態様は、前記ギザキザ形状の凸部のピークと凹部のピークの差が２～５０μｍである第２態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 In addition, the third aspect of the present invention provides a transparent conductive film excellent in laminating suitability according to the second aspect, wherein the difference between the peak of the convex part and the peak of the concave part is 2 to 50 μm.
　また、本発明の第４態様は、前記ギザキザ形状が複雑な構造である第１態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 Further, the fourth aspect of the present invention provides a transparent conductive film having excellent laminating suitability according to the first aspect, wherein the zigzag shape is a complicated structure.
　また、本発明の第５態様は、前記ギザキザ形状が、より複雑でフラクタル図形状になっている第４態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 Also, the fifth aspect of the present invention provides a transparent conductive film having excellent laminating suitability according to the fourth aspect in which the zigzag shape is more complicated and has a fractal shape.
　また、本発明の第６態様は、前記厚膜回路パターンが導電性ペーストで形成されている第１態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 Further, the sixth aspect of the present invention provides a transparent conductive film excellent in bonding suitability of the first aspect in which the thick film circuit pattern is formed of a conductive paste.
　また、本発明の第７態様は、前記厚膜回路パターンが２本以上並走する領域を有しており、並走する前記厚膜回路パターンの間隔が１０～６０μｍである第１態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 The seventh aspect of the present invention is the application according to the first aspect, wherein the thick film circuit pattern has a region where two or more thick film circuit patterns run in parallel, and the interval between the thick film circuit patterns running in parallel is 10 to 60 μm. A transparent conductive film excellent in suitability for alignment is provided.
　また、本発明の第８態様は、さらに、前記フィルム基材と前記厚膜回路パターンとの間に、前記透明電極パターンから延出された透明導電膜からなる回路パターンを備える第１態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 Moreover, the 8th aspect of this invention is a sticking of a 1st aspect further provided with the circuit pattern which consists of a transparent conductive film extended from the said transparent electrode pattern between the said film base material and the said thick film circuit pattern. A transparent conductive film excellent in suitability for alignment is provided.
　また、本発明の第９態様は、さらに、少なくとも前記厚膜回路パターンの形成領域を覆うように感圧接着剤層を備える第１態様の貼合わせ適性に優れた透明導電性フィルムを提供する。 Further, the ninth aspect of the present invention further provides a transparent conductive film excellent in laminating suitability of the first aspect provided with a pressure-sensitive adhesive layer so as to cover at least the formation region of the thick film circuit pattern.
　また、本発明の第１０態様は、第１～９態様の透明導電性フィルムを用いたことを特徴するタッチパネルを提供する。 The tenth aspect of the present invention provides a touch panel characterized by using the transparent conductive film according to the first to ninth aspects.
　本発明によれば、厚膜回路パターンのラインエッジがギザキザ形状に形成されているので、厚膜回路パターンの形成領域を感圧接着剤層で被覆する際でも、この段差に起因して、感圧接着剤層が厚膜回路パターンの側壁との間に空気を噛みことがなく、気泡が発生しない。何故ならば、厚膜回路パターンの側壁を業と粗くしているので、当該粗面の凹凸で構成される微細な隙間を介して空気が抜け易くなっているためである。また、抜けきれなかった空気も前記微細な隙間に細かく分散して存在するため気泡を構成しない。 According to the present invention, since the line edge of the thick film circuit pattern is formed in a zigzag shape, even when the formation area of the thick film circuit pattern is covered with the pressure-sensitive adhesive layer, it is caused by this step. The pressure adhesive layer does not bite air between the thick film circuit pattern side walls, and bubbles are not generated. This is because the side walls of the thick film circuit pattern are roughened so that air can easily escape through the fine gaps formed by the irregularities on the rough surface. Also, air that could not be removed does not form bubbles because it is finely dispersed in the fine gaps.
　したがって、気泡が存在しないので、タッチパネルの外表面に膨れなどの外観不良を起こすという悪さをしない。 Therefore, since there are no air bubbles, there is no bad effect such as blistering on the outer surface of the touch panel.
　また、気泡が存在しないので、感圧接着剤層はしっかり接着して貼合わせ力は低下しない。むしろ、厚膜回路パターンの側壁の凹凸が感圧接着剤層に対してアンカー効果を発揮し、タッチパネル使用時の撓み、高温高湿環境下におけるタッチパネルの反りによっても透明導電性フィルムが剥離しないほどに強い貼合わせ力が得られる。 Also, since there are no air bubbles, the pressure-sensitive adhesive layer adheres firmly and the laminating force does not decrease. Rather, the unevenness on the side wall of the thick film circuit pattern exerts an anchor effect on the pressure-sensitive adhesive layer, and the transparent conductive film does not peel off due to bending during use of the touch panel or warping of the touch panel in a high temperature and high humidity environment. A strong laminating force can be obtained.
　さらに、気泡が存在しないので、厚膜回路パターンには酸化による劣化が生じにくい。加えて複数本の厚膜回路パターンが並走している場合でも、厚膜回路パターンどうしの間で短絡が生じるおそれもない。 Furthermore, since there are no bubbles, the thick film circuit pattern is not easily deteriorated by oxidation. In addition, even when a plurality of thick film circuit patterns are running in parallel, there is no possibility that a short circuit will occur between the thick film circuit patterns.
　そして、タッチパネルが静電容量方式の場合に、透明電極パターン形成領域まで移動してくる気泡も存在しないので、タッチパネルを透して背後のディスプレイを視認しずらくなるという問題も生じない。 And, when the touch panel is a capacitive type, there is no bubble moving to the transparent electrode pattern formation region, so that there is no problem that it is difficult to see the back display through the touch panel.
本発明に係る透明導電性フィルムの一例を示す平面図である。It is a top view which shows an example of the transparent conductive film which concerns on this invention. 図１の透明導電性フィルムに引き回された厚膜回路パターンの部分拡大写真である。It is the elements on larger scale of the thick film circuit pattern drawn around the transparent conductive film of FIG. 本発明に係る透明導電性フィルムの一例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows an example of the transparent conductive film which concerns on this invention. 本発明に係る透明導電性フィルムの他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of the transparent conductive film which concerns on this invention. 本発明に係る透明導電性フィルムの他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of the transparent conductive film which concerns on this invention. 本発明に係る抵抗膜方式のタッチパネルの一例を示す分解斜視図である。1 is an exploded perspective view showing an example of a resistive film type touch panel according to the present invention. FIG. 本発明に係る静電容量方式のタッチパネルの一例を示す分解斜視図である。It is a disassembled perspective view which shows an example of the capacitive touch panel which concerns on this invention. 厚膜回路パターンのラインエッジの状態を説明する模式図である。It is a schematic diagram explaining the state of the line edge of a thick film circuit pattern. 実施例１の厚膜回路パターンの部分拡大写真である。2 is a partially enlarged photograph of a thick film circuit pattern of Example 1. FIG. 実施例１の厚膜回路パターンの部分拡大写真である。2 is a partially enlarged photograph of a thick film circuit pattern of Example 1. FIG. 実施例２の厚膜回路パターンの部分拡大写真である。4 is a partially enlarged photograph of a thick film circuit pattern of Example 2. FIG. 実施例２の厚膜回路パターンの部分拡大写真である。4 is a partially enlarged photograph of a thick film circuit pattern of Example 2. FIG. 実施例３の厚膜回路パターンの部分拡大写真である。4 is a partially enlarged photograph of a thick film circuit pattern of Example 3. FIG. 実施例３の厚膜回路パターンの部分拡大写真である。4 is a partially enlarged photograph of a thick film circuit pattern of Example 3. FIG.
　次に、発明の実施の形態について図を参照しながら説明する。 Next, embodiments of the invention will be described with reference to the drawings.
　図１の発明の透明導電性フィルム１は、フィルム基材６２の片面に透明導電膜からなる透明電極パターン６１が形成され、この透明電極パターン６１が形成されたフィルム基材６２上の周縁部において、複数の厚膜回路パターン６０が引き回されて透明電極パターン６１の端部と接続されている。 In the transparent conductive film 1 of the invention of FIG. 1, a transparent electrode pattern 61 made of a transparent conductive film is formed on one side of a film substrate 62, and at the peripheral portion on the film substrate 62 on which the transparent electrode pattern 61 is formed. A plurality of thick film circuit patterns 60 are routed and connected to the ends of the transparent electrode pattern 61.
　フィルム基材６２の材質は、ポリエチレンテレフタレート、ポリエチレン、ポリプロピレン、環状ポリオレフィン、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリメチルメタクリレート、ポリメチルアクリレート、ポリスチレン、ニトロセルロース、トリアセチルセルロース、ポリカーボネート、ポリジメチルシクロヘキサンテレフタレート、ＡＢＳ樹脂、ポリアミド、ポリイミド、ポリエーテルスルホン、ポリスルホン、ポリビニルアセタール、ポリエーテルケトン、ポリウレタン、これらの樹脂の共重合体樹脂、これらの樹脂の混合樹脂などが挙げられる。 The material of the film substrate 62 is polyethylene terephthalate, polyethylene, polypropylene, cyclic polyolefin, polyvinyl chloride, polyvinylidene chloride, polymethyl methacrylate, polymethyl acrylate, polystyrene, nitrocellulose, triacetyl cellulose, polycarbonate, polydimethylcyclohexane terephthalate, Examples thereof include ABS resin, polyamide, polyimide, polyethersulfone, polysulfone, polyvinyl acetal, polyetherketone, polyurethane, copolymer resins of these resins, and mixed resins of these resins.
　透明電極パターン６１は透明導電膜で構成され、その材質は、インジウム酸化物、スズ酸化物、インジウムスズ酸化物、亜鉛酸化物、アルミニウム亜鉛酸化物などの透明酸化物などのほか、チオフェン系などの透明導電ポリマーなどが挙げられる。 The transparent electrode pattern 61 is made of a transparent conductive film, and the material thereof is made of transparent oxides such as indium oxide, tin oxide, indium tin oxide, zinc oxide, and aluminum zinc oxide, as well as thiophene-based materials. Examples thereof include transparent conductive polymers.
　厚膜回路パターン６０には、前記透明導電膜より低抵抗の材料が用いられる。例えばバインダー樹脂と導電性材料とからなる導電ペースト層や導電性材料単体からなる薄膜層が挙げられる。バインダー樹脂は、アクリル、ポリエステル、ポリウレタン、ポリ塩化ビニルなどの樹脂が挙げられる。厚膜回路パターン６０は、スクリーン印刷、グラビア印刷、オフセット印刷の他、塗装やインクジェットなどの方法により所定のパターンに形成する。あるいはこれらの方法でベタパターンを形成したのち、パターニングしてもよい。 The thick film circuit pattern 60 is made of a material having a resistance lower than that of the transparent conductive film. For example, a conductive paste layer made of a binder resin and a conductive material or a thin film layer made of a single conductive material can be used. Examples of the binder resin include resins such as acrylic, polyester, polyurethane, and polyvinyl chloride. The thick film circuit pattern 60 is formed into a predetermined pattern by a method such as painting or ink jet, in addition to screen printing, gravure printing, and offset printing. Alternatively, the solid pattern may be formed by these methods and then patterned.
　導電性材料は、銀、金、銅、パラジウムなどの金属粉や金属粒子、金属ナノ粒子のほか、カーボンナノファイバー、金属ナノワイヤなどの導電性ナノファイバーなどが挙げられる。 Examples of conductive materials include metal powders such as silver, gold, copper, and palladium, metal particles, and metal nanoparticles, as well as conductive nanofibers such as carbon nanofibers and metal nanowires.
　厚膜回路パターン６０の厚みは０．０５～１００μｍの範囲で適宜設定可能である。厚みが０．０５μｍより薄いと引き回し回路としての導電性が得にくくなり、厚みが１００μｍより厚いと薄膜形成が難しい。 The thickness of the thick film circuit pattern 60 can be appropriately set in the range of 0.05 to 100 μm. If the thickness is less than 0.05 μm, it is difficult to obtain the conductivity as a routing circuit, and if the thickness is more than 100 μm, it is difficult to form a thin film.
　本発明の特徴は、厚膜回路パターン６０の少なくとも一方のラインエッジをギザキザ形状に形成して優れた貼合わせ適性を得たことにある（図２、図８参照）。すなわち、厚膜回路パターン６０のラインエッジがギザキザ形状に形成されているので、厚膜回路パターン６０の形成領域を感圧接着剤層６４で被覆する際でも、この段差に起因して、感圧接着剤層６４が厚膜回路パターン６０の側壁との間に空気を噛みことがなく、気泡が発生しない。何故ならば、厚膜回路パターン６０の側壁６０ａを業と粗くしているので、当該粗面の凹凸で構成される微細な隙間を介して空気が抜け易くなっているためである。また、抜けきれなかった空気も前記微細な隙間に細かく分散して存在するため気泡を構成しない。 The feature of the present invention lies in that at least one line edge of the thick film circuit pattern 60 is formed in a zigzag shape to obtain excellent bonding ability (see FIGS. 2 and 8). That is, since the line edge of the thick film circuit pattern 60 is formed in a zigzag shape, even when the formation area of the thick film circuit pattern 60 is covered with the pressure sensitive adhesive layer 64, the pressure sensitivity is caused by this step. The adhesive layer 64 does not bite air between the side walls of the thick film circuit pattern 60, and bubbles are not generated. This is because the side wall 60a of the thick film circuit pattern 60 is roughened so that air can easily escape through the fine gaps formed by the irregularities of the rough surface. Also, air that could not be removed does not form bubbles because it is finely dispersed in the fine gaps.
　従来、厚膜回路パターンは、ラインエッジ、即ち厚膜回路パターンの側壁は平滑になるように形成されている。より平滑である方が複数の厚膜回路パターンを接近して形成し、高精細化が図れるからである。実際、この分野では如何にラインエッジを平滑にできるかという技術競争をしている。これに対して、本発明では逆転の発想により、むしろわざとラインエッジを、通常より粗く、ギザキザ形状に形成することにより前段落の効果を得ようとするものである。 Conventionally, the thick film circuit pattern is formed so that the line edge, that is, the side wall of the thick film circuit pattern is smooth. This is because the smoother one can form a plurality of thick film circuit patterns closer to each other and achieve higher definition. In fact, in this field, there is a technical competition on how to smooth line edges. On the other hand, in the present invention, the effect of the preceding paragraph is obtained by intentionally forming the line edge into a rough and jagged shape rather than usual, based on the idea of reversal.
　前記ギザキザ形状は、凸部ピークから隣の凸部ピークまでの距離が１０～６００μｍの範囲で形成するのが好ましい（図２参照）。１０μｍに満たない場合には凹凸を形成することが難しくなり、６００μｍを越える場合には貼合わせ適性が充分に得られなくなる。より好ましくは、２０～３００μｍである。さらに好ましくは４０～１５０μｍである。 The jagged shape is preferably formed so that the distance from the convex peak to the adjacent convex peak is in the range of 10 to 600 μm (see FIG. 2). When it is less than 10 μm, it becomes difficult to form unevenness, and when it exceeds 600 μm, it is impossible to obtain sufficient bonding suitability. More preferably, it is 20 to 300 μm. More preferably, it is 40 to 150 μm.
　また、ギザキザ形状は、凸部ピークから隣の凸部ピークまでの距離が１０～６００μｍの範囲で、なおかつ凸部のピークと凹部のピークの差が２～５０μｍの範囲で形成するのが好ましい（図２参照）。凸部のピークと凹部のピークの差が２μｍに満たない場合には貼合わせ適性が充分に得られなくなり、凸部のピークと凹部のピークの差が５０μｍを越える場合には並走する厚膜回路パターン間の間隔を小さくすること（狭額縁化）が難しくなる。より好ましくは、凸部のピークと凹部のピークの差が３～２５μｍである。さらに好ましくは凸部のピークと凹部のピークの差が５～１５μｍである。 Further, the jagged shape is preferably formed so that the distance from the convex peak to the adjacent convex peak is in the range of 10 to 600 μm, and the difference between the convex peak and the concave peak is in the range of 2 to 50 μm ( (See FIG. 2). When the difference between the peak of the convex part and the peak of the concave part is less than 2 μm, the bonding ability cannot be obtained sufficiently, and when the difference between the peak of the convex part and the peak of the concave part exceeds 50 μm, the thick film runs in parallel It is difficult to reduce the interval between circuit patterns (narrow frame). More preferably, the difference between the peak of the convex portion and the peak of the concave portion is 3 to 25 μm. More preferably, the difference between the peak of the convex portion and the peak of the concave portion is 5 to 15 μm.
　また、ギザキザ形状は、複雑な構造であるほうが感圧接着剤層６４に対してアンカー効果に優れている。つまり、凹凸の大きさや突出方向がバラバラになることにより、タッチパネル使用時の撓み方や、高温高湿環境下におけるタッチパネルの反り方など、力の加わり方が色々と変化しても、各々に対応できる。これに対してギザキザ形状が均一であると、力の加わり方によってアンカー効果にバラツキが生じる。 Also, the zigzag shape has a more complex anchor structure and better anchor effect with respect to the pressure-sensitive adhesive layer 64. In other words, the unevenness and the protruding direction are different, so it can respond to various changes in how the force is applied, such as how to bend when using the touch panel and how to warp the touch panel in a high-temperature and high-humidity environment. it can. On the other hand, if the jagged shape is uniform, the anchor effect varies depending on how the force is applied.
　また、ギザキザ形状に形成された前述ラインエッジの形状が、より複雑でフラクタル図形状に、つまりギザキザの表面を拡大するとさらにギザギザであるような構造となっていても良い。このことによってアンカー効果はさらに増大する。 Also, the shape of the aforementioned line edge formed in a jagged shape may be a more complicated and fractal diagram shape, that is, a structure that is more jagged when the surface of the jagged surface is enlarged. This further increases the anchor effect.
　前記厚膜回路パターン６０が２本以上並走する領域を有しており（図１～３参照）、並走する前記厚膜回路パターン６０の間隔５が１０～６０μｍである。間隔５が１０μｍに満たない場合には感圧接着剤層６４が厚膜回路パターン６０の間に入り込みにくくなり、間隔５が６０μｍを越える場合には狭額縁化が難しくなる。なお、本明細書においては、間隔５とは、最も突出した凸部どうしの間のことをいう。 The thick film circuit pattern 60 has a region in which two or more of the thick film circuit patterns 60 run in parallel (see FIGS. 1 to 3), and an interval 5 between the thick film circuit patterns 60 that run in parallel is 10 to 60 μm. When the interval 5 is less than 10 μm, the pressure-sensitive adhesive layer 64 is difficult to enter between the thick film circuit patterns 60, and when the interval 5 exceeds 60 μm, it is difficult to narrow the frame. In addition, in this specification, the space | interval 5 means between the convex parts which protrude most.
　さらに、図４に示すように、前記フィルム基材６２と前記厚膜回路パターン６０との間に、前記透明電極パターン６１から延出された透明導電膜からなる回路パターン６４を備えるようにしてもよい。 Further, as shown in FIG. 4, a circuit pattern 64 made of a transparent conductive film extended from the transparent electrode pattern 61 is provided between the film substrate 62 and the thick film circuit pattern 60. Good.
　なお、透明導電性フィルム１は、少なくとも前記厚膜回路パターン６０の形成領域を覆うように、貼合わせのための感圧接着剤(Pressure Sensitive Adhesives,ＰＳＡ)層６４をあらかじめ備えていてもよい（図５参照）。ＰＳＡ層６４の塗布方法としては、スクリーン印刷、オフセット印刷、グラビア印刷、若しくは、フレキソ印刷などの通常印刷法などを用いるとよい。 The transparent conductive film 1 may include a pressure-sensitive adhesive (PSA) layer 64 for bonding in advance so as to cover at least the formation region of the thick film circuit pattern 60 ( (See FIG. 5). As a method for applying the PSA layer 64, a normal printing method such as screen printing, offset printing, gravure printing, or flexographic printing may be used.
　以上のような透明導電性フィルム１を用いてタッチパネル１を得ることができる。タッチパネルとはＬＣＤなどの画面表示を邪魔せずにどこをタッチしたかを検出するセンサである。タッチした位置の検出を電気的に行うものと電気を用いないものに分かれるが、上記した透明導電性フィルム１を用いるのは、抵抗膜方式や静電容量方式などの電気的に検出する方式である。例えば、抵抗膜方式のタッチパネル１００の場合は、二枚の透明導電性フィルム１を透明電極どうしが空気層を介して対向するように周縁部のみで接着させる。入力面をタッチすると、圧力によりフィルムが撓み、透明電極どうしが接触して電気が流れるため、それぞれの透明電極の抵抗による分圧比を測定することで押された位置を検出することができる（図６参照）。一方、静電容量方式のタッチパネル１０１の場合は、指先と透明電極との間での静電容量の変化を捉えて位置を検出するもので、ガラス板の裏面などに透明導電性フィルム１を全面的に接着させたり、二枚の透明導電性フィルム１を透明電極どうしが対向するように全面接着させたりする（図７参照）。 The touch panel 1 can be obtained using the transparent conductive film 1 as described above. The touch panel is a sensor that detects where the user touches without disturbing the screen display of an LCD or the like. Although the touched position is detected electrically and the one not using electricity, the transparent conductive film 1 described above is used for an electric detection method such as a resistance film method or a capacitance method. is there. For example, in the case of the resistive film type touch panel 100, the two transparent conductive films 1 are bonded only at the peripheral edge so that the transparent electrodes face each other through the air layer. When the input surface is touched, the film bends due to the pressure, and the transparent electrodes come into contact with each other so that electricity flows. Therefore, the pressed position can be detected by measuring the voltage division ratio due to the resistance of each transparent electrode (Fig. 6). On the other hand, in the case of the capacitive touch panel 101, the position is detected by detecting the change in the capacitance between the fingertip and the transparent electrode. The transparent conductive film 1 is placed on the entire back surface of the glass plate. The two transparent conductive films 1 are bonded together so that the transparent electrodes face each other (see FIG. 7).
　フィルム基材として厚さ１００μｍの二軸延伸ポリエチレンテレフタレートフィルムの片面にスパッタリング法によりインジウムスズ酸化物からなる透明導電膜を形成し、不要部分を除去して、透明電極パターンを形成した。 A transparent conductive film made of indium tin oxide was formed by sputtering on one side of a biaxially stretched polyethylene terephthalate film having a thickness of 100 μm as a film substrate, and unnecessary portions were removed to form a transparent electrode pattern.
　次に、透明電極パターン上に、スクリーン印刷により銀ペースト（アクリル樹脂１０重量部に対して平均粒子径２０μｍの銀粉３重量部）用いて、厚み７μｍである枠状のベタパターンで形成し、不要部分を除去して、両側のラインエッジが不均一なギザギザ形状の厚膜回路パターンを透明電極パターンに接続するように形成し、透明導電性フィルムを得た。形成された厚膜回路パターンのラインエッジ部分は、ギザギザ形状の凸部ピークから隣の凸部ピークまでの距離が平均１００μｍ、凸部のピークと凹部のピークの差が平均１４μｍであって、並走する厚膜回路パターンどうしの間隙が約５０μｍであった（図９，図１０参照）。 Next, on the transparent electrode pattern, a silver paste (3 parts by weight of silver powder having an average particle diameter of 20 μm with respect to 10 parts by weight of acrylic resin) is used by screen printing to form a frame-shaped solid pattern having a thickness of 7 μm, which is unnecessary The portion was removed, and a jagged thick film circuit pattern with uneven line edges on both sides was formed so as to be connected to the transparent electrode pattern to obtain a transparent conductive film. The line edge portion of the formed thick film circuit pattern has an average distance of 100 μm from the jagged convex peak to the adjacent convex peak, and an average difference of 14 μm between the convex peak and the concave peak. The gap between the running thick film circuit patterns was about 50 μm (see FIGS. 9 and 10).
　最後に、二枚の上記透明導電性フィルムを透明電極どうしが対向するように、感圧接着剤層にて全面接着させて静電容量方式のタッチパネルを得た。 Finally, the two transparent conductive films were bonded together with a pressure-sensitive adhesive layer so that the transparent electrodes were opposed to each other to obtain a capacitive touch panel.
　このようにして得られたタッチパネルは、感圧接着剤層が厚膜回路パターンの側壁との間に空気を噛みことがなく、気泡が発生しないものであった。その上、タッチパネル使用時の撓み、高温高湿環境下におけるタッチパネルの反りによっても透明導電性フィルムが剥離しないほどに強い貼合わせ力が有していた。 The touch panel obtained in this way had no pressure between the pressure-sensitive adhesive layer and the side wall of the thick film circuit pattern, and no bubbles were generated. In addition, the bonding force was strong enough to prevent the transparent conductive film from peeling due to bending when using the touch panel and warping of the touch panel in a high temperature and high humidity environment.
　前記銀ペーストの銀粉に換えて、平均粒子径が１μｍの銀ナノコロイド材料を使った他は、実施例１と同様にして厚膜回路パターンを形成した。この場合、実施例１と比べて厚膜回路パターンのラインエッジ部分のギザギザ形状の凸部ピークから隣の凸部ピークまでの距離が平均１００μｍ、凸部のピークと凹部のピークの差が平均５μｍにまで減少した（図１１，図１２参照）。が、それでも貼合わせについて充分な効果は得られた。 A thick film circuit pattern was formed in the same manner as in Example 1 except that a silver nanocolloid material having an average particle diameter of 1 μm was used instead of the silver powder of the silver paste. In this case, compared to Example 1, the distance from the jagged-shaped convex peak at the line edge portion of the thick film circuit pattern to the adjacent convex peak is 100 μm on average, and the difference between the convex peak and the concave peak is 5 μm on average (See FIGS. 11 and 12). However, a sufficient effect was obtained for pasting.
　前記銀ペーストに換えて厚さ１０μｍの銅箔を使った他は、実施例１と同様にして厚膜回路パターンを形成した。この場合、実施例１と比べて厚膜回路パターンのラインエッジ部分のギザギザ形状の凸部ピークから隣の凸部ピークまでの距離が平均４０μｍ、凸部のピークと凹部のピークの差が平均６μｍにまで減少した（図１３，図１４参照）。が、それでも貼合わせについて充分な効果は得られた。 A thick film circuit pattern was formed in the same manner as in Example 1 except that a copper foil having a thickness of 10 μm was used instead of the silver paste. In this case, compared with Example 1, the distance from the jagged convex peak at the line edge portion of the thick film circuit pattern to the adjacent convex peak is 40 μm on average, and the difference between the convex peak and the concave peak is 6 μm on average (See FIGS. 13 and 14). However, a sufficient effect was obtained for pasting.
　なお前記様々な実施形態のうちの任意の実施形態を適宜組み合わせることにより、それぞれの有する効果を奏するようにすることができる。本発明は、添付図面を参照しながら好ましい実施形態に関連して充分に記載されているが、この技術の熟練した人々にとっては種々の変形や修正は明白である。そのような変形や修正は、請求の範囲による本発明の範囲から外れない限りにおいて、その中に含まれると理解されるべきである。 It should be noted that, by appropriately combining arbitrary embodiments among the various embodiments, the effects possessed by them can be produced. Although the present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such changes and modifications are to be understood as included within the scope of the present invention as long as they do not depart from the scope of the present invention.
　本発明は、ＰＤＡ、ハンディターミナルなど携帯情報端末、コピー機、ファクシミリなどＯＡ機器、スマートフォン、 携帯電話機、携帯ゲーム機器、電子辞書、カーナビシステム、小型ＰＣ、各種家電品等の用途に用いることができ、産業上有用なものである。 INDUSTRIAL APPLICABILITY The present invention can be used for applications such as PDAs, handheld terminals and other portable information terminals, copiers, facsimile and other OA equipment, smartphones, mobile phones, portable game machines, electronic dictionaries, car navigation systems, small PCs, various home appliances It is useful industrially.
　１　　透明導電性フィルム
　５　　厚膜回路パターンどうしの間隙
　６０　厚膜回路パターン
　６１　透明電極パターン
　６２　フィルム基材
　６３　透明導電膜からなる回路パターン
　６４　感圧接着剤層
　１００　抵抗膜方式のタッチパネル
　１０１　静電容量方式のタッチパネル  DESCRIPTION OF SYMBOLS 1 Transparent conductive film 5 Gap between thick film circuit patterns 60 Thick film circuit pattern 61 Transparent electrode pattern 62 Film substrate 63 Circuit pattern made of transparent conductive film 64 Pressure sensitive adhesive layer 100 Resistive film type touch panel 101 Capacitance Touch panel

Claims (10)

  1. 　フィルム基材と、
    　前記フィルム基材の片面に形成された透明導電膜からなる透明電極パターンと、
    　前記透明電極パターンが形成された前記フィルム基材上の周縁部に引き回されて前記透明電極パターンの端部と接続される、前記透明導電膜より低抵抗の材料からなる厚膜回路パターンと、を備えた透明導電性フィルムであって、
    　前記厚膜回路パターンが、０．０５～１００μｍの膜厚で、なおかつ少なくとも一方のラインエッジをギザキザ形状に形成されていることを特徴とする貼合わせ適性に優れた透明導電性フィルム。     A film substrate;
    A transparent electrode pattern composed of a transparent conductive film formed on one side of the film substrate;
    A thick film circuit pattern made of a material having a resistance lower than that of the transparent conductive film, which is routed to a peripheral portion on the film substrate on which the transparent electrode pattern is formed and connected to an end of the transparent electrode pattern; A transparent conductive film comprising:
    A transparent conductive film excellent in laminating suitability, wherein the thick film circuit pattern has a film thickness of 0.05 to 100 μm and at least one line edge is formed in a zigzag shape.
  2. 　前記ギザキザ形状の凸部ピークから隣の凸部ピークまでの距離が１０～６００μｍである請求項１記載の貼合わせ適性に優れた透明導電性フィルム。 The transparent conductive film excellent in laminating suitability according to claim 1, wherein the distance from the convex peak of the jagged shape to the adjacent convex peak is 10 to 600 µm.
  3. 　前記ギザキザ形状の凸部のピークと凹部のピークの差が２～５０μｍである請求項２記載の貼合わせ適性に優れた透明導電性フィルム。 3. The transparent conductive film excellent in laminating suitability according to claim 2, wherein the difference between the peak of the convex part and the peak of the concave part is 2 to 50 μm.
  4. 　前記ギザキザ形状が複雑な構造である請求項１記載の貼合わせ適性に優れた透明導電性フィルム。 The transparent conductive film having excellent laminating suitability according to claim 1, wherein the zigzag shape is a complicated structure.
  5. 　前記ギザキザ形状が、より複雑でフラクタル図形状になっている請求項４に記載の貼合わせ適性に優れた透明導電性フィルム。 The transparent conductive film having excellent laminating suitability according to claim 4, wherein the zigzag shape is more complicated and has a fractal shape.
  6. 　前記厚膜回路パターンが導電性ペーストで形成されている請求項１記載の貼合わせ適性に優れた透明導電性フィルム。 2. The transparent conductive film excellent in bonding suitability according to claim 1, wherein the thick film circuit pattern is formed of a conductive paste.
  7. 　前記厚膜回路パターンが２本以上並走する領域を有しており、並走する前記厚膜回路パターンの間隔が１０～６０μｍである請求項１記載の貼合わせ適性に優れた透明導電性フィルム。 2. The transparent conductive film with excellent laminating suitability according to claim 1, wherein the thick film circuit pattern has a region where two or more of the thick film circuit patterns run in parallel, and an interval between the thick film circuit patterns running in parallel is 10 to 60 μm. .
  8. 　さらに、前記フィルム基材と前記厚膜回路パターンとの間に、前記透明電極パターンから延出された透明導電膜からなる回路パターンを備える請求項１貼合わせ適性に優れた透明導電性フィルム。 Furthermore, the transparent conductive film excellent in the laminating suitability provided with the circuit pattern which consists of a transparent conductive film extended from the said transparent electrode pattern between the said film base material and the said thick film circuit pattern.
  9. 　さらに、少なくとも前記厚膜回路パターンの形成領域を覆うように感圧接着剤層を備える請求項１記載の貼合わせ適性に優れた透明導電性フィルム。 Furthermore, the transparent conductive film excellent in the laminating suitability of Claim 1 provided with a pressure sensitive adhesive layer so that the formation area of the said thick film circuit pattern may be covered at least.
  10. 　請求項１～９のいずれかに記載の透明導電性フィルムを用いたことを特徴するタッチパネル。 A touch panel using the transparent conductive film according to any one of claims 1 to 9.
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WO2012173192A1 (en) * 2011-06-17 2012-12-20 日東電工株式会社 Conductive laminate, transparent conductive laminate with patterned wiring, and optical device
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JP2016130913A (en) * 2015-01-13 2016-07-21 大日本印刷株式会社 Method for manufacturing conductive pattern sheet, conductive pattern sheet, touch panel sensor including conductive pattern sheet, and photomask
WO2024020721A1 (en) * 2022-07-25 2024-02-01 京东方科技集团股份有限公司 Optical structure and method for manufacturing optical structure

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