JP2016130913A - Method for manufacturing conductive pattern sheet, conductive pattern sheet, touch panel sensor including conductive pattern sheet, and photomask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To render a conductive thin line constituting a conductive pattern of a conductive pattern sheet to be less likely visually recognized by an observer.SOLUTION: A method for manufacturing a conductive pattern sheet is provided, which includes: a resist pattern forming step of forming a resist pattern 83 on a laminate 80 having a base sheet and a conductive layer 81 disposed on the base sheet, in which the resist pattern 83 is formed on the conductive layer 81 side and includes a base end face 83a located on the base sheet side, a top end face 83b located opposing to the base end face 83a, and a pair of side faces 83c, 83d connecting the base end face 83a and the top end face 83b, and the side faces 83c, 83d of the resist pattern 83 include a non-smooth face 84; and a conductive pattern forming step of forming a conductive pattern 50 comprising a patterned conductive layer 81 by etching the conductive layer 81 by using the resist pattern 83 as a mask to pattern the conductive layer 81.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a method for manufacturing a conductive pattern sheet, and more particularly, to a method for manufacturing a conductive pattern sheet that can effectively prevent the conductive pattern from being visually recognized. The present invention also relates to a conductive pattern sheet, a touch panel sensor including the conductive pattern sheet, and a photomask.

  Conventionally, a conductive pattern having visible light permeability has been widely used in various fields as an electrode substrate for a touch panel, a transparent antenna, an electromagnetic wave shielding material (electromagnetic wave shielding sheet), and the like. While such a conductive pattern is formed by using an opaque metal material itself, it is used for many applications, for example, an electrode substrate for a touch panel and an electromagnetic wave shielding material (electromagnetic wave shielding sheet) disposed on a display device. ) Is required to be sufficiently invisible. In particular, when the pattern of the conductive mesh comes to be partially visible, not only the transmittance is lowered, but also, for example, when overlapping with other members, there are problems such as uneven shading, flickering, and moire. It will cause.

  A touch panel device that is widely used as input means today will be described as an example. The touch panel device includes a touch panel sensor, a control circuit that detects a contact position on the touch panel sensor, and wiring that connects the touch panel sensor and the control circuit. In many cases, the touch panel device is a variety of devices in which an image display mechanism such as a liquid crystal display or a plasma display is incorporated (for example, a ticket machine, ATM, cash register, kiosk terminal, mobile phone, tablet terminal, game machine, etc. ) Is used together with an image display mechanism. In such a device, the touch panel sensor is disposed on the display surface of the image display mechanism, and thus the touch panel device enables a very direct input to the display device. An area of the touch panel sensor that faces the display area of the image display mechanism is transparent, and this area of the touch panel sensor constitutes an active area that can detect a contact position (approach position).

  The touch panel device can be classified into various types based on the principle of detecting a contact position (approach position) on the touch panel sensor. In recent years, a capacitively coupled touch panel device is often used for reasons such as being optically bright, having a design property, being easy in structure, and being functionally superior. In a capacitively coupled touch panel device, an external conductor (for example, a user's finger) whose position is to be detected contacts (approaches) the touch panel sensor via a dielectric, and a parasitic capacitance is newly generated. The position of the external conductor on the touch panel sensor is detected using this change in parasitic capacitance.

  The touch panel sensor usually has a base material and an electrode provided on the base material. The electrode has a detection electrode located in the active area and a take-out electrode located in the inactive area. For example, as disclosed in Patent Document 1, in many touch panel sensors, the detection electrode is disposed at a position facing the display area of the image display mechanism, and thus is formed using a transparent conductive material such as ITO. ing. However, the refractive index of the transparent conductive material is relatively large. Therefore, the transmittance and reflectance of light between the area where the detection electrode is arranged and the area where the detection electrode is not arranged in the touch panel sensor. May vary greatly. In this way, when the difference in light transmittance and reflectance between regions is large, the contour of the detection electrode will be visually recognized by the user of the touch panel sensor, which is not preferable from the viewpoint of design, but also a display device Will significantly degrade the image quality.

  As another touch panel sensor, a touch panel sensor in which detection electrodes are formed using a metal material is also known. In this touch panel sensor, the detection electrode is formed of a narrow conductive thin wire made of a metal material. For this reason, the transmittance in the active area can be sufficiently increased. Moreover, since the electrical conductivity of the metal material is high, the surface resistivity (unit: Ω / □) of the touch panel sensor can be sufficiently reduced even if the width of the conductive thin wire is narrowed. In such a touch panel sensor, a metal foil is first laminated on a transparent substrate via an adhesive, and then this metal foil is patterned by etching using a photolithography technique to form an electrode. It is made by doing.

JP 2008-98169 A

  In the conventional touch panel sensor 130 including the conductive pattern sheet having the conductive pattern made of the conductive thin wire 155, as shown in FIG. 29, the side surface of the conductive thin wire 155 viewed from the normal direction to the sheet surface of the base material 135. 155c and 155d had a shape composed of straight lines. The inventors of the present invention have eagerly studied the touch panel sensor 130 having the conductive thin wire 155, and as a result, the conductive property having the conductive thin wire 155 due to the side shape formed by the straight line of the conductive thin wire 155. It has been found that the pattern can be viewed by an observer. When the light L incident on the touch panel sensor 130, particularly the image light L1 or the external light L2, is incident on the side surfaces 155c and 155d formed by straight lines in the conductive thin wire 155, the incident light L corresponds to the incident direction. Reflected in substantially the same direction on the side surfaces 155c and 155d of the conductive thin wire 155. Then, when the reflected light is visually recognized by the observer, the conductive pattern having the conductive thin wire 155 is visually recognized by the observer. As a result, the shading unevenness caused by the conductive thin lines 155 and the moire caused by the interference with the pixel arrangement of the image display mechanism, the conductive thin lines of other touch panel sensors, and the like are easily recognized.

  The present invention has been made in consideration of such points, and an object of the present invention is to suppress an observer from visually recognizing a thin conductive wire forming a conductive pattern of a conductive pattern sheet.

The method for producing a conductive pattern sheet according to the present invention includes:
Forming a resist pattern from the side of the conductive layer on a laminate having a base sheet and a conductive layer disposed on the base sheet, wherein the resist pattern is A resist pattern having a base end face located on the base sheet side, a front end face disposed opposite to the base end face, and a pair of side faces connecting the base end face and the front end face; Wherein the side surface includes a non-smooth surface, and a resist pattern forming step;
Etching the conductive layer using the resist pattern as a mask and patterning the conductive layer to form a conductive pattern made of the patterned conductive layer;
Is provided.

  In the method for producing a conductive pattern sheet according to the present invention, the resist pattern forming step is a photomask having a mask base material and a light shielding pattern disposed on the mask base material, wherein the light shielding pattern is: A base end face located on the mask base material side, a front end face arranged to face the base end face, and a pair of side faces connecting the base end face and the front end face, and The side surface of the pattern has a non-smooth surface, a step of preparing a photomask, a step of forming a photosensitive layer on the conductive layer of the laminate, and the photo layer on the side opposite to the conductive layer. A step of arranging a mask; a step of exposing the photosensitive layer using the light-shielding pattern of the photomask as a mask; and developing the photosensitive layer to form a resist pattern comprising the developed photosensitive layer. A step of, may have.

  In the method for producing a conductive pattern sheet according to the present invention, the side surface of the light-shielding pattern may include a non-smooth surface that is wavy or polygonal when viewed from the normal direction to the sheet surface of the mask base material. Good.

  In the method for producing a conductive pattern sheet according to the present invention, the resist pattern forming step includes a step of preparing a photomask having a mask base material and a light-shielding pattern disposed on the mask base material, and the laminate. Forming a photosensitive layer containing a photosensitive material and a light diffusing component on the conductive layer, disposing the photomask on the opposite side of the photosensitive layer from the conductive layer, and the photomask You may have the process of exposing the said photosensitive layer by using a light shielding pattern as a mask, and the process of developing the said photosensitive layer and forming the resist pattern which consists of the developed photosensitive layer.

  In the method for producing a conductive pattern sheet according to the present invention, the side surface of the resist pattern may include a non-smooth surface that is wavy or polygonal when viewed from the normal direction to the sheet surface of the base sheet. Good.

  The conductive pattern sheet according to the present invention has a base sheet and a conductive pattern disposed on the base sheet, and the conductive pattern is a base end face located on the base sheet side, A conductive thin wire having a distal end surface disposed opposite to the proximal end surface and a pair of side surfaces connecting the proximal end surface and the distal end surface, and the side surface of the conductive pattern is non- Includes smooth surfaces.

  In the conductive pattern sheet according to the present invention, the side surface of the conductive thin wire may include a non-smooth surface that is wavy or broken when viewed from the normal direction to the sheet surface of the base sheet.

  A touch panel sensor according to the present invention includes the above-described conductive pattern sheet.

  The photomask according to the present invention includes a mask base material and a light shielding pattern disposed on the mask base material, and the light shielding pattern is provided on a base end surface located on the mask base material side and on the base end surface. And a pair of side surfaces connecting the base end surface and the front end surface, and the side surfaces of the light shielding pattern have a non-smooth surface.

  In the photomask according to the present invention, the side surface of the light shielding pattern may include a non-smooth surface having a wavy line shape or a polygonal line shape when viewed from the normal direction to the sheet surface of the mask base material.

  According to this invention, it can suppress that the electroconductive fine wire of an electroconductive pattern sheet is visually recognized by an observer.

FIG. 1 is a diagram for explaining an embodiment according to the present invention, and schematically shows a touch panel device having a conductive pattern sheet together with an image display mechanism. FIG. 2 is a sectional view showing the touch panel device of FIG. 1 together with an image display mechanism. The cross section shown in FIG. 2 generally corresponds to the cross section taken along the line II-II in FIG. FIG. 3 is a top view showing a touch panel sensor of the touch panel device. FIG. 4 is an enlarged view of a part of the electrode substrate for a touch panel in FIG. 1 and is an enlarged view showing an example of the conductive pattern in the conductive pattern sheet. FIG. 5 is a diagram showing in further detail the shape of the conductive thin wire group forming the conductive pattern by further expanding the conductive pattern and the extraction wiring of FIG. FIG. 6 is an enlarged view showing another example of the conductive pattern. FIG. 7 is a diagram showing in further detail the shape of the conductive mesh forming the conductive pattern by further expanding the conductive pattern and the extraction wiring of FIG. FIG. 8 is a diagram showing a cross-sectional shape of a conductive thin wire forming a conductive pattern. FIG. 9 is a diagram showing a planar view shape of the conductive thin wire forming the conductive pattern. FIG. 10 is a cross-sectional view for explaining an example of a manufacturing method of a photomask used for manufacturing a conductive pattern sheet. FIG. 11 is a diagram for explaining an example of a photomask manufacturing method. FIG. 12 is a diagram for explaining an example of a photomask manufacturing method. FIG. 13 is a diagram for explaining an example of a photomask manufacturing method. FIG. 14 is a diagram for explaining an example of a photomask manufacturing method. FIG. 15 is a diagram showing an example of the shape of the light shielding pattern of the photomask. FIG. 16 is a diagram for explaining an example of a method for producing a conductive pattern sheet. FIG. 17 is a diagram for explaining an example of a method for producing a conductive pattern sheet. FIG. 18 is a diagram for explaining an example of a method for producing a conductive pattern sheet. FIG. 19 is a diagram for explaining an example of a method for producing a conductive pattern sheet. FIG. 20 is a diagram for explaining an example of a method for producing a conductive pattern sheet. FIG. 21 is a diagram for explaining an example of a method for producing a conductive pattern sheet. Drawing 22 is a figure for explaining the modification of the manufacturing method of a conductive pattern sheet. FIG. 23 is a diagram for explaining a modification of the method for producing a conductive pattern sheet. FIG. 24 is a plan view for explaining a modification of the method for producing the conductive pattern sheet. FIG. 25 is a diagram for explaining a modification of the method for manufacturing the conductive pattern sheet. FIG. 26 is a diagram for explaining a modification of the method for manufacturing the conductive pattern sheet. FIG. 27 is a diagram for explaining a modification of the method for manufacturing the conductive pattern sheet. FIG. 28 is a diagram for explaining a modification of the method for manufacturing the conductive pattern sheet. FIG. 29 is a diagram showing conductive thin wires of a conventional conductive pattern sheet.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  In this specification, the terms “plate”, “sheet”, and “film” are not distinguished from each other only based on the difference in designation. For example, “conductive pattern sheet” is a concept that includes members that can be called plates and films. Therefore, “conductive pattern sheet” means “conductive pattern plate (substrate)” and “conductive It cannot be distinguished from a member called “pattern film” only by the difference in designation.

  In addition, “sheet surface (plate surface, film surface)” means a target sheet-like member (plate-like) when the target sheet-like (plate-like, film-like) member is viewed as a whole and globally. It refers to the surface that coincides with the plane direction of the member or film-like member.

  Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel”, “orthogonal”, “identical”, length and angle values, etc. Without being bound by meaning, it should be interpreted including the extent to which similar functions can be expected.

  1 to 28 are diagrams for explaining an embodiment according to the present invention. Hereinafter, an example in which the conductive pattern sheet is incorporated in the touch panel sensor will be described. 1 is a diagram schematically showing a touch panel device having a conductive pattern sheet together with a display device, FIG. 2 is a cross-sectional view showing the touch panel device of FIG. 1 together with the display device, and FIG. 3 shows a touch panel sensor of the touch panel device. FIG.

  The touch panel device 20 shown in FIGS. 1 and 2 is configured as a projection-type capacitive coupling method, and is configured to be able to detect a contact position of an external conductor (for example, a human finger) 5 to the touch panel device. Yes. In addition, when the detection sensitivity of the capacitively coupled touch panel device 20 is excellent, it is possible to detect which region of the touch panel device the external conductor is approaching just by approaching the external conductor. Can do. Along with such a phenomenon, the “contact position” used here is a concept including an approach position that is not actually in contact but can be detected.

<<< Image display mechanism >>>
As shown in FIG. 1 and FIG. 2, the touch panel device 20 is used in combination with an image display mechanism (for example, a liquid crystal display device) 12 to constitute a display device 10. The illustrated image display mechanism 12 is configured as a flat panel display as an example, more specifically as a liquid crystal display device. The image display mechanism 12 includes a liquid crystal display panel 15 that forms the display surface 12a, a backlight 14 that illuminates the liquid crystal display panel 15 from the back, and a display control unit 13 that is connected to the liquid crystal display panel 15. Yes. The liquid crystal display panel 15 includes a display area A1 that can display an image, and a non-display area (also referred to as a frame area) A2 that is disposed outside the display area A1 so as to surround the display area A1. Yes. The display control unit 13 processes information related to the video to be displayed and drives the liquid crystal display panel 15 based on the video information. The liquid crystal display panel 15 displays a predetermined image on the display surface 12a according to a control signal from the display control unit 13. That is, the image display mechanism 12 plays a role as an output device that outputs information such as characters and drawings as video.

  As shown in FIG. 2, the liquid crystal display panel 15 includes a pair of polarizing plates 16 and 18 and a liquid crystal cell 17 disposed between the pair of polarizing plates 16 and 18. A functional layer 19 is provided on the light output side of the polarizing plate 18 disposed on the light output side. The functional layer 19 is a layer expected to exhibit a specific function, and forms the most light-emitting surface of the image display mechanism 12, that is, the display surface 12a. As an example, the functional layer 19 can be a low refractive index layer that functions as an antireflection layer (AR layer). Other examples of the functional layer 19 include an antiglare layer (AG layer) having an antiglare function, a hard coat layer (HC layer) having scratch resistance, instead of or in addition to the antireflection layer. ), One or more of an antistatic layer (AS layer) having an antistatic function, and the like.

  The polarizing plates 16 and 18 have a function of decomposing incident light into two orthogonal polarization components, transmitting the polarization component in one direction, and absorbing the polarization component in the other direction orthogonal to the one direction. It has a polarizer. In the following, in order to distinguish a pair of polarizing plates included in the liquid crystal display panel 15, regardless of the arrangement state of the liquid crystal display panel 15, the light incident side (backlight side) polarizing plate 16 is referred to as a lower polarizing plate, The light output side (observer side) polarizing plate 18 is referred to as an upper polarizing plate.

  The liquid crystal cell 17 has a pair of support plates and a liquid crystal disposed between the pair of support plates. In the liquid crystal cell 17, an electric field can be applied to each region where one pixel is formed. The alignment of the liquid crystal in the liquid crystal cell 17 to which an electric field is applied changes. As an example, the polarization component of a specific direction (direction parallel to the transmission axis) transmitted through the lower polarizing plate 16 disposed on the light incident side has a polarization direction of 90 when passing through the liquid crystal cell 17 to which an electric field is applied. Rotate and maintain the polarization direction when passing through the liquid crystal cell 17 to which no electric field is applied. For this reason, depending on whether or not an electric field is applied to the liquid crystal cell 17, the polarized light component in a specific direction transmitted through the lower polarizing plate 16 further passes through the upper polarizing plate 18 disposed on the light output side of the lower polarizing plate 16, or It is possible to control whether the light is absorbed and blocked by the upper polarizing plate 18.

  The backlight 14 includes a light source and irradiates light in a planar shape. As the backlight 14, a known surface light source device configured as an edge light type (side light type) or a direct type can be used. The light source may be a known light source such as a light emitting diode (LED), a cold cathode tube, an incandescent lamp, or an organic EL.

<<< Touch Panel Device >>>
In the example shown in FIGS. 1 and 2, the touch panel device 20 includes a detection control unit 21 and a touch panel laminate 22. The touch panel laminate 22 of the touch panel device 20 includes a touch panel sensor 30 having a first electrode substrate (conductive pattern sheet) 31 and a second electrode substrate (conductive pattern sheet) 32. In the illustrated example, the touch panel laminate 22 includes a cover layer 28, an adhesive layer 25, a first electrode substrate 31, an adhesive layer 24, and a second layer in order from the viewer side, that is, the side opposite to the image display mechanism 12. The electrode substrate 32 and the low refractive index layer 23 are included.

  The cover layer 28 is a light-transmitting layer that functions as a dielectric, and is formed of, for example, glass or a resin film. The cover layer 28 functions as an input surface (touch surface, contact surface) to the touch panel device 20. That is, information can be input to the touch panel device 20 from the outside by bringing the conductor (for example, a human finger) 5 into contact with the cover layer 28. The cover layer 28 forms the most observer side of the display device 10 and functions as a cover for protecting the touch panel device 20 and the image display mechanism 12 from the outside in the display device 10.

  The cover layer 28 is bonded to the first electrode substrate 31 through the adhesive layer 25. The first electrode substrate 31 is bonded to the second electrode substrate 32 via the adhesive layer 24. The adhesive layer 24 and the adhesive layer 25 function as a dielectric between the electrodes 41 and 42 of the electrode substrates 31 and 32 and the conductor (for example, a human finger) 5 in contact with the cover layer 28. As the adhesive layer 24 and the adhesive layer 25, layers made of materials having various adhesive properties can be used. In the present specification, “adhesion (layer)” is used as a concept including adhesion (layer).

  The low refractive index layer 23 provided on the image display mechanism 12 side of the second electrode substrate 32 is a layer expected to function as an antireflection layer (AR layer). According to the low refractive index layer 23, it is possible to prevent light that forms an image from the image display mechanism 12 from being reflected on the surface of the touch panel device 20 on the image display mechanism 12 side and becoming stray light. Can do. Note that the low refractive index layer 23 can be replaced with an antireflection layer having a moth-eye structure including a large number of minute protrusions, or can be omitted. Furthermore, the touch panel laminate 22 of the touch panel device 20 can be bonded to the display surface 12a of the image display mechanism 12 via an adhesive layer or the like. In this case, the low refractive index layer 23 is not necessary.

  The touch panel laminate 22 of the touch panel device 20 is not limited to the illustrated example, and may be provided with other functional layers expected to exhibit a specific function. In addition, one functional layer may exhibit two or more functions. For example, each layer (each base material included in the base sheet 35 or 36 described later of the touch panel sensor 30 or other touch panel laminate 22. Alternatively, a function may be imparted to the adhesive layer. Examples of functions that can be imparted to the touch panel laminate 22 of the touch panel device 20 include an antiglare (AG) function, a hard coat (HC) function having scratch resistance, an antistatic (AS) function, an electromagnetic wave shielding function, An antifouling function or the like can be exemplified.

  The detection control unit 21 of the touch panel device 20 is connected to the touch panel sensor 30 and processes information input via the cover layer 28. Specifically, the detection control unit 21 is configured to be able to specify the contact position of the conductor 5 with the cover layer 28 when the conductor (for example, a human finger) 5 is in contact with the cover layer 28. Circuit (detection circuit). Further, the detection control unit 21 is connected to the display control unit 13 of the image display mechanism 12 and can also transmit the processed input information to the display control unit 13. At this time, the display control unit 13 can create video information based on the input information and cause the image display mechanism 12 to display a video corresponding to the input information.

  Note that the terms “capacitive coupling” and “projection type” capacitive coupling have the same meaning as that used in the technical field of touch panels, and are used in this case. The “capacitive coupling” method is also referred to as “capacitance” method or “capacitance coupling” method in the technical field of touch panels. It is treated as a term synonymous with the “capacitive coupling” method. A typical capacitively coupled touch panel device includes an electrode (conductor layer). When an external conductor (for example, a human finger) comes into contact with the touch panel, the external conductor and the electrode of the touch panel device ( A capacitor (capacitance) is formed with the conductor layer. Based on the change in the electrical state accompanying the formation of the capacitor, the position coordinates of the position where the external conductor is in contact on the touch panel are specified (position detection).

<< Touch panel sensor >>
Next, the touch panel sensor 30 will be described. As shown in FIG. 2, the touch panel sensor 30 includes a first electrode 41 and a second electrode that are spaced apart in the thickness direction of the touch panel sensor 30, that is, the direction along the normal direction to the panel surface of the touch panel sensor 30. An electrode 42 is provided. In particular, in the example shown in FIG. 2, the touch panel sensor 30 includes a first electrode substrate (conductive pattern sheet) 31 in which a first electrode 41 is formed on a first base sheet 35, and a second base sheet 36. A second electrode substrate (conductive pattern sheet) 32 having a second electrode 42 formed thereon is provided. Further, the present invention is not limited to this, and the first electrode 41 and the second electrode 42 may be formed on both surfaces of one base sheet to form one electrode substrate (conductive pattern sheet).

<Base material sheet>
The base material sheets 35 and 36 support the electrodes 41 and 42 and function as a dielectric in the touch panel sensor 30. As shown in FIGS. 1 and 3, the base material sheets 35 and 36 include an active area Aa1 corresponding to an area where the touch position can be detected, and an inactive area Aa2 adjacent to the active area Aa1. As shown in FIG. 1, the active area Aa1 of the touch panel sensor 30 occupies an area facing the display area A1 of the image display mechanism 12. On the other hand, the non-active area Aa2 is formed in a frame shape so as to surround the rectangular active area Aa1 from the four sides. The inactive area Aa2 is formed in a region facing the non-display region A2 of the image display mechanism 12.

  The base material sheets 35 and 36 are transparent or translucent so that an image of the image display mechanism 12 can be observed through the active area Aa1. The base material sheets 35 and 36 preferably have a transmittance in the visible light region of 80% or more, and more preferably 84% or more. In addition, the transmittance | permeability of the base material sheets 35 and 36 can be measured by JISK7361-1 (the test method of the total light transmittance of a plastic-transparent material).

  The base sheet 35, 36 is, for example, a polyester resin such as polyethylene terephthalate or polyethylene naphthalate, an acrylic resin such as polymethyl methacrylate, a polyolefin resin such as polypropylene, a cellulose resin such as triacetyl cellulose (cellulose triacetate), or a polycarbonate. A material that can function as a dielectric, such as a resin sheet made of resin, an inorganic material made of glass, ceramics, or the like, can be used.

<Electrode>
As shown in FIG. 3, the first electrode 41 includes a plurality of first detection electrodes 43 that are used for position detection and are arranged in the active area Aa1. Each first detection electrode 43 is connected to a first extraction wiring 45 disposed in the inactive area Aa2. The second electrode 42 includes a plurality of second detection electrodes 44 that are used for position detection and are disposed in the active area Aa1. Each second detection electrode 44 is connected to a second extraction wiring 46 disposed in the inactive area Aa2. The extraction wirings 45 and 46 extend from the detection electrodes 43 and 45 to the terminal portion 49 in the inactive area Aa2. In the example shown in FIGS. 1 to 4 and 6, the terminal unit 49 is connected to the detection control unit 21 via an external connection wiring (for example, a flexible printed board) (not shown). Each of the detection electrodes 43 and 44 includes a conductive pattern 50, and the conductive pattern 50 is formed by a conductive thin wire group 51 or a conductive mesh 52 composed of conductive thin wires 55 as described below as an example. However, in FIG. 3, the area | region where each detection electrode 43 and 44 is arrange | positioned is shown.

  One or two extraction wirings 45 and 46 are provided for each of the detection electrodes 43 and 44 according to the contact position detection method. Each extraction wiring 45, 46 is connected to a corresponding detection electrode 43, 44 to form a wiring.

  The detection electrodes 43 and 44 are provided to detect an electromagnetic change or a change in capacitance that occurs when the external conductor 5 approaches the touch panel laminate 22. The detection electrodes 43 and 44 are composed of a conductive thin wire group 51 or a conductive mesh 52 made of a conductive thin wire 55 made of a metal material with a predetermined line width and thickness. As the metal material, one or more of gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, and alloys thereof can be used.

(Conductive pattern)
4 and 5 show a conductive pattern 50 having a conductive thin wire group 51 composed of conductive thin wires 55 as an example of the conductive pattern 50 in the present embodiment. FIG. 4 is an enlarged view of a part of the electrode substrates (conductive pattern sheets) 31 and 32 shown in FIG. FIG. 5 is an enlarged view of the conductive pattern 50 of FIG.

  In the example shown in FIG. 4, the extraction wirings 45 and 46 arranged in the inactive area Aa2 include wiring parts 45a and 46a, and connection parts 45b and 46b arranged at the ends of the wiring parts 45a and 46a, Is included. The detection electrodes 43 and 44 include a conductive thin wire group 51 that forms a conductive pattern 50.

  As shown in FIG. 5, the conductive thin wire group 51 of the first detection electrode 43 extends in the first direction (X) and is in a second direction that is not parallel to the first direction (X). It has a plurality of thin conductive wires 55 arranged in (Y). The plurality of conductive thin wires 55 extend from the active area Aa1 to the inactive area Aa2 along the first direction (X), and are connected to the common connection portion 45b. The connecting portion 45b extends in a direction non-parallel to the first direction (X) that is the longitudinal direction of the conductive thin wire 55. In particular, the connecting portion 45b extends in the second direction (Y), which is the direction in which the conductive thin wires 55 are arranged. The plurality of conductive thin wire groups 51 are arranged apart from each other in a second direction (Y) that is non-parallel to the first direction (X). In the illustrated example, the first direction (X) is orthogonal to the second direction (Y).

  On the other hand, the conductive thin wire group 51 of the second detection electrode 44 extends in a third direction intersecting the first direction (X), as shown in FIG. The plurality of conductive thin wire groups 51 are arranged away from each other in a fourth direction that intersects both the second direction (Y) and the third direction. In the illustrated example, as shown in FIG. 4, the third direction which is the longitudinal direction of the conductive thin wire group 51 is parallel to the second direction (Y). The fourth direction, which is the direction in which the conductive thin wire groups 51 are arranged, is parallel to the first direction (X). That is, the longitudinal direction of the conductive thin wire group 51 of the first detection electrode 43 and the longitudinal direction of the conductive thin wire group 51 of the second detection electrode 44 are orthogonal to each other. The arrangement direction of the conductive thin wire group 51 of the first detection electrode 43 and the arrangement direction of the conductive thin wire group 51 of the second detection electrode 44 are orthogonal to each other. However, without being limited to this example, as the touch panel sensor 30, the longitudinal direction of the conductive thin wire group 51 of the first detection electrode 43 and the longitudinal direction of the conductive thin wire group 51 of the second detection electrode 44 are orthogonal to each other. It is not necessary to be crossed. Similarly, the arrangement direction of the conductive thin wire group 51 of the first detection electrode 43 and the arrangement direction of the arrangement direction of the conductive thin wire group 51 of the second detection electrode 44 do not need to be orthogonal to each other. Good.

  In the example shown in FIG. 4 and FIG. 5, each conductive thin wire 55 of the first detection electrode 43 extends linearly along the first direction (X). Or wavy pattern with amplitude in a direction non-parallel to the first direction (X), in particular with amplitude in the second direction (Y), in the first direction (X) It may extend along. In the example shown in FIG. 4, each conductive thin wire 55 of the second detection electrode 44 extends linearly along the second direction (Y). However, the present invention is not limited to this. The pattern has an amplitude in a direction non-parallel to the second direction (Y), and in particular has an amplitude in the first direction (X) and extends along the second direction (Y). It may be.

  The conductive thin wires 55 of the conductive thin wire group 51 as described above are formed by, for example, gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium by vapor deposition, sputtering, foil transfer, coating, or the like. By forming a metal film containing one or more of palladium, indium, and one of these alloys on the base sheet 35, 36 and etching the metal film in a desired pattern, Can be formed.

  6 and 7 show a conductive pattern 50 having a conductive mesh 52 made of conductive thin wires 55 as another example of the conductive pattern 50 in the present embodiment. FIG. 6 is an enlarged view of a part of the electrode substrates (conductive pattern sheets) 31 and 32 shown in FIG. FIG. 7 is an enlarged view of the conductive pattern 50 on the surface of FIG.

  In the example shown in FIG. 6, the first electrode 41 and the second electrode 42 include a conductive mesh 52 that forms a conductive pattern 50. The conductive mesh 52 is a mesh-like material in which a large number of open areas 56 are defined by a large number of thin conductive wires 55. In particular, in the illustrated example, the conductive mesh 52 has a grid-like mesh formed by a large number of conductive thin wires 55, thereby defining a large number of rectangular opening regions 56.

  As shown in FIG. 7, the conductive mesh 52 includes a number of conductive connection elements 58 that extend between two branch points (confluence points) 57 and define an open region 56. In particular, in the illustrated example, the conductive mesh 52 is configured as a collection of a number of connecting elements 58 that form branch points 57 at both ends. That is, the conductive mesh 52 is configured as a collection of a large number of connection elements 58 extending between the two branch points 57. An opening region 56 is defined by connecting the connecting element 58 at the branch point 57. In other words, one opening region 56 is defined by being surrounded and partitioned by the connecting element 58.

  The conductive thin wires 55 of the conductive mesh 52 as described above are formed by, for example, the same method as the conductive thin wires 55 of the conductive thin wire group 51 described above, that is, a metal film is formed on the base sheet 35, 36, The metal film can be formed by a method of etching with a desired pattern.

  Next, with reference to FIG. 8 and FIG. 9, the shape of the conductive fine wire group 51 or the conductive fine wire 55 of the conductive mesh 52 forming the conductive pattern 50 in the present embodiment will be described in detail. FIG. 8 shows the electrode substrates 31 and 32 in a cross section along the thickness direction of the electrode substrates (conductive pattern sheets) 31 and 32. Here, the thickness direction means a cross section along the normal direction to the sheet surface (film surface, plate surface, panel surface) of the electrode substrates 31 and 32 having a sheet shape (film shape, plate shape, panel shape). Point to. And in this Embodiment, the base material sheets 35 and 36 have a sheet-like shape which has a pair of main surface. Therefore, in this Embodiment, the cross section along the thickness direction corresponds with the cross section along the normal line direction to the surface of the base sheet 35,36.

  The electrode substrates 31 and 32 have base material sheets 35 and 36 and electrodes 41 and 42 formed on the base material sheets 35 and 36. Each of the electrodes 41 and 42 has a conductive pattern 50 including a conductive thin wire 55 forming a conductive thin wire group 51 or a conductive mesh 52. The conductive thin wire 55 connects the base end surface 55a forming the surface on the base sheet 35, 36 side, the tip end surface 55b disposed to face the base end surface 55a, and the base end surface 55a and the tip end surface 55b. A pair of side surfaces 55c and 55d. In the example shown in FIG. 8, the base end surface 55a and the front end surface 55b are parallel to each other.

  In the conductive pattern 50 having such a configuration, the cross section perpendicular to the width W of the conductive thin wires 55 forming the conductive thin wire group 51 or the conductive mesh 52, that is, the extending direction (longitudinal direction) of the conductive thin wires 55. It is preferable that a width (maximum width) W along the sheet surface of the electrode substrates 31 and 32 in (hereinafter also simply referred to as “main cut surface”) be 1 μm or more and 20 μm or less. In addition, the height (thickness) H of the conductive thin wire 55, that is, the height (thickness) H along the thickness direction of the electrode substrates 31 and 32 is preferably set to 0.05 μm or more and 15 μm or less. According to the conductive thin wire group 51 or the conductive mesh 52 having such a size, the conductive thin wire 55 is sufficiently thinned, so that the conductive pattern 50 forming the electrodes 41 and 42 can be very effectively invisible. can do. At the same time, the height between the base end surface 55a and the front end surface 55b is sufficiently high, that is, the aspect ratio (H / W) of the cross-sectional shape of the conductive thin wire 55 is sufficiently large, and has high conductivity. Become.

  FIG. 9 shows the electrode substrates 31 and 32 when viewed from the normal direction to the sheet surfaces of the electrode substrates (conductive pattern sheets) 31 and 32. As described above, the conductive thin wire group 51 forming the conductive pattern 50 or the conductive thin wire 55 of the conductive mesh 52 has a pair of side surfaces 55c and 55d that connect the base end surface 55a and the front end surface 55b. ing. The side surfaces 55 c and 55 d include a non-smooth surface 60. Here, the “non-smooth surface” used for the side surfaces 55c and 55d of the conductive thin wire 55 is a surface having irregularities to the extent that light incident on the surface can be irregularly reflected on the surface, in other words, the surface. The surface which has the unevenness | corrugation of the grade which can reflect in the direction which the light which incline in the predetermined angle reflected in a different direction by the incident point. In the example shown in FIG. 9, the side surfaces 55 c and 55 d of the conductive thin wires 55 are non-smooth surfaces 60 having uneven surfaces 61 that are wavy when viewed from the normal direction to the sheet surfaces of the electrode substrates 31 and 32. Is included.

  In the example shown in FIG. 9, the uneven surface 61 forming the non-smooth surface 60 of the side surfaces 55 c and 55 d of the conductive thin wire 55 is a plurality of convex portions protruding in a direction non-parallel to the extending direction of the conductive thin wire 55. 62 and a concave portion 63 formed between two adjacent convex portions 62. In particular, in the example shown in FIG. 9, the uneven surface 61 forming the non-smooth surface 60 of the side surfaces 55 c and 55 d of the conductive thin wire 55 is orthogonal to the extending direction of the conductive thin wire 55 and the sheet of the electrode substrates 31 and 32. It has the some convex part 62 which protrudes in the direction parallel to a surface, and the recessed part 63 formed between the two convex parts 62 adjacent to the extension direction of the electroconductive thin wire | line 55. As shown in FIG.

  According to the conductive pattern sheet having the conductive thin wire 55 including the non-smooth surface 60, the light L incident on the side surfaces 55c and 55d of the conductive thin wire 55 is as shown in FIG. Reflected irregularly at the side surfaces 55c and 55d. Thereby, the light L incident on the side surfaces 55c and 55d of the conductive thin wire 55 is prevented from being reflected in the same direction by the side surfaces 55c and 55d corresponding to the incident direction. Therefore, it is possible to effectively suppress the reflected light from being visually recognized by the observer and the conductive pattern 50 having the conductive thin wires 55 being visually recognized by the observer.

  In particular, when the conductive pattern sheet having the conductive thin wire 55 including the non-smooth surface 60 is used for the touch panel sensor, the video light L1 or the external light L2 incident on the side surfaces 55c and 55d of the conductive thin wire 55 is the side surface 55c. , 55d. Thereby, the image light L1 or the external light L2 incident on the side surfaces 55c and 55d of the conductive thin wire 55 is suppressed from being reflected in the same direction by the side surfaces 55c and 55d corresponding to the incident direction. Therefore, it is possible to effectively suppress the reflected light from being visually recognized by the observer as a bright part or a bright spot. As a result, it is possible to effectively suppress the shading unevenness caused by the conductive thin lines 55 and the moire caused by the interference with the pixel arrangement of the image display mechanism, the conductive thin lines of other touch panel sensors, and the like. it can.

  In the example shown in FIG. 9, the arrangement interval (arrangement pitch) P of the convex portions 62, that is, the extension of the conductive thin wires 55 of the two convex portions 62 adjacent to each other in the extending direction of the conductive thin wires 55 as the arrangement direction. The interval P along the current direction is preferably 1 μm or more and 50 μm or less. For example, as shown in FIG. 9, the distance P along the extending direction of the conductive thin wire 55 between the two convex portions 62 adjacent to each other in the extending direction of the conductive thin wire 55 is the tip end portion 62 a of the two convex portions 62. It can be specified as the distance along the extending direction of the conductive thin wire 55 between. Further, the amplitude A of the convex portion 62, that is, the protruding length A in the direction perpendicular to the extending direction of the conductive thin wire 55 of the convex portion 62 and parallel to the sheet surface of the electrode substrates 31, 32 is 1 μm or more and 25 μm. The following is preferable. For example, as shown in FIG. 9, the protrusion length of the protrusion 62 in the direction perpendicular to the extending direction of the conductive thin wire 55 and parallel to the sheet surface of the electrode substrates 31 and 32 is the tip of the protrusion 62. Sheets of the electrode substrates 31 and 32 that are orthogonal to the extending direction of the conductive thin wire 55 between the projecting portion 62 and the deepest portion 63a of the recessed portion 63 adjacent to the extending direction of the conductive thin wire 55 It can be specified as a distance along a direction parallel to the surface.

  Next, an example of a method for manufacturing the electrode substrates (conductive pattern sheets) 31 and 32 of the touch panel sensor 30 described above will be described with reference to FIGS.

  First, a method for manufacturing the photomask 70 used for manufacturing the electrode substrates 31 and 32 will be described with reference to FIGS.

  First, the light shielding layer 72 is formed on the mask base material 71. As the mask substrate 71, for example, a glass plate such as quartz glass and soda lime glass can be used. The light shielding layer 72 can be provided by forming a metal thin film of chromium, molybdenum or the like on the mask substrate 71 by a sputtering method, a vacuum deposition method, a CVD method or the like. The light shielding layer 72 may be a single layer such as a chromium single layer film, or a chromium oxide layer provided on the chromium layer or a chromium oxide layer provided on both sides of the chromium layer. Thus, it may be formed of a plurality of layers.

  Next, as shown in FIG. 10, a resist layer 78 is formed on the light shielding layer 72. As the resist layer 78, a known negative type or positive type photoresist layer can be used.

  Next, the resist layer 78 is exposed. When a negative photoresist layer is used as the resist layer 78, for example, as shown in FIG. 11, laser drawing or electron beam for irradiating a laser on the resist layer 78 corresponding to the portion where the light shielding layer 74 should be left. The resist layer 78 is exposed by EB drawing that irradiates the film. At this time, drawing with a laser or an electron beam is performed along the uneven shape of the non-smooth surface 74 described later.

  After the exposure of the resist layer 78, the resist layer 78 is developed to form a resist pattern 79, as shown in FIG.

  Next, as shown in FIG. 13, the exposed light shielding layer 72 is removed by etching using the resist pattern 79 as a mask.

  Thereafter, the resist pattern 79 is removed, and a photomask 70 having a light shielding pattern 73 shown in FIG. 14 is manufactured.

  The shape of the light shielding pattern 73 of the photomask 70 in the present embodiment will be described with reference to FIGS. FIG. 14 shows the photomask 70 in a cross section along the thickness direction of the photomask 70. And in this Embodiment, the mask base material 71 has a sheet-like shape which has a pair of main surface. Therefore, in the present embodiment, the cross section along the thickness direction coincides with the cross section along the normal direction to the surface of the mask base 71.

  The photomask 70 has a mask base 71 and a light shielding pattern 73 formed on the mask base 71. As shown in FIG. 14, the light shielding pattern 73 includes a base end surface 73a that forms a surface on the mask base material 71 side, a front end surface 73b that is disposed to face the base end surface 73a, and a base end surface 73a and a front end surface. And a pair of side surfaces 73c and 73d that connect the same to 73b. In the example shown in FIG. 14, the base end face 73a and the front end face 73b are parallel to each other.

  FIG. 15 shows the photomask 70 as viewed from the direction normal to the sheet surface of the photomask 70. As shown in FIG. 15, the side surfaces 73 c and 73 d of the light shielding pattern 73 of the photomask 70 include a non-smooth surface 74. In the illustrated example, the side surfaces 73 c and 73 d of the light shielding pattern 73 include a non-smooth surface 74 having a concavo-convex surface 75 that is wavy when viewed from the normal direction to the sheet surface of the photomask 70.

  In the example shown in FIG. 15, the uneven surface 75 that forms the non-smooth surface 74 of the side surfaces 73 c and 73 d of the light shielding pattern 73 includes a plurality of convex portions 76 that project from the light shielding pattern 73 and two adjacent convex portions 76. And a recess 77 formed on the surface. In particular, in the example shown in FIG. 15, the uneven surface 75 that forms the non-smooth surface 74 of the side surfaces 73 c and 73 d of the light shielding pattern 73 is the uneven surface 61 that forms the non-smooth surface 60 of the side surfaces 55 c and 55 d of the conductive thin wire 55. It is formed so as to have a substantially complementary shape. That is, the convex portion 76 of the concave / convex surface 75 in the light shielding pattern 73 is formed to have a substantially complementary shape corresponding to the concave portion 63 of the concave / convex surface 61 in the conductive thin wire 55, and the concave portion 77 of the concave / convex surface 75 in the light shielding pattern 73. Are formed so as to have a substantially complementary shape corresponding to the convex portion 62 of the concave-convex surface 61 in the conductive thin wire 55.

  When a positive photoresist layer is used as the resist layer 82 in the step of forming the resist layer 82 in the manufacturing method of the electrode substrates 31 and 32 of the touch panel sensor described later, the side surfaces 73c and 73d of the light shielding pattern 73 are not formed. The concavo-convex surface 75 forming the smooth surface 74 is formed to have substantially the same shape as the concavo-convex surface 61 forming the non-smooth surface 60 of the side surfaces 55c and 55d of the conductive thin wire 55. That is, the convex portion 76 of the concave / convex surface 75 in the light shielding pattern 73 is formed to have substantially the same shape corresponding to the convex portion 62 of the concave / convex surface 61 in the conductive thin wire 55, and the concave portion of the concave / convex surface 75 in the light shielding pattern 73. 77 is formed to have substantially the same shape corresponding to the concave portion 63 of the concave-convex surface 61 in the conductive thin wire 55.

  Next, an example of a manufacturing method of the electrode substrates (conductive pattern sheets) 31 and 32 of the touch panel sensor using the photomask 70 will be described with reference to FIGS.

  First, the base material sheets 35 and 36 are prepared. The base sheet 35, 36 is, for example, a polyester resin such as polyethylene terephthalate or polyethylene naphthalate, an acrylic resin such as polymethyl methacrylate, a polyolefin resin such as polypropylene, a cellulose resin such as triacetyl cellulose (cellulose triacetate), or a polycarbonate. A resin sheet made of resin or the like, an inorganic material made of glass, ceramics, or the like can be used.

  Next, a conductive metal layer (conductive layer) 81 is formed on the base material sheets 35 and 36, and a laminate 80 is produced. As described above, the conductive metal layer 81 is a layer made of one or more of gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, and alloys thereof. The conductive metal layer 61 can be formed by a known method. For example, a method of sticking a metal foil such as copper foil, a plating method including electrolytic plating and electroless plating, a sputtering method, a CVD method, a PVD method, an ion plating method, or a method in which two or more of these are combined is adopted. can do.

  Next, a resist layer (photosensitive layer) 82 is provided on the conductive metal layer 81 of the laminate 80. FIG. 16 shows a structure in which the base sheet 35, 36, the conductive metal layer 81, and the resist layer 82 are laminated. As the resist layer 82, a known negative type or positive type photo resist layer, that is, a resin layer having photosensitivity to light in a specific wavelength range, for example, ultraviolet rays can be used.

  Next, as shown in FIG. 17, the photomask 70 having the light shielding pattern 73 shown in FIG. 15 is arranged on the side of the resist layer (photosensitive layer) 82 opposite to the conductive metal layer (conductive layer) 81. Exposure. In the example shown in FIG. 17, the photomask 70 is arranged so that the light shielding pattern 73 of the photomask 70 faces the resist layer 82. Then, light in a specific wavelength region, for example, ultraviolet rays is irradiated from the side of the photomask 70 opposite to the resist layer 82. Thereby, in the example shown in FIG. 17, the part corresponding to the light shielding pattern 73 of the resist layer 82 is shielded from light, and the other part is exposed.

  Next, the resist layer (photosensitive layer) 82 is developed to form a resist pattern 83 composed of the developed resist layer 82. For example, when a negative photoresist layer is used as the resist layer 82, as shown in FIG. 18, the resist layer 82 in a portion other than the portion exposed in the above-described exposure step is removed. Further, when a positive photoresist layer is used as the resist layer 82, the resist layer 82 at the portion exposed in the above-described exposure process is removed.

  Here, as shown in FIG. 18, the resist pattern 83 includes a base end face 83a that forms a surface on the conductive metal layer (conductive layer) 81 side, and a front end face 83b that is disposed to face the base end face 83a. And a pair of side surfaces 83c and 83d that connect between the base end surface 83a and the front end surface 83b. In the example shown in FIG. 18, the base end face 83a and the front end face 83b are parallel to each other.

  FIG. 19 shows the laminate 80 and the resist pattern 83 when viewed from the normal direction to the sheet surface of the laminate 80. As shown in FIG. 19, the side surfaces 83 c and 83 d of the resist pattern 83 include a non-smooth surface 84. In the illustrated example, the side surfaces 83 c and 83 d of the resist pattern 83 include a non-smooth surface 84 having an uneven surface 85 that is wavy when viewed from the normal direction to the sheet surface of the stacked body 80.

  In the example shown in FIG. 19, the concavo-convex surface 85 forming the non-smooth surface 84 of the side surfaces 83 c and 83 d of the resist pattern 83 includes a plurality of convex portions 86 protruding in a direction non-parallel to the extending direction of the resist pattern 83. , And a concave portion 87 formed between two adjacent convex portions 86. In particular, in the example shown in FIG. 19, the uneven surface 85 forming the non-smooth surface 84 of the side surfaces 83 c and 83 d of the resist pattern 83 is orthogonal to the extending direction of the resist pattern 83 and parallel to the sheet surface of the laminate 80. A plurality of convex portions 86 projecting in the direction, and a concave portion 87 formed between two convex portions 86 adjacent to each other in the extending direction of the resist pattern 83.

  In the example shown in FIG. 19, the uneven surface 85 that forms the non-smooth surface 84 of the side surfaces 83c and 83d of the resist pattern 83 is the uneven surface that forms the non-smooth surface 74 of the side surfaces 73c and 73d of the light shielding pattern 73 of the photomask 70. 75 so as to have a substantially complementary shape. That is, the convex portion 86 of the concave / convex surface 85 in the resist pattern 83 is formed to have a substantially complementary shape corresponding to the concave portion 77 of the concave / convex surface 75 in the light shielding pattern 73 of the photomask 70, and the concave / convex surface 85 in the resist pattern 83. The concave portion 87 is formed to have a substantially complementary shape corresponding to the convex portion 76 of the concave and convex surface 75 in the light shielding pattern 73 of the photomask 70.

  When a positive type photoresist layer is used as the resist layer 82, the uneven surface 85 that forms the non-smooth surface 84 of the side surfaces 83c and 83d of the resist pattern 83 corresponds to the side surfaces 73c and 83c of the light shielding pattern 73 of the photomask 70. It is formed to have substantially the same shape as the uneven surface 75 that forms the 73d non-smooth surface 74. That is, the convex portion 86 of the concave / convex surface 85 in the resist pattern 83 is formed to have substantially the same shape as the convex portion 76 of the concave / convex surface 75 in the light shielding pattern 73 of the photomask 70, and the concave / convex surface in the resist pattern 83. The 85 concave portions 87 are formed to have substantially the same shape corresponding to the concave portions 77 of the uneven surface 75 in the light shielding pattern 73 of the photomask 70.

  Next, as shown in FIG. 20, the conductive metal layer (conductive layer) 81 is etched using the resist pattern 83 as a mask. By this etching, the conductive metal layer 81 is patterned into a pattern substantially the same as the resist pattern 83. The etching method is not particularly limited, and a known method can be employed. Known methods include, for example, wet etching using an etchant, plasma etching, and the like. Thereafter, the resist pattern 83 is removed to obtain electrode substrates (conductive pattern sheets) 31 and 32 shown in FIG.

  According to an example of the method for manufacturing the electrode substrates (conductive pattern sheets) 31 and 32 of the touch panel sensor 30, the base material sheets 35 and 36 and the conductive pattern 50 disposed on the base material sheets 35 and 36. The conductive pattern 50 includes a base end surface 55a located on the base sheet 35, 36 side, a front end surface 55b disposed to face the base end surface 55a, a base end surface 55a, and a front end surface 55b. A conductive pattern sheet 31, 32 having a conductive thin wire 55 having a pair of side surfaces 55 c, 55 d that connect between each other, and the side surfaces 55 c, 55 d of the conductive thin wire 55 including the non-smooth surface 60 is manufactured. be able to. According to such conductive pattern sheets 31 and 32, as shown in FIG. 9, the light L incident on the side surfaces 55c and 55d of the conductive thin wire 55 is irregularly reflected by the side surfaces 55c and 55d. . Thereby, the light L incident on the side surfaces 55c and 55d of the conductive thin wire 55 is prevented from being reflected in the same direction by the side surfaces 55c and 55d corresponding to the incident direction. Therefore, it is possible to effectively suppress the reflected light from being visually recognized by the observer and the conductive pattern 50 having the conductive thin wires 55 being visually recognized by the observer.

  In particular, when the conductive pattern sheet having the conductive thin wire 55 including the non-smooth surface 60 is used for the touch panel sensor, the video light L1 or the external light L2 incident on the side surfaces 55c and 55d of the conductive thin wire 55 is the side surface 55c. , 55d. Thereby, the image light L1 or the external light L2 incident on the side surfaces 55c and 55d of the conductive thin wire 55 is suppressed from being reflected in the same direction by the side surfaces 55c and 55d corresponding to the incident direction. Therefore, it is possible to effectively suppress the reflected light from being visually recognized by the observer as a bright part or a bright spot. As a result, it is possible to effectively suppress the shading unevenness caused by the conductive thin lines 55 and the moire caused by the interference with the pixel arrangement of the image display mechanism and the conductive thin lines of other touch panel sensors. it can.

  Next, with reference to FIGS. 22-28, the modification of the manufacturing method of the electroconductive pattern sheet of this Embodiment is demonstrated. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted.

  The base material sheets 35 and 36 are prepared, the conductive metal layer (conductive layer) 81 is formed on the base material sheets 35 and 36, and the laminated body 80 is produced. Next, a resist layer (photosensitive layer) 92 is provided on the conductive metal layer 81 of the stacked body 80. The resist layer 92 is configured to include a photosensitive material 92a and a light diffusion component 92b. FIG. 22 shows a structure in which the base sheet 35, 36, the conductive metal layer 81 and the resist layer 92 are laminated.

  As the photosensitive material 92a of the resist layer (photosensitive layer) 92, a known negative-type or positive-type photoresist material, that is, a resin material having photosensitivity to light in a specific wavelength range, for example, ultraviolet rays can be used.

  The light diffusing component 92b of the resist layer (photosensitive layer) 92 is a component that can exhibit a function of changing the light path direction by reflection or refraction. Examples of the light diffusing component 92b include particles such as resin beads, a metal compound, a porous material containing a gas, resin beads holding a metal compound around them, and simple bubbles. As the particles, light-transmitting particles or light-reflecting particles can be used. When using light-transmitting particles, it is preferable to use particles having a refractive index different from that of the photosensitive material 92a. The particles constituting the light diffusing component 92b can be contained in the resist layer 92 at a weight percent of 10% to 40%. The average particle diameter (average diameter) of the light diffusing component 92b is an arithmetic average particle diameter measured by the method prescribed in the annex of JIS Z 8901: 2006 (test powder and test particles), and is 1 μm or more and 20 μm. It can be as follows.

  Next, as shown in FIG. 23, a photomask 70 having a light shielding pattern 73 shown in FIG. 24 is arranged on the opposite side of the resist layer (photosensitive layer) 92 from the conductive metal layer (conductive layer) 81. Exposure. Note that the photomask 70 having the light shielding pattern 73 shown in FIG. 15 may be used as the photomask.

As shown in FIG. 23, light in a specific wavelength region, for example, ultraviolet light that has passed through the photomask 70 without being blocked by the light shielding pattern 73 of the photomask 70 is incident on the resist layer (photosensitive layer) 92. The light incident on the resist layer 92 sensitizes the photosensitive material 92 a of the resist layer 92. At this time, as shown in FIG. 25, a part of the light incident on the resist layer 92 is diffused by the light diffusion component 92b. Specifically, the light diffusing component 92b is reflected by the light-reflecting surface of the particle, and the light diffusing component 92b and the photosensitive material 92a are generated by the difference in refractive index between the particle forming the light diffusing component 92b and the photosensitive material 92a. The light such as ultraviolet rays incident on the resist layer 92 is diffused by reflection of light at the interface, light diffusion due to bending of the optical path due to refraction at the interface between the light diffusion component 92b and the photosensitive material 92a. Then, the diffused light such as ultraviolet light sensitizes the photosensitive material 92a around the light diffusion component 92b. Thus, as shown by the broken line in FIG. 25, the boundary line L _A of the photosensitive portion 921 and the non-photosensitive portion 922 will have an uneven.

Next, the resist layer (photosensitive layer) 92 is developed to form a resist pattern 93 composed of the developed resist layer 92. When a negative photoresist material, for example, is used as the photosensitive material 92a of the resist layer 92, as shown in FIG. 26, the resist layer 92 at a location other than the location exposed in the above-described exposure process. Is removed. In addition, when a positive photoresist material is used as the photosensitive material 92a of the resist layer 92, the resist layer 92 at the location exposed in the above-described exposure process is removed. At this time, part of the light diffusing component 92b that existed on the boundary line L _A of the photosensitive portion 921 and the non-photosensitive portion 922 remaining on the resist pattern 93, the other part from falling off from the resist pattern 93.

  As shown in FIG. 26, the resist pattern 93 includes a base end surface 93a that forms a surface on the conductive metal layer (conductive layer) 81 side, a front end surface 93b that is disposed to face the base end surface 93a, and a base pattern 93a. It has a pair of side surfaces 93c and 93d that connect the end surface 93a and the front end surface 93b. And in the example shown by FIG. 26, the base end surface 93a and the front end surface 93b are mutually parallel.

The side surfaces 93 c and 93 d of the resist pattern 93 include a non-smooth surface 94. In particular, in the example shown in FIGS. 25 and 26, the side surfaces 93c and 93d of the resist pattern 93 are seen from the normal direction to the sheet surface of the laminate 80, and the photosensitive portion 921 and the non-photosensitive portion 922 in the resist layer 92. comprising a non-smooth surface 94 having an uneven surface corresponding to the unevenness of the boundary line L _a of the.

  Next, as shown in FIG. 27, the conductive metal layer (conductive layer) 91 is etched using the resist pattern 93 as a mask. By this etching, the conductive metal layer 91 is patterned into a pattern corresponding to the resist pattern 93. Thereafter, the resist pattern 93 is removed to obtain electrode substrates (conductive pattern sheets) 31 and 32 shown in FIG.

  According to the modification of the method of manufacturing the electrode substrates (conductive pattern sheets) 31 and 32 of the touch panel sensor 30, the photomask 70 having the light shielding pattern 73 shown in FIG. 24, that is, the side surface of the light shielding pattern is non-smooth. The non-smooth surface 60 can be easily formed on the side surfaces 55c and 55d of the conductive thin wire 55 without using a photomask having a surface.

  Note that various modifications can be made to the above-described embodiment.

  In the above-described embodiment, the side surfaces 55c and 55d of the conductive thin wire 55 have the wavy uneven surface 61 when viewed from the normal direction to the sheet surface of the base sheet 35 or 36. Not limited to this, the side surfaces 55c and 55d of the conductive thin wire 55 may have a concavo-convex surface 61 that is a polygonal line when viewed from the normal direction to the sheet surface of the base sheet 35 or 36. In the above-described embodiment, the side surfaces 73 c and 73 d of the light shielding pattern 73 of the photomask 70 have the wavy uneven surface 75 when viewed from the normal direction to the sheet surface of the mask base 71. However, the present invention is not limited thereto, and the side surfaces 73 c and 73 d of the light shielding pattern 73 of the photomask 70 may have a concavo-convex uneven surface 75 that is a polygonal line when viewed from the normal direction to the sheet surface of the mask base 71. Furthermore, in the above-described embodiment, the side surfaces 83c and 83d of the resist pattern 83 have the wavy uneven surface 85 when viewed from the normal direction to the sheet surface of the base sheet 35 or 36. Not limited to this, the side surfaces 83c and 83d of the resist pattern 83 may have a concavo-convex surface 85 having a broken line shape when viewed from the normal direction to the sheet surfaces of the base material sheets 35 and 36.

  In the above-described embodiment, an example of the pattern of the conductive thin wire group 51 and the conductive mesh 52 that is extremely effective in making the uneven density and moire invisible has been described. However, the conductive thin wire group 51 and the conductive mesh 52 are described. This pattern is not limited to the example described above. Instead of the above-described configuration, a known method for making the unevenness of shading and moire invisible can be applied to the conductive thin wire group 51 and the conductive mesh 52 as appropriate. Further, for example, depending on the width and arrangement interval of the conductive thin wires 55 forming the conductive thin wire group 51 and the conductive mesh 52, it may be difficult to visually recognize shading unevenness and moire. Therefore, the pattern of the conductive thin wire group 51 and the conductive mesh 52 is not limited to the above-described example. For example, in the conductive thin wire group 51, each conductive thin wire 55 may be arranged in a polygonal or wavy pattern. In the conductive mesh 52, the conductive thin wires 55 may be arranged in a square lattice arrangement or a honeycomb arrangement. The mesh pattern of the conductive mesh 52 is not limited to a regular mesh pattern, and may be an irregular mesh pattern such as a Voronoi mesh.

  In the above-described embodiment, a dark color layer may be formed on at least one of the base end surface 55a, the front end surface 55b, and the side surfaces 55c and 55d of the conductive thin wire 55 forming the conductive pattern 50. The conductive pattern 50 made of a metal material has excellent conductivity, but exhibits a relatively high reflectance. And when external light is reflected by the conductive pattern 50 of the touch panel sensor 30, the image contrast of the image display mechanism 12 observed through the display area A3 of the touch panel device 20 is lowered. Therefore, the dark color layer may be formed on at least one of the base end surface 55a, the front end surface 55b, and the side surfaces 55c and 55d of the conductive thin wire 55 forming the conductive pattern 50. With this dark color layer, the contrast of the image can be improved, and the visibility of the image displayed by the image display mechanism 12 can be improved. The dark color layer is a dark color layer such as black and has a lower reflectance than the adjacent metal layer.

  Various known layers can be used as the dark color layer. A part of the material forming the conductive thin line 55 may be darkened (blackened) to form a dark color layer made of a metal oxide or metal sulfide from the part of the conductive thin line 55. . Moreover, you may make it provide a dark color layer on the electroconductive thin wire | line 55 like the coating film of a dark color material, plating layers, such as nickel and chromium. The dark color layer used here includes not only a darkened (blackened) layer but also a roughened layer.

  In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining a some modification suitably.

30 Touch Panel Sensor 31 First Electrode Substrate (Conductive Pattern Sheet)
32 Second electrode substrate (conductive pattern sheet)
35 First substrate sheet 36 Second substrate sheet 50 Conductive pattern 51 Conductive thin wire group 52 Conductive mesh 55 Conductive thin wire 55a Base end surface 55b Front end surface 55c Side surface 55d Side surface 60 Non-smooth surface 61 Uneven surface 62 Convex portion 62a Front end portion 63 Concave portion 70 Photomask 71 Mask base material 72 Light shielding layer 73 Light shielding pattern 73a Base end surface 73b Front end surface 73c Side surface 73d Side surface 74 Non-smooth surface 75 Uneven surface 76 Convex portion 77 Recess 80 Laminate 81 Conductive metal layer (conductive layer) )
82 Resist layer (photosensitive layer)
83 resist pattern 83a base end face 83b tip end face 83c side face 83d side face 84 non-smooth face 85 uneven face 86 convex part 87 concave part 92 resist layer (photosensitive layer)
92a Photosensitive material 92b Light diffusing component 93 Resist pattern 93a Base end surface 93b Front end surface 93c Side surface 93d Side surface 94 Non-smooth surface

Claims (10)

Forming a resist pattern from the side of the conductive layer on a laminate having a base sheet and a conductive layer disposed on the base sheet, wherein the resist pattern is A resist pattern having a base end face located on the base sheet side, a front end face disposed opposite to the base end face, and a pair of side faces connecting the base end face and the front end face; Wherein the side surface includes a non-smooth surface, and a resist pattern forming step;
Etching the conductive layer using the resist pattern as a mask and patterning the conductive layer to form a conductive pattern made of the patterned conductive layer;
A method for producing a conductive pattern sheet. The resist pattern forming step includes
A photomask having a mask base material and a light shielding pattern disposed on the mask base material, wherein the light shielding pattern is opposed to the base end surface located on the mask base material side and the base end surface. Providing a photomask having a disposed distal end surface and a pair of side surfaces connecting between the proximal end surface and the distal end surface, and wherein the side surface of the light shielding pattern has a non-smooth surface;
Forming a photosensitive layer on the conductive layer of the laminate;
Disposing the photomask on the opposite side of the photosensitive layer from the conductive layer;
Exposing the photosensitive layer using the light shielding pattern of the photomask as a mask;
Developing the photosensitive layer to form a resist pattern comprising the developed photosensitive layer;
The manufacturing method of the electroconductive pattern sheet of Claim 1 which has these.   The said side surface of the said light shielding pattern contains the non-smooth surface which makes a wavy shape or a polygonal line shape seeing from the normal line direction to the sheet | seat surface of the said mask base material, The manufacture of the electroconductive pattern sheet of Claim 2 Method. The resist pattern forming step includes
Preparing a photomask having a mask substrate and a light shielding pattern disposed on the mask substrate;
Forming a photosensitive layer containing a photosensitive material and a light diffusion component on the conductive layer of the laminate;
Disposing the photomask on the opposite side of the photosensitive layer from the conductive layer;
Exposing the photosensitive layer using the light shielding pattern of the photomask as a mask;
Developing the photosensitive layer to form a resist pattern comprising the developed photosensitive layer;
The manufacturing method of the electroconductive pattern sheet of Claim 1 which has these.   The said side surface of the said resist pattern sees from the normal line direction to the sheet | seat surface of the said base material sheet, and includes the non-smooth surface which makes wavy shape or a polygonal line shape, The electroconductivity in any one of Claims 1-4 Method for producing a pattern sheet. A base sheet, and a conductive pattern disposed on the base sheet,
The conductive pattern includes a base end face located on the base sheet side, a front end face disposed to face the base end face, a pair of side faces connecting the base end face and the front end face, A conductive thin wire having
The conductive pattern sheet, wherein the side surface of the conductive thin wire includes a non-smooth surface.   7. The conductive pattern sheet according to claim 6, wherein the side surface of the conductive thin wire includes a non-smooth surface having a wavy line shape or a polygonal line shape when viewed from a normal line direction to the sheet surface of the base material sheet.   A touch panel sensor comprising the conductive pattern sheet according to claim 6. A mask base material, and a light shielding pattern disposed on the mask base material,
The light-shielding pattern includes a base end surface located on the mask base material side, a front end surface disposed to face the base end surface, and a pair of side surfaces connecting the base end surface and the front end surface. A photomask having a non-smooth surface on the side surface of the light shielding pattern.   9. The photomask according to claim 8, wherein the side surface of the light shielding pattern includes a non-smooth surface having a wavy line shape or a polygonal line shape when viewed from the normal direction to the sheet surface of the mask base material.

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